IP Library › Granted Patent US 12692342
Granted Patent B2
US 12692342 · App. 17/822,281 · Granted Jul 28, 2026

Epoxy resin composition, cured product, and electrical/electronic component

Inventor: Kazumasa Ota (Tokyo, JP)
Assignee: Mitsubishi Chemical Corporation
C08G59/621
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Quick Facts
Patent No.
US 12692342
App. No.
17/822,281
Granted
Jul 28, 2026
Kind
B2
Abstract

An epoxy resin composition (A), having an epoxy resin represented by formula (1): and an epoxy resin represented by formula (2): where R 1 is a linear aliphatic hydrocarbon group having 1 to 6 carbon atoms, and n is an integer of 0 or 1. An epoxy resin composition (B), having 100 parts by weight of the epoxy resin composition (A) and 0.01 to 1,000 parts by weight of a curing agent.

Claims (11)

1 . An epoxy resin composition (A), comprising an epoxy resin of formula (1) and an epoxy resin of formula (2):

wherein R 1 is a linear aliphatic hydrocarbon group having from 4 to 6 carbon atoms, and

n is an integer of 0 or 1,

wherein a hydrolyzable chlorine content of the epoxy resin composition (A) is 300 ppm or less by weight.

2 . The epoxy resin composition (A) according to claim 1 , wherein a proportion of the epoxy resin of formula (1) is from 0.01% to 5.0% by weight of the epoxy resin composition.

3 . The epoxy resin composition (A) according to claim 1 , wherein in the epoxy resin of formula (2), a proportion of the epoxy resin in which n=0 is from 83.0% to 90.0% by weight of the epoxy resin composition, and a proportion of the epoxy resin in which n=1 is 2.0% to 9.9% by weight of the epoxy resin composition.

4 . An epoxy resin composition (B), comprising 100 parts by weight of the epoxy resin composition (A) according to claim 1 and 0.01 to 1,000 parts by weight of a curing agent.

5 . The epoxy resin composition (B) according to claim 4 , wherein the curing agent is at least one selected from the group consisting of phenolic curing agents, amine curing agents, acid anhydride curing agents, and amide curing agents.

6 . The epoxy resin composition (B) according to claim 4 , further comprising an epoxy resin different from the epoxy resin in the epoxy resin composition (A).

7 . A cured product obtained by curing the epoxy resin composition (B) according to claim 4 .

8 . An electrical or electronic component obtained by curing the epoxy resin composition (B) according to claim 4 .