Automated power discrete and module model generation for system level simulators

1 . A method of generating a product system model for use in system level simulations, the method comprising:

using a first interface generated by a computing device, receiving from a user a selection of a product type;

selecting, using a processor, a product SPICE model associated with the product type from a database of product SPICE models;

using a second interface generated by the computing device, receiving from the user a selection of a process condition;

using a third interface generated by the computing device, receiving from the user one or more system characteristics and one or more operating characteristics;

using a fourth interface generated by the computing device, receiving from the user one or more circuit characteristics;

using the processor and a SPICE model simulation module, generating a SPICE model output with the product SPICE model, the process condition, the one or more system characteristics, the one or more operating characteristics, and the one or more circuit characteristics; and

using the processor and a formatting module, formatting the SPICE model output into a product system model file, the product system model file comprising one of a structured text file, a plain text file, or a delimited text file.

2 . The method of claim 1 , wherein the product system model file is configured to be used to perform a system level simulation of a system comprising the product type.

3 . The method of claim 1 , wherein receiving from the user the selection of the product type further comprises receiving a selection of one of a product die type, a product technology type, a product voltage level, a device type, and any combination thereof.

4 . The method of claim 1 , wherein receiving from the user the selection of the process condition further comprises receiving a selection of one of a nominal condition, a worst conduction loss/best case switching loss, or a best case conduction loss/worst case switching loss.

5 . The method of claim 1 , wherein the one or more system characteristics comprise one of a number of devices and one or more temperatures.

6 . The method of claim 1 , wherein the one or more operating characteristics further comprises one of at least one direct current characteristic, at least one switching characteristic, at least one gate threshold voltage, or any combination thereof.

7 . The method of claim 1 , wherein the one or more circuit characteristics further comprise one of gate resistance, gate inductance, gate loop inductance, source inductance, loop inductance, diode voltage, and any combination thereof.

8 . The method of claim 1 , wherein the fourth interface further comprises a circuit schematic.

9 . The method of claim 1 , wherein the product system model file is a structured text file configured to be used by a Piecewise Linear Electrical Circuit Simulation system.

10 . The method of claim 1 , wherein the product type comprises a discrete power semiconductor die.

11 . A system for generating a system model for use in system level simulations, the system comprising:

one or more hardware processors configured by machine-readable instructions to:

use a first interface generated by a computing device to receive from a user a selection of a product type;

select a product SPICE model associated with the product type from a database of product SPICE models;

use a second interface generated by a computing device to receive from the user a selection of a process condition;

use a third interface generated by a computing device to receive from the user one or more system characteristics and one or more operating characteristics;

use a fourth interface generated by a computing device to receive from the user one or more circuit characteristics;

use a SPICE model simulation module to generate a SPICE model output with the product SPICE model, the process condition, the one or more system characteristics, the one or more operating characteristics, and the one or more circuit characteristics; and

use a formatting module to format the SPICE model output into a product system model file, the product system model file comprising one of a structured text file, a plain text file, or a delimited text file.

12 . The system of claim 11 , wherein the product system model file is configured to be used to perform a system level simulation of a system comprising the product type.

13 . The system of claim 11 , wherein the selection of the product type further comprises a selection of one of a product die type, a product technology type, a product voltage level, a device type, and any combination thereof.

14 . The system of claim 11 , wherein the selection of the process condition further comprises a selection of a nominal condition, a worst conduction loss/best case switching loss, or a best case conduction loss/worst case switching loss.

15 . The system of claim 11 , wherein the one or more system characteristics comprise one of a number of devices and one or more temperatures.

16 . The system of claim 11 , wherein the one or more operating characteristics further comprises one of at least one direct current characteristic, at least one switching characteristic, at least one gate threshold voltage, or any combination thereof.

17 . The system of claim 11 , wherein the one or more circuit characteristics further comprise one of gate resistance, gate inductance, gate loop inductance, source inductance, loop inductance, diode voltage, and any combination thereof.

18 . The system of claim 11 , wherein the fourth interface further comprises a circuit schematic.

19 . The system of claim 11 , wherein the product system model file is a structured text file configured to be used by a Piecewise Linear Electrical Circuit Simulation system.

20 . The system of claim 11 , wherein the product type comprises a discrete power semiconductor die.