Radiation detector, radiation detection unit, and radiation imaging system
A radiation detector includes a semiconductor layer including a light receiving portion configured to receive radiation, and a cooling device disposed at a distance from the semiconductor layer in a direction perpendicular to a main surface of the semiconductor layer. A first member and a second member are provided along a plane that is positioned between the semiconductor layer and the cooling device and that is parallel to the main surface of the semiconductor layer, the second member having physical properties different from physical properties of the first member. In the direction perpendicular to the main surface of the semiconductor layer, the first member and a third member are coupled via a first buffer member, and the second member and the third member are coupled via an adhesive layer.
1 . A radiation detector comprising:
a semiconductor layer including a light receiving portion configured to receive radiation; and
a cooling device disposed at a distance from the semiconductor layer in a direction perpendicular to a main surface of the semiconductor layer,
wherein a first member and a second member are provided along a plane that is positioned between the semiconductor layer and the cooling device and that is parallel to the main surface of the semiconductor layer, the second member having physical properties different from physical properties of the first member, and
in the direction perpendicular to the main surface of the semiconductor layer, the first member and a third member are coupled via a first buffer member, and the second member and the third member are coupled via an adhesive layer.
2 . The radiation detector according to claim 1 , wherein an elastic modulus of the first member is higher than an elastic modulus of the second member, and the first buffer member is more easily deformed by an external force than the adhesive layer.
3 . The radiation detector according to claim 1 , wherein the first buffer member includes any one of a pseudoplastic fluid, a plastic fluid, a double-sided tape, or a die attach film.
4 . The radiation detector according to claim 1 , wherein the first buffer member is grease.
5 . The radiation detector according to claim 1 , wherein the second member is provided at a position farther away from the light receiving portion than the first member in a direction along the plane.
6 . The radiation detector according to claim 1 , wherein a space is provided on a back surface side of the light receiving portion.
7 . The radiation detector according to claim 1 , wherein the first member is a heat conducting member, the second member is a circuit board, and the third member is the semiconductor layer.
8 . The radiation detector according to claim 7 , wherein the first member and the cooling device are coupled via a second buffer member.
9 . The radiation detector according to claim 8 , wherein the second buffer member includes any one of a pseudoplastic fluid, a plastic fluid, a double-sided tape, or a die attach film.
10 . The radiation detector according to claim 8 , wherein the second buffer member is grease.
11 . The radiation detector according to claim 1 , wherein the first member is a first heat conducting member, the second member is a circuit board, and the third member is a second heat conducting member.
12 . The radiation detector according to claim 11 , wherein the third member and the cooling device are coupled via a second buffer member.
13 . The radiation detector according to claim 12 , wherein the second buffer member includes any one of a pseudoplastic fluid, a plastic fluid, a double-sided tape, or a die attach film.
14 . The radiation detector according to claim 12 , wherein the second buffer member is grease.
15 . The radiation detector according to claim 11 ,
wherein a support member is provided between the semiconductor layer and the first heat conducting member, and
a thermal expansion coefficient of the support member is equal to or higher than a thermal expansion coefficient of the semiconductor layer, and is lower than a thermal expansion coefficient of the first heat conducting member.
16 . A radiation imaging system comprising:
the radiation detector according to claim 1 ; and
a signal processor configured to process a signal output from the radiation detector.
17 . A radiation imaging system comprising:
the radiation detector according to claim 1 ; and
a radiation source.
18 . A radiation detection unit comprising:
a semiconductor layer including a light receiving portion configured to receive radiation; and
a first heat conducting member disposed at a distance from the semiconductor layer in a direction perpendicular to a main surface of the semiconductor layer,
wherein a first member and a second member are provided along a plane parallel to the main surface of the semiconductor layer, the second member having physical properties different from physical properties of the first member, and
in the direction perpendicular to the main surface of the semiconductor layer, the first member and a third member are coupled via a first buffer member, and the second member and the third member are coupled via an adhesive layer.
19 . The radiation detection unit according to claim 18 , wherein an elastic modulus of the first member is higher than an elastic modulus of the second member, and the first buffer member is more easily deformed by an external force than the adhesive layer.
20 . The radiation detection unit according to claim 18 , wherein the first buffer member includes any one of a pseudoplastic fluid, a plastic fluid, a double-sided tape, or a die attach film.
21 . The radiation detection unit according to claim 18 , wherein the first buffer member is grease.
22 . The radiation detection unit according to claim 18 , wherein the second member is provided at a position farther away from the light receiving portion than the first member in a direction along the plane.
23 . The radiation detection unit according to claim 18 , wherein a space is provided on a back surface side of the light receiving portion.
24 . The radiation detection unit according to claim 18 , wherein the first member is the first heat conducting member, the second member is a circuit board, and the third member is the semiconductor layer.
25 . The radiation detection unit according to claim 18 , wherein the first member is the first heat conducting member, the second member is a circuit board, and the third member is a second heat conducting member.
26 . The radiation detection unit according to claim 18 ,
wherein a support member is provided between the semiconductor layer and the first heat conducting member, and
a thermal expansion coefficient of the support member is equal to or higher than a thermal expansion coefficient of the semiconductor layer, and is lower than a thermal expansion coefficient of the first heat conducting member.