IP Library Granted Patent US 12692199
Granted Patent B2
US 12692199 · App. 18/038,598 · Granted Jul 28, 2026

Cutting tool

Inventors: Hirotsugu Iwasaki (Hyogo, JP); Akihiko Ueda (Hyogo, JP); Naoki Watanobe (Hyogo, JP); Takashi Harada (Hyogo, JP); Satoru Kukino (Hyogo, JP)
Assignee: SUMITOMO ELECTRIC HARDMETAL CORP.
C04B35/528
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Quick Facts
Patent No.
US 12692199
App. No.
18/038,598
Granted
Jul 28, 2026
Kind
B2
Abstract

A cutting tool includes a rake face, a flank face, and a cutting edge ridge line connecting the rake face and the flank face. A portion of the rake face and a portion of the flank face adjacent to the cutting edge ridge line are made of a diamond sintered body including diamond grains. A dislocation density in the portion of the flank face is 8×10 15 /m 2 or less. The diamond grains have an average grain size of 0.1 μm to 50 μm. A content ratio of the diamond grains in the diamond sintered body is 80% by volume to 99% by volume.

Claims (20)

1 . A cutting tool comprising a rake face, a flank face, and a cutting edge ridge line connecting the rake face and the flank face,

wherein each of a portion of the rake face and a portion of the flank face adjacent to the cutting edge ridge line is made of a diamond sintered body including diamond grains,

a dislocation density in the portion of the flank face is 7.5×10 15 /m 2 or less,

the diamond grains have an average grain size of 0.1 μm to 50 μm, and

a content ratio of the diamond grains in the diamond sintered body is 80% by volume to 99% by volume.

2 . The cutting tool according to claim 1 , wherein the dislocation density of the diamond sintered body in the portion of the flank face is 7×10 15 /m 2 or less.

3 . The cutting tool according to claim 1 ,

wherein the diamond sintered body includes a binder,

the binder contains at least one selected from the group consisting of an elemental metal, an alloy, and an intermetallic compound, and

each of the elemental metal, the alloy, and the intermetallic compound contains at least one metal element selected from the group consisting of a group 4 element in the periodic table, a group 5 element in the periodic table, a group 6 element in the periodic table, iron, aluminum, silicon, cobalt, and nickel.

4 . The cutting tool according to claim 1 ,

wherein the diamond sintered body includes a binder,

the binder contains at least one selected from the group consisting of a compound and a solid solution derived from the compound,

the compound consists of at least one selected from the group consisting of an elemental metal, an alloy, and an intermetallic compound and at least one selected from

the group consisting of nitrogen, carbon, and oxygen, and each of the elemental metal, the alloy, and the intermetallic compound contains at least one metal element selected from the group consisting of a group 4 element in the periodic table, a group 5 element in the periodic table, a group 6 element in the periodic table, iron, aluminum, silicon, cobalt, and nickel.

5 . The cutting tool according to claim 3 , wherein the binder contains cobalt.

6 . The cutting tool according to claim 1 , wherein a surface roughness Ra in the portion of the rake face is 120 nm or less.

7 . The cutting tool according to claim 1 , wherein a dislocation density in the portion of the rake face is 10×10 15 /m 2 or less.

8 . The cutting tool according to claim 1 , comprising a substrate holding the diamond sintered body.

9 . The cutting tool according to claim 1 , wherein each of an entirety of the rake face and an entirety of the flank face is made of the diamond sintered body.