Lithography stitching
A method of forming patterned features on a substrate is provided. The method includes: positioning a first mask over a first portion of a substrate; directing radiation through the patterned area of the first mask at the first portion of the substrate to form a first patterned region on the substrate; positioning a second mask over a second portion of the substrate, the second mask including a first patterned area and a second patterned area, the first patterned area spaced apart from the second patterned area by an unpatterned area; directing radiation through the first patterned area of the second mask at a first part of the second portion of the substrate to form a second patterned region on the substrate; and directing radiation through the second patterned area of the second mask at a second part of the second portion of the substrate to form a third patterned region.
1 . A method of forming patterned features on a substrate comprising:
positioning a first mask over a first portion of a substrate, the first mask including a patterned area;
directing radiation through the patterned area of the first mask at the first portion of the substrate to form a first patterned region on the substrate during a first time period;
positioning a second mask over a second portion of the substrate, the second mask including a first patterned area and a second patterned area, the first patterned area spaced apart from the second patterned area by an unpatterned area;
directing radiation through the first patterned area of the second mask at a first part of the second portion of the substrate to form a second patterned region on the substrate during a second time period; and
directing radiation through the second patterned area of the second mask at a second part of the second portion of the substrate to form a third patterned region on the substrate during a third time period, wherein the third patterned region is positioned between the first patterned region and the second patterned region.
2 . The method of claim 1 , wherein the third patterned region borders the first patterned region.
3 . The method of claim 2 , wherein the third patterned region borders the second patterned region.
4 . The method of claim 1 , wherein a size of the third patterned region is less than 10% of a size of the second patterned region.
5 . The method of claim 4 , wherein the size of the third patterned region is less than 10% of a size of the first patterned region.
6 . The method of claim 1 , wherein a size of the third patterned region is less than 1% of a size of the second patterned region.
7 . The method of claim 6 , the size of the third patterned region is less than 1% of a size of the first patterned region.
8 . The method of claim 1 , wherein the third time period occurs after the first time period and the second time period.
9 . The method of claim 1 , wherein the third time period occurs before the first time period and the second time period.
10 . The method of claim 1 , wherein the third time period occurs between the first time period and the second time period.
11 . A method of forming patterned features on a substrate comprising:
positioning a first mask over a first portion of a substrate during a first time period;
directing radiation through a patterned area of the first mask at the first portion of the substrate during the first time period to form a first patterned region on the substrate, wherein for the first mask
the patterned area of the first mask includes a first edge,
the patterned area of the first mask includes a plurality of transparent cells and non-transparent cells arranged in rows that extend perpendicular to the first edge and columns that extend parallel to the first edge, each transparent cell having a first side,
the first edge of the patterned area is parallel to the first side of each of the transparent cells, and
the positions of the transparent cells are arranged in a first staggered pattern in which the position of transparent cells are staggered for the different rows with respect to the first edge;
positioning a second mask over a second portion of the substrate during a second time period; and
directing radiation through a patterned area of the second mask at the second portion of the substrate during the second time period to form a second patterned region on the substrate, wherein for the second mask
the patterned area of the second mask includes a first edge,
the patterned area of the second mask includes a plurality of transparent cells and non-transparent cells arranged in rows perpendicular to the first edge and columns parallel to the first edge, each transparent cell having a first side,
the first edge of the patterned area is parallel to the first side of each of the transparent cells, and
the positions of the transparent cells are arranged in a second staggered pattern in which the position of transparent cells are staggered for the different rows with respect to the first edge.
12 . The method of claim 11 , wherein the first staggered pattern is configured to be combined with the second staggered pattern to form a combined pattern, the combined pattern including a plurality of rows in which a transparent cell from the first staggered pattern borders a transparent cell from the second staggered pattern.
13 . The method of claim 12 , wherein there is no overlap of transparent cells from the first staggered pattern and the second staggered pattern in the combined pattern.
14 . The method of claim 11 , wherein a distance from the first edge to a first transparent cell changes for each bordering row in the first staggered pattern.
15 . The method of claim 11 , wherein the first edge of the patterned area of the first mask consists of a single straight line.
16 . The method of claim 15 , wherein the first edge of the patterned area of the second mask consists of a single straight line.
17 . A method of forming patterned features on a substrate comprising:
positioning a first mask over a first portion of a substrate, the first mask including a patterned area,
directing radiation through the patterned area of the first mask at the first portion of the substrate to form a first patterned region on the substrate during a first time period;
positioning a second mask over a second portion of the substrate, the second mask including a first patterned area and a second patterned area, the first patterned area spaced apart from the second patterned area by an unpatterned area;
directing radiation through the first patterned area of the second mask at a first part of the second portion of the substrate to form a second patterned region on the substrate during a second time period; and
directing radiation through the second patterned area of the second mask at a second part of the second portion of the substrate to form a third patterned region on the substrate during a third time period, wherein
the third patterned region is positioned between the first patterned region and the second patterned region,
a size of the third patterned region is less than 1% of a size of the second patterned region,
the third patterned region borders the first patterned region, and
the third patterned region borders the second patterned region.
18 . The method of claim 17 , wherein the size of the third patterned region is less than 0.1% of the size of the second patterned region.
19 . The method of claim 17 , wherein
the third patterned region includes a first edge,
the second patterned region includes a first edge, and
a length of the first edge of the third patterned region is the same as a length of the first edge of the second patterned region.
20 . The method of claim 19 , wherein
the first patterned region includes a first edge, and
the length of the first edge of the third patterned region is the same as a length of the first edge of the first patterned region.