In-situ mycoremediation system and process
An in-situ mycoremediation system and process is provided, including a device with a rod casing having a top end, a bottom end, and a sidewall with one or more perforations, the sidewall defining an internal channel that extends from an intake opening on the top end to the one or more perforations, a sleeve that extends around at least part of the rod casing and that is slidable between at least a first position that covers the one or more perforations and a second position that at least partly uncovers the one or more perforations, and a plumbing line linked to the intake opening and configured to facilitate forcible injection of one more fungal mixtures and/or air via the one or more perforations when the sleeve is in the second position.
1 . A process for in-situ remediation, the process comprising:
pushing an injection head into a subsurface, the pushing causing a sleeve of the injection head to slidably cover one or more orifices in a sidewall of the injection head;
pulling the sleeve of the injection head to slidably expose the one or more orifices; and
injecting a remediation material into the subsurface via the one or more orifices of the injection head to support a hyphal network of mycelium.
2 . The process of claim 1 , wherein the pushing an injection head into a subsurface comprises:
pushing an injection pipe into a subsurface.
3 . The process of claim 1 , wherein the pushing an injection head into a subsurface comprises:
pushing an injection head into a subsurface such that the one or more orifices are fully below a surface.
4 . The process of claim 1 , wherein the pushing an injection head into a subsurface comprises:
pushing an injection head into one or more of the following: sediment, soil, dirt, sand, or silt.
5 . The process of claim 1 , wherein the pushing an injection head into a subsurface comprises:
pushing an injection head into a subsurface while vibrating.
6 . The process of claim 1 , wherein the pulling the sleeve of the injection head comprises:
pulling the sleeve of the injection head to partially expose the one or more orifices.
7 . The process of claim 1 , wherein the pulling the sleeve of the injection head comprises:
pulling the sleeve of the injection head to slidably expose at least one of the following types of orifices: hole, mesh, filter, or screen.
8 . The process of claim 1 , wherein the pulling the sleeve of the injection head comprises:
pulling the sleeve of the injection head to slidably expose at least one of the following types of orifices: tear drop, square, rectangle, triangle, oval, or slot.
9 . The process of claim 1 , wherein the pulling the sleeve of the injection head comprises:
pulling the sleeve of the injection head to slidably expose the one or more orifices in a recessed segment of a sidewall of the injection head.
10 . The process of claim 1 , wherein the injecting a remediation material into the subsurface via the one or more orifices of the injection head to support a hyphal network of mycelium comprises:
injecting a remediation material into the subsurface above an overburden pressure of the subsurface.
11 . The process of claim 1 , wherein the injecting a remediation material into the subsurface via the one or more orifices of the injection head to support a hyphal network of mycelium comprises:
injecting a remediation material into the subsurface at a pressure that fractures at least a portion of the subsurface.
12 . The process of claim 1 , wherein the injecting a remediation material into the subsurface via the one or more orifices of the injection head to support a hyphal network of mycelium comprises:
injecting a remediation slurry including fungi and a food source into the subsurface.
13 . The process of claim 1 , wherein the injecting a remediation material into the subsurface via the one or more orifices of the injection head to support a hyphal network of mycelium comprises:
injecting at least one of the following remediation materials into the subsurface: fungus, mycelium, enzyme, bacteria, or microbe.
14 . The process of claim 1 , wherein the process for in-situ remediation is performed without excavation.
15 . The process of claim 1 , wherein the pushing an injection head into a subsurface comprises:
pushing an injection head into a subsurface using a direct push type rig.
16 . The process of claim 1 , wherein the pushing an injection head into a subsurface comprises:
pushing an injection head into a subsurface such that the injection head collapses to a first configuration.
17 . The process of claim 16 , wherein the pulling the sleeve comprises:
pulling the sleeve such that the injection head extends to a second configuration that is longer than the first configuration.
18 . The process of claim 1 , further comprising:
stepping the injection head sequentially to at least one other depth.
19 . The process of claim 1 , further comprising:
pushing a distributed set of injection heads into the subsurface to a target soil horizon.
20 . The process of claim 1 , wherein the injecting a remediation material into the subsurface comprises:
fracturing the subsurface by injecting the remediation material via the one or more orifices of the injection head.
21 . A process for in-situ remediation, the process comprising:
pushing an injection device into a subsurface;
rotating at least a portion of the injection device, the rotating extending the injection device to expose one or more perforations that were covered during pushing; and
injecting a remediation material into the subsurface via the one or more perforations.
22 . A process for in-situ remediation, the process comprising:
pushing a rod casing into a subsurface;
pulling a sleeve of the rod casing to expose one or more holes of the rod casing that were covered during pushing; and
injecting a remediation material into the subsurface via the one or more holes.