Adhesive tape
Provided in the present invention is an adhesive tape, including: a base film, having a coefficient of thermal expansion within a range of 4.5 to 15 ppm/° C.; and an adhesive layer, including polyether ether ketone having a crystallinity equal to or less than 10% and an elastic modulus between 10 and 100 MPa at 150-300° C. The adhesive tape according to the technical solution of the present invention can effectively avoid problems such as chip tilt, packaging material flash, contamination caused by an adhesive residue, lead frame warpage, and the like during back-end packaging of a semiconductor device.
1 . An adhesive tape, comprising:
a base film, having a coefficient of thermal expansion within a range of 4.5 to 15 ppm/° C.
when tested from of −150° C.-1000° C.; and
an adhesive layer, comprising polyether ether ketone having a crystallinity equal to or less than 10% and an elastic modulus between 10 and 100 MPa at 150-300° C., wherein the adhesive layer is bonded to the base film.
2 . The adhesive tape according to claim 1 , wherein the base film is a heat-resistant base film.
3 . The adhesive tape according to claim 1 , wherein the base film is a polyimide film.
4 . The adhesive tape according to claim 3 , wherein a glass transition temperature of the polyimide film is greater than or equal to 300° C.
5 . The adhesive tape according to claim 1 , wherein the base film has a thickness within a range of 5 to 50 μm.
6 . The adhesive tape according to claim 1 , wherein the base film and the adhesive layer are bonded to each other.
7 . The adhesive tape according to claim 1 , wherein the adhesive layer does not comprise any epoxy resin reactive group.
8 . The adhesive tape according to claim 1 , wherein the adhesive layer does not comprise any carboxyl group, acid anhydride group, amine group, amide group, carbamate group, isocyanate group, epoxy group, hydroxyl group, or thiol group.
9 . The adhesive tape according to claim 1 , wherein the adhesive layer has a thickness within a range of 6 to 50 μm.
10 . The adhesive tape according to claim 1 , wherein the adhesive tape further comprises an adhesion agent layer located between the base film and the adhesive layer.
11 . The adhesive tape according to claim 10 , wherein the adhesive tape sequentially comprises the base film, the adhesion agent layer, and the adhesive layer contacting each other.
12 . The adhesive tape according to claim 10 , wherein the adhesion agent layer comprises a pressure-sensitive adhesive adhesion agent or a semi-structural adhesive adhesion agent.
13 . The adhesive tape according to claim 10 , wherein the adhesion agent layer comprises one or more of an acrylate-based pressure sensitive adhesive adhesion agent or semi-structural adhesive adhesion agent or a polyurethane-based pressure sensitive adhesive adhesion agent or semi-structural adhesive adhesion agent.
14 . The adhesive tape according to claim 10 , wherein the adhesion agent layer has a thickness within a range of 2 to 8 μm.