Semiconductor device with spacer and method for fabricating the same
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes an interposer having a first surface and a second surface parallel to the first surface; a conductive via extending between the first surface and the second surface of the interposer; an insulation layer separating the conductive via from the interposer; a first electronic component positioned on the second surface and electrically connected to the conductive via; a first conductive element positioned on the first surface of the interposer and electrically connected to the conductive via; a spacer conformally positioned on the first surface of the interposer and on sidewalls of the first conductive element; and a passivation layer positioned on the spacer. The passivation layer has a first dielectric constant, and the spacer has a second dielectric constant less than the first dielectric constant.
1 . A semiconductor device, comprising:
an interposer having a first surface and a second surface parallel to the first surface;
a conductive via extending between the first surface and the second surface of the interposer;
an insulation layer separating the conductive via from the interposer;
a first electronic component positioned on the second surface and electrically connected to the conductive via;
a first conductive element positioned on the first surface of the interposer and electrically connected to the conductive via;
a spacer conformally positioned on the first surface of the interposer and on sidewalls of the first conductive element; and
a passivation layer positioned on the spacer;
wherein the passivation layer has a first dielectric constant, and the spacer has a second dielectric constant less than the first dielectric constant.
2 . The semiconductor device of claim 1 , further comprising a second electronic component embedded within the interposer.
3 . The semiconductor device of claim 2 , wherein the second electronic component is embedded in a package structure.
4 . The semiconductor device of claim 2 , further comprising a conductive pillar extending between the first surface of the interposer and the second electronic component.
5 . The semiconductor device of claim 2 , further comprising an encapsulant encapsulating the second electronic component, wherein the encapsulant fully penetrates the interposer.
6 . The semiconductor device of claim 2 , further comprising a third electronic component positioned on the second electronic component and electrically connected to the second electronic component.
7 . The semiconductor device of claim 6 , further comprising a second conductive element electrically connecting the second electronic component and the third electronic component, wherein the second conductive element penetrates the second electronic component.
8 . The semiconductor device of claim 6 , wherein the insulation layer comprises silicon oxide.
9 . The semiconductor device of claim 6 , further comprising:
a fourth electronic component positioned on the second surface of the interposer;
a mother board supporting the interposer; and
a conductive wire electrically connecting the fourth electronic component and the mother board.
10 . The semiconductor device of claim 1 , further comprising a protection layer positioned on the second surface of the interposer, wherein the protection layer is further positioned between the conductive via and the interposer, wherein the protection layer has a third surface substantially coplanar with the first surface of the interposer.
11 . The semiconductor device of claim 1 , wherein the spacer comprises low-k oxide-based dielectrics.
12 . The semiconductor device of claim 1 , wherein the passivation layer comprises silicon oxide.