Additive manufacturing systems and methods including build characteristic contribution profiles
An additive manufacturing system includes a control system communicatively coupled to a consolidation device and configured to control operation of the consolidation device. The control system is configured to generate a model of a component including a plurality of elements and at least one region of interest. The control system is also configured to apply at least one strain load to at least one element of the plurality of elements and generate a build characteristic contribution profile based on the at least one strain load. The control system is further configured to determine a build parameter based at least partly on the build characteristic contribution profile.
1 . An apparatus comprising:
at least one memory circuit including instructions; and
at least one processor circuit configured to at least:
model a part to be built, the part including a plurality of elements, the modeling including applying modeled loads to the elements;
generate a build characteristic contribution map from the model, the build characteristic contribution map including a plurality of locations with respect to a region of interest of the part, the build characteristic contribution map providing a correlation between a respective location and a build characteristic of the region of interest;
adjust a build parameter of the region of interest for a build of the part by an additive manufacturing system based on the correlation; and
control the build of the part by the additive manufacturing system.
2 . The apparatus of claim 1 , wherein the at least one processor circuit is to adjust the build parameter during the build of the part.
3 . The apparatus of claim 1 , wherein the modeled loads include modeled strain loads, and wherein the modeling of the part includes modeling of stress caused by the modeled strain loads.
4 . The apparatus of claim 3 , wherein the strain loads include a plurality of directional strain loads applied to elements of the plurality of elements.
5 . The apparatus of claim 4 , wherein the at least one processor circuit is to determine at least one of a displacement or a distortion in the region of interest based on the plurality of directional strain loads.
6 . The apparatus of claim 1 , wherein the build parameter includes a stress, and wherein the build characteristic contribution map correlates the plurality of locations to stress on the region of interest.
7 . The apparatus of claim 1 , wherein the at least one processor circuit is to determine a scan strategy based on the build characteristic contribution map, the scan strategy including at least one of a scan orientation or a scan delay at at least one of the plurality of elements.
8 . The apparatus of claim 1 , wherein the build characteristic contribution map includes a plurality of build characteristic contribution profiles, respective build characteristic contribution profiles associated with respective locations.
9 . The apparatus of claim 1 , wherein the correlation includes a graduated scale measuring a relative value of a respective element's contribution on the build characteristic.
10 . At least one non-transitory computer readable storage medium including instructions that, when executed, cause at least one processor circuit to at least:
model a part to be built, the part including a plurality of elements, the modeling including applying modeled loads to the elements;
generate a build characteristic contribution map from the model, the build characteristic contribution map including a plurality of locations with respect to a region of interest of the part, the build characteristic contribution map providing a correlation between a respective location and a build characteristic of the region of interest;
adjust a build parameter of the region of interest for a build of the part by an additive manufacturing system based on the correlation; and
control the build of the part by the additive manufacturing system.
11 . The at least one computer readable storage medium of claim 10 , wherein the at least one processor circuit is to adjust the build parameter during the build of the part.
12 . The at least one computer readable storage medium of claim 10 , wherein the modeled loads include modeled strain loads, and wherein the modeling of the part includes modeling of stress caused by the modeled strain loads.
13 . The at least one computer readable storage medium of claim 12 , wherein the strain loads include a plurality of directional strain loads applied to elements of the plurality of elements.
14 . The at least one computer readable storage medium of claim 13 , wherein the at least one processor circuit is to determine at least one of a displacement or a distortion in the region of interest based on the plurality of directional strain loads.
15 . The at least one computer readable storage medium of claim 10 , wherein the build parameter includes a stress, and wherein the build characteristic contribution map correlates the plurality of locations to stress on the region of interest.
16 . The at least one computer readable storage medium of claim 10 , wherein the at least one processor circuit is to determine a scan strategy based on the build characteristic contribution map, the scan strategy including at least one of a scan orientation or a scan delay at at least one of the plurality of elements.
17 . The at least one computer readable storage medium of claim 10 , wherein the build characteristic contribution map includes a plurality of build characteristic contribution profiles, respective build characteristic contribution profiles associated with respective locations.
18 . The at least one computer readable storage medium of claim 10 , wherein the correlation includes a graduated scale measuring a relative value of a respective element's contribution on the build characteristic.