Method and apparatus for plating metal and metal oxide layer cores
An apparatus and method for plating magnetic cores by periodically transferring a plate directly back and forth between a metal plating environment and an insulation deposit environment. This direct metal to insulation to metal plating is enabled by a nano-scale insulation layer that provides an imperfect coverage of the metal layer while still keeping sufficient insulation to prevent eddy current formation—even during high-frequency current applications. Therefore, this invention enables the practical creation of magnetic cores having layers with widths even under one nanometer and can generate cores having a layer scale that can be varied to suit a variety of uses in the microelectronic industry.
1 . A magnetic core apparatus comprising;
an initial metal layer;
a least one oxide insulation layer having a series of imperfections and operationally bonded to the initial metal layer; and
a subsequent metal layer operationally bonded to the initial metal layer through imperfections in the oxide insulation layer; and
the subsequent metal layers and the oxide insulation layers repeat at least once in an alternating fashion.
2 . The magnetic core apparatus of claim 1 , wherein the total number of layers is 4000 or less.
3 . The magnetic core apparatus of claim 1 , wherein the metal layers are nickel and nickel-iron, and the oxide layers are nickel oxide.
4 . The magnetic core apparatus of claim 3 , wherein the ratio of the nickel layer thickness to the ratio of nickel-oxide thickness is of a range from 1:3 to 1:10.