Solder particle manufacturing method, solder particle, and conductive composition
A solder particle manufacturing method includes a curing step of curing solder particles such that a hardness K of the solder particles under compressive deformation to 70% is 850 N/mm 2 or greater and 1,500 N/mm 2 or less, and a classifying step of classifying the solder particles after being cured by forcibly generating an airflow using a classifying device.
1 . A solder particle manufacturing method, comprising:
curing solder particles such that a hardness K of the solder particles under compressive deformation to 70% is 850 N/mm 2 or greater and 1,500 N/mm 2 or less; and
classifying the solder particles after being cured by forcibly generating an airflow using a classifying device.
2 . The solder particle manufacturing method according to claim 1 ,
wherein in the curing, solder particles having a hardness K of less than 850 N/mm 2 under compressive deformation to 70% are cured.
3 . The solder particle manufacturing method according to claim 1 ,
wherein in the curing, heating is performed in an oxygen-containing atmosphere at a temperature lower than or equal to (a melting point of the solder particles-15° C.).
4 . The solder particle manufacturing method according to claim 1 ,
wherein the classifying is performed in an oxygen-containing atmosphere.
5 . The solder particle manufacturing method according to claim 1 ,
wherein the classifying device is a device configured to classify the solder particles while generating the airflow by suctioning by a blower to swirl the solder particles and make the solder particles collide with a surface of a sieve.