Rotary electrical feedthrough integration for process chamber

1 . A semiconductor processing tool, comprising:

a chamber;

a chuck within the chamber, wherein the chuck is configured to rotate;

a pedestal holder around the chuck; and

a utility column coupled to the chuck, wherein the utility column comprises:

a magnetic coupler to enable rotation of portions of the utility column and the chuck, wherein the magnetic coupler comprises a bushing, wherein the bushing is stationary, a first set of magnets outside of the bushing, a second set of magnets inside of the bushing, and a tube coupled to the second set of magnets; and

a rotary electrical feedthrough, wherein the rotary electrical feedthrough, comprises a stator housing, and a rotor, and wherein an RF return path is provided along the pedestal holder, the bushing, and the stator housing.

2 . The semiconductor processing tool of claim 1 , wherein the RF return path is electrically isolated from conductive components other than the pedestal holder, the bushing, and the stator housing, and wherein an outer race of a mechanical bearing inside of the bushing is electrically isolated from the RF return path.

3 . The semiconductor processing tool of claim 1 , wherein the interior of the tube and the rotary electrical feedthrough are sealed in order to enable a chamber vacuum pressure to be maintained in the tube and the rotary electrical feedthrough.

4 . The semiconductor processing tool of claim 1 , wherein a dynamic seal fluidically isolates the rotary electrical feedthrough and an interior of the tube from the exterior of the tube, and wherein the rotary electrical feedthrough and the interior of the tube are configured to be held at a pressure that is different than the pressure in a wafer cavity and a process cavity in the chamber.

5 . The semiconductor processing tool of claim 1 , wherein the semiconductor processing tool is a physical vapor deposition (PVD) tool.

6 . The semiconductor processing tool of claim 1 , wherein the rotary electrical feedthrough comprises up to seven electrical inputs.

7 . The semiconductor processing tool of claim 6 , wherein the electrical inputs are provided for one or more heaters and one or more chucking electrodes.

8 . The semiconductor processing tool of claim 1 , further comprising:

a backside gas line for a substrate on the chuck, wherein the backside gas line is at an axial center of the utility column, and wherein a dynamic seal is provided around the backside gas line at a bottom of the rotary electrical feedthrough, and wherein a backside gas thermally couples the substrate to the chuck.