IP Library Granted Patent US 12693742
Granted Patent B2
US 12693742 · App. 18/338,733 · Granted Jul 28, 2026

Wearable device with haptic feedback and stimulations for the physicalization of remote digital interaction

Inventor: Rui Huang (Guangdong, CN)
G06F3/016H04R1/105
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Quick Facts
Patent No.
US 12693742
App. No.
18/338,733
Granted
Jul 28, 2026
Kind
B2
Abstract

A wearable device with a tangible user interface to provide haptic feedback and multi-sensorial stimulation for the physicalization of remote digital interaction, which comprises a headband, an array of haptic/kinesthetic feedback actuators, the first earpiece and the second earpiece, physiological sensing modules, and dynamic position sensing modules. The array of the haptic/kinesthetic feedback actuators is embedded, and evenly or unevenly distributed, in the headband. The invention has the following advantages compared to the prior arts: the solution introduces haptic and kinesthetic feedback and stimulation into remote communication and digital interaction, and more specifically, involves a device with a dual-layers interface, comprising of a haptic-based tangible layer and an audio channel, through which introduces tactile and kinesthetic feedback into remote communication, and translates gestures, facial expressions, tone of voice, and other tangible stimuli into haptic representations, following the principle guided by the ‘tactile and kinesthetic feedback semantic database’.

Claims (15)

1 . A wearable device with a tangible user interface to provide haptic feedback and multi-sensorial stimulation for the physicalization of remote digital interaction, which comprises a headband ( 1 ), a first earpiece ( 2 ), a second earpiece ( 3 ), an array of haptic/kinesthetic feedback actuators ( 5 ), a physiological sensing module, and a dynamic position sensing module;

wherein an adaptable headband housing ( 11 ) is externally attached to the headband ( 1 ), and the array of haptic/kinesthetic feedback actuators ( 5 ) are evenly or unevenly distributed across the headband ( 1 );

the headband housing ( 11 ) is connected with the first earpiece ( 2 ) at a first end and the second earpiece ( 3 ) at a second end, and both the first earpiece ( 2 ) and the second earpiece ( 3 ) are equipped with audio modules ( 4 );

the first earpiece ( 2 ) is provided with a power supply module ( 7 ), the second earpiece ( 3 ) is provided with a central processing unit (CPU) processor ( 6 ), a first audio receiver ( 8 ), and a second audio receiver ( 9 ); and

a touch control module ( 10 ) is also provided at the headband housing ( 11 );

wherein the first earpiece ( 2 ) comprises a first ear clip housing, and the first ear clip housing interior is provided with audio module ( 4 ) for the first earpiece ( 2 ), and the touch control module ( 10 ) corresponding to the exterior of the first ear clip housing; the audio module ( 4 ) and the touch control module ( 10 ) are connected to the CPU processor ( 6 ) and power supply module ( 7 ) through built-in circuits and I2C interface inside the headband ( 1 ).

2 . A wearable device with a tangible user interface to provide haptic feedback and multi-sensorial stimulation for the physicalization of remote digital interaction as claimed in claim 1 , wherein the CPU processor ( 6 ) comprises one or more processors, control units, storage units, wireless communication circuits, physiological information sensing modules, dynamic position sensing modules, and power supply modules ( 7 ), and the one or more the storage units, wireless communication circuits, physiological information sensing modules and dynamic position sensing modules are electrically connected to the CPU processor ( 6 ) and power supply module ( 7 ) through built-in circuits.

3 . A wearable device with a tangible user interface to provide haptic feedback and multi-sensorial stimulation for the physicalization of remote digital interaction as claimed in claim 2 , wherein the audio module ( 4 ) for first earpiece comprises a bone conduction vibrator unit and/or loudspeaker and an audio signal processor connected by built-in circuits, and the audio signal processor is electrically connected to the CPU processor ( 6 ) and the power supply device ( 7 ) via an I2C interface.

4 . A wearable device with a tangible user interface to provide haptic feedback and multi-sensorial stimulation for the physicalization of remote digital interaction as claimed in claim 1 , wherein the array of the haptic/kinesthetic feedback actuators ( 5 ) is evenly or unevenly distributed circumferentially along the headband ( 1 ) and is electrically connected to the CPU processor ( 6 ) and power supply module ( 7 ) through built-in circuits of the headband ( 1 ), providing surrounded vibration-based haptic and kinesthetic feedback and multi-sensorial stimulations.

5 . A wearable device with a tangible user interface to provide haptic feedback and multi-sensorial stimulation for the physicalization of remote digital interaction as claimed in claim 1 , wherein the second earpiece ( 3 ) comprises a second ear clip housing, and the audio module ( 4 ) for the second earpiece, a heart rate sensor, a electroencephalogram recorder, a contact sensor; and an light emitting diode (LED) module are provided compatible within the second earpiece ( 3 ); and the audio module, the heart rate sensor, the electroencephalogram recorder, and the contact sensor are connected to the CPU processor ( 6 ) and the power supply module ( 7 ) through built-in circuits and an I2C interface within the headband ( 1 ).

6 . A wearable device with a tangible user interface to provide haptic feedback and multi-sensorial stimulation for the physicalization of remote digital interaction as claimed in claim 1 , wherein the audio module ( 4 ) of the second earpiece ( 3 ) comprises a cartilage conduction vibrator unit or a speaker, as well as an audio signal processor connected through built-in circuits; the audio signal processor is electrically connected to the CPU processor ( 6 ) and the power supply device ( 7 ) via an I2C interface; the audio signal processor comprises a digital-to-analog conversion chip and a digital amplification chip; one end of the digital-to-analog conversion chip is electrically connected to the CPU processor ( 6 ) via wires, and the other end is connected to one end of the digital amplification chip; the other end of the digital amplification chip is connected to the cartilage conduction vibrator unit or speaker ( 4 ).

7 . A wearable device with a tangible user interface to provide haptic feedback and multi-sensorial stimulation for the physicalization of remote digital interaction as claimed in claim 1 , wherein the first earpiece ( 2 ) and the second earpiece ( 3 ) further comprise a first audio receiver ( 8 ) and a second audio receiver ( 9 ); and both first audio receiver ( 8 ) and the second audio receiver ( 9 ) comprise two microphones, with one microphone positioned for capturing ambient noise, and the other microphone for collecting user speech; and the first audio receiver ( 8 ) is electrically connected to the CPU processor ( 6 ).

8 . A wearable device with a tangible user interface to provide haptic feedback and multi-sensorial stimulation for the physicalization of remote digital interaction as claimed in claim 1 , wherein the physiological sensing module comprises one of the optical heart rate sensors or the electroencephalogram recorder.

9 . A wearable device with a tangible user interface to provide haptic feedback and multi-sensorial stimulation for the physicalization of remote digital interaction as claimed in claim 1 , wherein the dynamic position sensing module comprises one of an accelerometers or a gyroscope.

10 . A wearable device with a tangible user interface to provide haptic feedback and multi-sensorial stimulation for the physicalization of remote digital interaction as claimed in claim 1 , wherein the Tangible User Interface (TUI) is further configured to map audio and/or gesture inputs to haptic, tactile, and kinesthetic output patterns according to a tactile and kinesthetic feedback semantic database executed by the CPU processor ( 6 ).