Plasma processing apparatus
A plasma processing apparatus is for performing plasma processing in a depressurizable inner space. The apparatus includes a chamber having therein an inner space, a supporting table provided in the inner space and configured to support a substrate to be mounted thereon, one or more first members included in the chamber or separate from the chamber and partially exposed to a depressurized environment including the inner space, and one or more second members included in the chamber or separate from the chamber, each being in contact with a corresponding one of said one or more first members, and partially disposed in an atmospheric pressure environment. The apparatus further includes one or more feeders each of which is configured to supply a coolant to a cavity formed in a corresponding one of said one or more second members.
1 . A plasma processing apparatus comprising:
a plasma processing chamber having a depressurizable inner space;
a substrate support disposed in the plasma processing chamber;
a lower electrode disposed in the substrate support;
an upper electrode disposed above the substrate support;
a first thermally conductive member surrounding the upper electrode, the first thermally conductive member being insulated from the upper electrode and the first thermally conductive member being partially exposed to a depressurized environment including the inner space;
a heater disposed in the first thermally conductive member;
a second thermally conductive member surrounding and contacting the first thermally conductive member, the second thermally conductive member having a coolant channel and the second thermally conductive member being disposed in an atmospheric pressure environment;
a sealing member disposed between the first thermally conductive member and the second thermally conductive member, the sealing member separating the depressurized environment from the atmospheric pressure environment; and
a coolant supply configured to supply a coolant to the coolant channel.
2 . The plasma processing apparatus of claim 1 , wherein the coolant is water.
3 . The plasma processing apparatus of claim 1 , further comprising a pipe disposed in the second thermally conductive member,
wherein the pipe has the coolant channel.
4 . The plasma processing apparatus of claim 3 , wherein the pipe is disposed in a groove formed in the second thermally conductive member.
5 . The plasma processing apparatus of claim 1 , wherein the coolant is air.
6 . The plasma processing apparatus of claim 1 , wherein the first thermally conductive member is formed of aluminum material.
7 . The plasma processing apparatus of claim 6 , wherein the heater includes a resistive heating element.
8 . The plasma processing apparatus of claim 7 , wherein the second thermally conductive member is formed of aluminum material.
9 . The plasma processing apparatus of claim 1 , wherein the second thermally conductive member is exposed to an atmospheric environment.
10 . The plasma processing apparatus of claim 1 , wherein the second thermally conductive member is vertically overlapped with the first thermally conductive member.
11 . The plasma processing apparatus of claim 1 , wherein the second thermally conductive member has a cavity as the coolant channel.
12 . The plasma processing apparatus of claim 1 , further comprising a feeder configured to supply the coolant from the coolant supply to the coolant channel,
wherein the feeder extends through the second thermally conductive member from the atmospheric pressure environment to the coolant channel, and
wherein the coolant in the coolant channel indirectly cools the first thermally conductive member via thermal conduction through a contact surface between the first thermally conductive member and the second thermally conductive member.
13 . A substrate processing apparatus comprising:
a chamber having a sidewall, the sidewall having a first opening;
a substrate support disposed in the chamber;
a tubular shield disposed between the sidewall of the chamber and the substrate support, the tubular shield having a second opening facing the first opening;
a shutter mechanism configured to open and close the second opening, the shutter mechanism including:
a valve body configured to close the second opening;
a shaft body connected to the valve body, the shaft body having a main portion and a flange, the flange contacting the valve body, the main portion extending downward from the flange, the shaft body having a cavity as a coolant channel;
a cylindrical body through which the main portion of the shaft body is movable; and
a sealing portion provided in the cylindrical body, the sealing portion separating a depressurized environment including an inner space of the chamber from an atmospheric pressure environment;
a coolant supply configured to supply a coolant to the coolant channel;
wherein the shutter mechanism includes a heater disposed in the flange.
14 . The substrate processing apparatus of claim 13 , wherein the coolant is water.
15 . The substrate processing apparatus of claim 13 , wherein the coolant is air.
16 . The substrate processing apparatus of claim 13 , wherein the tubular shield includes a conductive body and a coating formed on the conductive body.
17 . The substrate processing apparatus of claim 16 , wherein the coating is formed of aluminum oxide or yttrium oxide.
18 . The substrate processing apparatus of claim 13 , wherein the heater includes a resistive heating element.
19 . The substrate processing apparatus of claim 13 , wherein the coolant supply is configured to supply the coolant to the cavity of the shaft body from the atmospheric pressure environment through a passage extending through the cylindrical body, and wherein the heater disposed in the flange is configured to heat the valve body while the coolant in the cavity cools the shaft body.