IP Library Granted Patent US 12691492
Granted Patent B2
US 12691492 · App. 18/397,832 · Granted Jul 28, 2026

Thixotropically molded product, thixotropic molding material, and method of producing thixotropic molding material

Inventors: Shunsuke Uchizono (Shiojiri, JP); Yasutoshi Hideshima (Matsumoto, JP); Setsuya Iwashita (Nirasaki, JP); Fumiya Maeda (Matsumoto, JP); Koichi Ozaki (Okayama, JP); Tadao Fukuta (Kurashiki, JP)
Assignee: SEIKO EPSON CORPORATION
B22D21/007C22C1/1068C22C23/02
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Quick Facts
Patent No.
US 12691492
App. No.
18/397,832
Granted
Jul 28, 2026
Kind
B2
Abstract

A thixotropically molded product includes: a matrix portion containing Mg as a main component; a first particle portion dispersed in the matrix portion and containing SiC as a main component; a second particle portion dispersed in the matrix portion and containing Mg 2 Si as a main component; and a third particle portion dispersed in the matrix portion and containing MgO as a main component. An area fraction of the first particle portion in a cross section is 0.68 or more and 19.6% or less.

Claims (26)

1 . A thixotropically molded product comprising:

a matrix portion containing Mg as a main component;

a first particle portion dispersed in the matrix portion and containing SiC as a main component;

a second particle portion dispersed in the matrix portion and containing Mg 2 Si as a main component; and

a third particle portion dispersed in the matrix portion and containing MgO as a main component, wherein

an area fraction of the first particle portion in a cross section is 0.6% or more and 19.6% or less.

2 . The thixotropically molded product according to claim 1 , wherein

a total area of the second particle portion and the third particle portion in the cross section is 1.0 or more and 30.0 or less when an area of the first particle portion is 100.

3 . The thixotropically molded product according to claim 1 , wherein

an average particle diameter of the first particle portion is 0.3 μm or more and 20.0 μm or less,

an average particle diameter of the second particle portion is 10.0 μm or less, and

an average particle diameter of the third particle portion is smaller than the average particle diameter of the second particle portion.

4 . A thixotropic molding material comprising:

a metal body containing Mg as a main component;

silicon carbide particles adhering to a surface of the metal body and containing SiC as a main component; and

interposed particles interposed between the metal body and the silicon carbide particles and made of an inorganic material, wherein

a ratio of the silicon carbide particles to a total of the metal body and the silicon carbide particles is 1.0 mass % or more and 30.0 mass % or less.

5 . The thixotropic molding material according to claim 4 , wherein

the inorganic material is a silicon oxide.

6 . The thixotropic molding material according to claim 4 , wherein

an average particle diameter of the silicon carbide particles is 0.3 μm or more and 20 μm or less.

7 . A method of producing a thixotropic molding material comprising:

a preparation step of preparing a mixture containing a metal body containing Mg as a main component, silicon carbide particles containing SiC as a main component, interposed particles made of an inorganic material, and a dispersion medium;

a stirring step of stirring the mixture; and

a drying step of adhering the silicon carbide particles to a surface of the metal body via the interposed particles by removing at least a part of the dispersion medium from the stirred mixture, wherein

in the mixture, a ratio of the silicon carbide particles to a total of the metal body and the silicon carbide particles is 1.0 mass % or more and 30.0 mass % or less.