IP Library › Granted Patent US 12693310
Granted Patent B2
US 12693310 · App. 18/284,072 · Granted Jul 28, 2026

Probe

Inventor: Kenichi Sato (Tomioka, JP)
Assignee: YOKOWO CO., LTD.
G01R1/067C22C5/04C22C9/00C22C30/02
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Quick Facts
Patent No.
US 12693310
App. No.
18/284,072
Granted
Jul 28, 2026
Kind
B2
Abstract

A probe includes greater than or equal to 15 mass % and less than or equal to 60 mass % of Pd, greater than or equal to 3 mass % and less than or equal to 79.9 mass % of Cu, and greater than or equal to 0.1 mass % and less than or equal to 75 mass % of at least one of Ni and Pt.

Claims (21)

1 . A probe formed of an alloy, the alloy comprising:

greater than or equal to 15 mass % and less than or equal to 60 mass % of Pd;

greater than or equal to 3 mass % and less than or equal to 79.9 mass % of Cu; and

greater than or equal to 0.1 mass % and less than or equal to 75 mass % of at least one of Ni and Pt, wherein when the alloy and a solder undergo heat treatment, the alloy has a solder resistance such that a diffusion layer in which both the solder and the Pd exist is less than or equal to 200 μm.

2 . The probe according to claim 1 , wherein the solder is a Sn—Bi based solder.

3 . The probe according to claim 1 , wherein the heat treatment is conducted at 250° C. for 1 hour.

4 . The probe according to claim 1 , wherein the alloy constitutes at least a tip end of the probe.

5 . The probe according to claim 4 , wherein the tip end of the probe includes a plurality of points around a central axis of the probe.

6 . The probe according to claim 1 , wherein the alloy comprises:

greater than or equal to 20 mass % and less than or equal to 48 mass % of Pd;

greater than or equal to 5 mass % and less than or equal to 74 mass % of Cu; and

greater than or equal to 0.5 mass % and less than or equal to 70 mass % of at least one of Ni and Pt.

7 . The probe according to claim 1 , wherein the alloy does not contain Ag.

8 . The probe according to claim 1 , wherein the alloy does not contain In.

9 . The probe according to claim 1 , wherein the alloy does not contain Ag or In.

10 . The probe according to claim 1 , wherein the alloy contains both Ni and Pt.

11 . The probe according to claim 1 , wherein the probe includes a plunger having a tip end, and wherein the plunger is formed of the alloy.

12 . The probe according to claim 11 , wherein the tip end of the plunger includes a plurality of points.

13 . The probe according to claim 1 , wherein the probe is configured to electrically connect an inspection target object to an inspection board.

14 . The probe according to claim 13 , wherein the inspection target object includes the solder.

15 . A socket for electrically connecting an inspection target object to an inspection board, the socket comprising the probe of claim 1 .