IP Library Granted Patent US 12695180
Granted Patent B2
US 12695180 · App. 18/036,372 · Granted Jul 28, 2026

Circuit board and manufacturing method thereof

Inventors: Chih-Chieh Fu (New Taipei, TW); Yu-Jia Men (Qinhuangdao, CN)
Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.; Avary Holding (Shenzhen) Co., Limited.; GARUDA TECHNOLOGY CO., LTD.
H01Q1/38H05K1/0237H05K1/0298H01Q9/0407H05K2201/10098
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Quick Facts
Patent No.
US 12695180
App. No.
18/036,372
Granted
Jul 28, 2026
Kind
B2
Abstract

The present application provides a circuit board and a manufacturing method thereof. The manufacturing method includes: providing a stacked board; the stacked board includes a third conducting circuit, a second substrate, a first conducting circuit, a first substrate, and a second conducting circuit, which are stacked disposed in that order; defining several through holes on a surface of the stacked board along a stacked direction of the stacked board; and manufacturing antenna conductors in the through holes. The antenna conductors are disposed in the through holes on a surface of the stacked board, the antenna conductors on different layers are connected to corresponding conducting circuits, some of the antenna conductors are directly connected with the conducting circuit. A loss of signals while transmitting is reduced, and the circuit board including the antenna structure is changed from an up-down structure into a left-right structure for reducing a board thickness.

Claims (13)

1 . A circuit board comprising:

a stacked board, the stacked board comprising a third conducting layer, a second substrate, a first conducting circuit, a first substrate, and a second conducting circuit, which are stacked disposed in that order; multiple through holes are defined on the stacked board along a stacked direction of the stacked board; a surface of the third conducting layer facing the second substrate is etched to form the third conducting circuit; and

antenna conductors disposed in the multiple through holes respectively, and extended along a direction perpendicular to the stacked board;

wherein the antenna conductors comprises a first antenna conductor in one of the multiple through holes and a second antenna conductor in another of the multiple through holes; an end of the first antenna conductor and an end of the second antenna conductor are adjacent to the first conducting circuit, and are electrically connected with each other through the first conducting circuit; another end of the first antenna conductor and another end of the second antenna conductor are adjacent to the second conducting circuit, and are electrically connected with each other through the second conducting circuit;

wherein the multiple through holes comprises a first through hole, a second through hole, and a third through hole; the antenna conductors further comprises a third antenna conductor, wherein

the first antenna conductor is disposed in the first through hole, the end and the other end of the first antenna conductor are directly connected with the first conducting circuit and the third conducting circuit, respectively; portions between the end and the other of the first antenna conductor are completely covered by the first substrate and the second substrate, respectively;

the second antenna conductor is disposed in the second through hole, the end and the other end of the second antenna conductor are directly connected with the first conducting circuit and the third conducting circuit, respectively; portions between the end and the other end of the second antenna conductor are completely covered by the first substrate and the second substrate, respectively; and

the third antenna conductor is disposed in the third through hole, two ends of the third antenna conductor are directly connected with the first conducting circuit and the second conducting circuit, respectively; portions between the two ends of the third antenna conductor are completely covered by the second substrate.

2 . The circuit board of claim 1 , wherein

the first substrate, the first conducting circuit, and the second conducting circuit are stacked on opposite surfaces of the first substrate to form a first circuit layer; and

the third conducting circuit is stacked on a surface of the second substrate facing the first substrate to form a second circuit layer.

3 . The circuit board of claim 1 , wherein the multiple through holes defines slots; the antenna conductors are disposed in the slots.

4 . The circuit board of claim 1 , wherein a material of the antenna conductor is copper.