Lithography pillar process for embedded bridge scaling
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a package substrate, and a first pad over the package substrate. In an embodiment, a layer is over the package substrate, where the layer is an insulating material. In an embodiment, the electronic package further comprises a via through the layer and in contact with the first pad. In an embodiment a first end of the via has a first width and a second end of the via that is in contact with the first pad has a second width that is larger than the first width. In an embodiment, the electronic package further comprises a second pad over the via.
1 . An electronic package, comprising:
a package substrate;
a first pad over the package substrate;
a layer over the package substrate, wherein the layer is an insulating material;
a via through the layer and in contact with the first pad, wherein a first end of the via has a first width and a second end of the via that is in contact with the first pad has a second width that is larger than the first width;
a second pad over the via, wherein there is no seam at the interface between the via and the second pad;
a third pad over the package substrate;
a second via through the layer and contacting the third pad; and
a fourth pad over the second via, wherein the fourth pad is substantially similar to the second pad, and wherein a distance between the fourth pad and the second pad is approximately 10 μm or smaller.
2 . The electronic package of claim 1 , wherein a sidewall of the via is tapered.
3 . The electronic package of claim 1 , wherein a width of the second pad is approximately 10 μm or smaller.
4 . The electronic package of claim 1 , wherein the first pad is electrically coupled to a bridge embedded in the package substrate.
5 . The electronic package of claim 1 , wherein a sidewall of the via is smooth.
6 . The electronic package of claim 1 , further comprising:
a solder over the second pad.
7 . The electronic package of claim 1 , wherein the second via has a width that is greater than a width of the via.
8 . An electronic package, comprising:
a package substrate;
a first pad over the package substrate;
a layer over the package substrate, wherein the layer is an insulating material;
a via through the layer and in contact with the first pad, wherein a first end of the via has a first width and a second end of the via that is in contact with the first pad has a second width that is larger than the first width;
a second pad over the via;
a third pad over the package substrate;
a second via through the layer and contacting the third pad; and
a fourth pad over the second via, wherein the fourth pad is substantially similar to the second pad, and wherein a distance between the fourth pad and the second pad is approximately 10 μm or smaller.
9 . The electronic package of claim 8 , wherein a sidewall of the via is tapered.
10 . The electronic package of claim 8 , wherein a width of the second pad is approximately 10 μm or smaller.
11 . The electronic package of claim 8 , wherein the first pad is electrically coupled to a bridge embedded in the package substrate.
12 . The electronic package of claim 8 , wherein a sidewall of the via is smooth.
13 . The electronic package of claim 8 , further comprising:
a solder over the second pad.
14 . The electronic package of claim 8 , wherein the second via has a width that is greater than a width of the via.