LED chip packaging module, fabrication method thereof, and display

1 . An LED chip packaging module, comprising:

a re-distribution layer, RDL comprising a metal layer disposed on a chip, so that an electrode and/or an input/output pad (I/O pad) of the chip can be re-disposed at another position of the chip, to connect to another integrated circuit or chip, and/or connect to an electrode and/or I/O pad of a different chip;

a first pad disposed on a lower surface of the RDL;

a plurality of micro light emitting diode (LED) chips disposed on an upper surface of the RDL, wherein an electrode of each of the micro LED chips faces the RDL and is connected to the RDL, the micro LED chips forming a plurality of pixels, and each of the pixels comprises at least one micro LED chip;

a micro integrated circuit (IC) disposed on the upper surface and/or the lower surface of the RDL, wherein an electrode of the micro IC faces the RDL and is connected to the RDL; and

a transparent packaging layer disposed on the upper surface of the RDL, the transparent packaging layer covering a surface of each of the micro LED chips and/or the micro IC, the transparent packaging layer comprising, on a side away from the RDL, a packaging plane parallel to the upper surface of the RDL and a micro-nano structure is disposed on the packaging plane;

wherein the first pad is electrically connected to the micro IC by using the RDL, the micro IC is electrically connected to the micro LED chip by using the RDL, the first pad is configured to receive an external drive signal, and the micro IC is configured to control, based on the external drive signal, a working state of the micro LED chip electrically connected to the micro IC,

wherein

the plurality of pixels correspond to one micro IC, the micro IC is disposed between the plurality of pixels corresponding to the micro IC, and the micro IC is electrically connected, by using the RDL, to the micro LED chips in the plurality of pixels corresponding to the micro IC.

2 . The LED chip packaging module according to claim 1 , wherein

each of the pixels corresponds to one micro IC, the micro IC is disposed adjacent to the pixel corresponding to the micro IC, and the micro IC is electrically connected, by using the RDL, to the micro LED chip in the pixel corresponding to the micro IC.

3 . The LED chip packaging module according to claim 1 , wherein

when the micro IC is located on the upper surface of the RDL, the electrode of the micro IC and the electrodes of the micro LED chips are located in a same plane.

4 . The LED chip packaging module according to claim 1 , further comprising:

a light isolation structure disposed on the upper surface of the RDL, wherein the light isolation structure is distributed between adjacent pixels, and/or the light isolation structure is distributed between adjacent micro LED chips.

5 . The LED chip packaging module according to claim 1 , further comprising:

a color conversion material, wherein surfaces of some or all of the micro LED chips are coated with the color conversion material, to convert chromatic light emitted by the micro LED chips into another color.

6 . The LED chip packaging module according to claim 1 , wherein

the pixel comprises N primary micro LED chips and N secondary micro LED chips that are in a one-to-one correspondence with the N primary micro LED chips, the secondary micro LED chip is configured to take over the job of the corresponding primary micro LED chip when the corresponding primary micro LED chip fails, and N is a positive integer.

7 . The LED chip packaging module according to claim 1 , wherein

the pixel comprises N primary micro LED chips and a secondary micro LED chip, the secondary micro LED chip is configured to take over, when any one of the primary micro LED chips fails, the job of the failed primary micro LED chip, and N is a positive integer.

8 . The LED chip packaging module according to claim 1 , wherein

the pixel comprises N primary micro LED chips, a secondary micro LED chip is further comprised between adjacent two pixels, the secondary micro LED chip is configured to take over, when any one of the primary micro LED chips in adjacent two pixels fails, the job of the failed primary micro LED chip, and N is a positive integer.

9 . The LED chip packaging module according to claim 1 , wherein when a light ray emitted by the micro LED chips to an external environment does not pass through the RDL, an insulation flat layer of the RDL is a non-transparent material.

10 . The LED chip packaging module according to claim 1 , wherein when a light ray emitted by the micro LED chips to an external environment passes through the RDL, an insulation flat layer of the RDL is a transparent material.

11 . An LED chip packaging module, comprising:

a re-distribution layer RDL comprising a metal layer disposed on a chip, so that an electrode and/or an input/output pad (I/O pad) of the chip can be re-disposed at another position of the chip, to connect to another integrated circuit or chip, and/or connect to an electrode and/or I/O pad of a different chip, wherein a plurality of first pads are disposed on a lower surface of the RDL; and

a plurality of micro light emitting diode chips disposed on an upper surface of the RDL, wherein an electrode of the micro LED chip faces the RDL and is connected to the RDL, the micro LED chips forming a plurality of pixels, and each of the pixels comprises at least one micro LED chip; and

the first pad is electrically connected to the micro LED chip by using the RDL, the first pad is configured to receive an external drive signal, and the external drive signal is used to control a working state of the micro LED chip;

a transparent packaging layer disposed on the upper surface of the RDL, the transparent packaging layer covering a surface of each of the micro LED chips, the transparent packaging layer comprising, on a side away from the RDL, a packaging plane parallel to the upper surface of the RDL and a micro-nano structure is disposed on the packaging plane; and

a light isolation structure disposed on the upper surface of the RDL, wherein the light isolation structure is distributed between adjacent pixels, and/or the light isolation structure is distributed between adjacent micro LED chips.

12 . The chip packaging module according to claim 11 , wherein

each of the first pads is electrically connected to the micro LED chip of at least one of the pixels by using the RDL.

13 . A display, comprising:

a drive backplane,

a display driver integrated circuit (DDIC) configured to generate an external drive signal, and at least one LED chip packaging module,

the at least one chip packaging module comprising: a re-distribution layer, RDL comprising a metal layer disposed on a chip, so that an electrode and/or an input/output pad (I/O pad) of the chip can be re-disposed at another position of the chip, to connect to another integrated circuit or chip, and/or connect to an electrode and/or I/O pad of a different chip,

a first pad disposed on a lower surface of the RDL;

a plurality of micro light emitting diode (LED) chips disposed on an upper surface of the RDL, an electrode of each of the micro LED chips faces the RDL and is connected to the RDL; and

a micro integrated circuit (IC) disposed on the upper surface and/or the lower surface of the RDL, wherein an electrode of the micro IC faces the RDL and is connected to the RDL, and the first pad is electrically connected to the micro IC by using the RDL, the micro IC is electrically connected to the micro LED chip by using the RDL, the first pad is configured to receive the external drive signal, and the micro IC is configured to control, based on the external drive signal, a working state of the micro LED chip electrically connected to the micro IC;

the DDIC and the at least one LED chip packaging module are disposed on the drive backplane;

the drive backplane comprises a second pad at a position corresponding to that of the first pad of the at least one LED chip packaging module, and the second pad is connected to the DDIC by using a line; and

the first pad is configured for the LED chip packaging module to receive the external drive signal, and the first pad is soldered to the second pad using a bump.