Temperature sensors in medical implants

1 . An implantable medical device comprising:

a housing comprising an exterior surface and an interior surface;

a hybrid board within the housing;

at least one support disposed within the housing;

a temperature sensor comprising a sensor surface thermally coupled to the interior surface of the housing, wherein the temperature sensor is disposed within the housing and configured to sense a temperature of a portion of the housing;

a flexible circuit; and

at least one physically compliant material disposed between the at least one support and the temperature sensor, wherein the physically compliant material is configured to provide a physical bias against the temperature sensor and towards the interior surface of the housing, and wherein the temperature sensor is electrically coupled to the hybrid board via the flexible circuit independent of the physically compliant material.

2 . The implantable medical device of claim 1 , wherein the at least one physically compliant material is configured to provide the physical bias to the temperature sensor to maintain contact between the interior surface of the housing and the sensor surface of the temperature sensor.

3 . The implantable medical device of claim 1 , wherein the at least one support contacts at least two interior surfaces of the housing.

4 . The implantable medical device of claim 1 , wherein the sensor surface is an operable sensing surface and the sensing surface is disposed directly in contact with the interior surface of the housing.

5 . The implantable medical device of claim 1 , wherein the at least one support is in contact with the interior surface of the housing.

6 . The implantable medical device of claim 1 , wherein the at least one support is a rigid support.

7 . The implantable medical device of claim 1 , wherein the physically compliant material is an elastic pad.

8 . The implantable medical device of claim 1 , further comprising a thermally conductive material disposed between the sensor surface and the interior surface of the housing.

9 . The implantable medical device of claim 8 , wherein the housing comprises a curved inner portion, and wherein the thermally conductive material is configured to conform to the curved inner portion to couple the sensor surface and the interior surface of the housing.

10 . The implantable medical device of claim 1 , wherein the temperature sensor is a first temperature sensor, and wherein the implantable medical device comprises one or more additional temperature sensors disposed at multiple locations within the housing and thermally coupled to respective portions of the interior surface of the housing.

11 . The implantable medical device of claim 1 , wherein the housing is a titanium shield configured to protect the temperature sensor.

12 . The implantable medical device of claim 1 , wherein the hybrid board comprises processing circuitry configured to receive a temperature signal from the temperature sensor and control at least one function of the implantable medical device based on the temperature signal.

13 . A method comprising:

attaching at least one physically compliant material with at least one support;

attaching a temperature sensor to the at least one physically compliant material;

disposing a hybrid board within a housing;

disposing the temperature sensor within the housing, the housing comprising an exterior surface and an interior surface, the housing having at least one support coupled to the housing, where the at least one physically compliant material is configured to physically bias the temperature sensor towards the interior surface of the housing with the physically compliant material;

thermally coupling the temperature sensor to the housing, the temperature sensor configured to sense a temperature of a portion of the housing, the temperature sensor including a sensor surface; and

electrically coupling the temperature sensor to the hybrid board, the temperature sensor being electrically coupled to the hybrid board via a flexible circuit independent of the physically compliant material.

14 . The method of claim 13 , further comprising disposing a sensing surface of the temperature sensor directly adjacent to the interior surface of the housing wherein the sensing surface is in direct contact with the interior surface of the housing.

15 . The method of claim 13 , further comprising disposing thermally conductive material disposed between the temperature sensor and the interior surface of the housing.

16 . The method of claim 15 , further comprising thermally connecting the thermally conductive material with the sensor surface and the interior surface of the housing.

17 . The method of claim 13 , further comprising disposing multiple temperature sensors at multiple locations within the housing, and wherein each of the multiple temperature sensors are physically biased towards the interior surface of the housing with the physically compliant material.

18 . An implantable medical device comprising:

a housing comprising an exterior surface and an interior surface;

at least one support disposed within the housing;

a temperature sensor comprising a sensor surface thermally coupled to the interior surface of the housing, wherein the temperature sensor is disposed within the housing and configured to sense a temperature of a portion of the housing;

at least one physically compliant material disposed between the at least one support and the temperature sensor, wherein the physically compliant material is configured to provide a physical bias against the temperature sensor and towards the interior surface of the housing;

a hybrid board disposed within the housing;

a flexible circuit electrically coupling the temperature sensor to the hybrid board; and

processing circuitry configured to receive a temperature signal from the temperature sensor and control at least one function of the implantable medical device based on the temperature signal.