Adapter card with compression attached memory modules

1 . An apparatus comprising:

a printed circuit board (PCB) having an edge to be received by a dual-inline memory module (DIMM) connector, the PCB including:

first conductive contacts to couple with contacts of the DIMM connector,

second conductive contacts on a first face of the PCB,

third conductive contacts on a second face of the PCB,

first conductive traces between the first conductive contacts and the second conductive contacts, and

second conductive traces between the first conductive contacts and the third conductive contacts;

a first compression attached memory module (CAMM) compressibly attached to the first face of the PCB via first compressible conductive contacts between the second conductive contacts on the first face of the PCB and third fourth conductive contacts of the first CAMM; and

a second CAM compressibly attached to the second face of the PCB via second compressible conductive contacts between the third conductive contacts on the second face of the PCB and fifth conductive contacts of the second CAMM.

2 . The apparatus of claim 1 , wherein:

the first compressible conductive contacts are included in a first compression mount technology (CMT) connector between the PCB and the first CAMM, and

the second compressible conductive contacts are included in a second CMT connector between the PCB and the second CAMM.

3 . The apparatus of claim 1 , wherein:

the first conductive traces couple the first conductive contacts having a first pin-out with corresponding contacts of the second conductive contacts having a second pin-out that is different than the first pin-out, and

the second conductive traces couple the first conductive contacts having the first pin-out with corresponding contacts of the third conductive contacts having the second pin-out that is different than the second pin-out.

4 . The apparatus of claim 3 , wherein:

the first conductive contacts include power, ground, and data contacts compatible with a first memory standard having the first pin-out;

the second and third conductive contacts include second power, ground, and data contacts compatible with a second memory standard having the second pin-out;

the first conductive traces couple the power, ground, and data contacts of the first conductive contacts with corresponding second power, ground, and data contacts of the second conductive contacts; and

the second conductive traces couple the power, ground, and data contacts of the first conductive contacts with corresponding third power, ground, and data contacts of the third conductive contacts.

5 . The apparatus of claim 1 , wherein:

the first conductive traces couple the first conductive contacts having a first pitch with corresponding contacts of the second conductive contacts having a second pitch that is smaller than the first pitch, and

the second conductive traces couple the first conductive contacts having the first pitch with corresponding contacts of the third conductive contacts having the second pitch that is smaller than the first pitch.

6 . The apparatus of claim 1 , wherein:

the DIMM connector is a double data rate synchronous dynamic random-access memory (DDR SDRAM) DIMM connector.

7 . The apparatus of claim 1 , further comprising:

a first fastener to compressibly attach the first CAMM to the PCB; and

a second fastener to compressible attach the second CAMM to the PCB.

8 . A system comprising:

a motherboard including a first dual-inline memory module (DIMM) connector; and

a printed circuit board (PCB) having an edge to be received by the DIMM connector, the PCB including:

first conductive contacts to couple with contacts of the DIMM connector,

second conductive contacts on a first face of the PCB, and

third conductive contacts on a second face of the PCB,

first conductive traces between the first conductive contacts and the second conductive contacts, and

second conductive traces between the first conductive contacts and the third conductive contacts;

a first compression attached memory module (CAMM) compressibly attached to the first face of the PCB via first compressible conductive contacts between the second conductive contacts on the first face of the PCB and third fourth conductive contacts of the first CAMM; and

a second CAM compressibly attached to the second face of the PCB via second compressible conductive contacts between the third conductive contacts on the second face of the PCB and fifth conductive contacts of the second CAMM.

9 . The system of claim 8 , further comprising:

a second DIMM connector on the motherboard; and

a second PCB having an edge to be received by the second DIMM connector;

wherein the second PCB also couples two CAMMs with the second DIMM connector.

10 . The system of claim 9 , wherein:

the distance between the first DIMM connector and the second DIMM connector is greater than the distance between the two CAMMs coupled with the first PCB or the second PCB.

11 . The system of claim 9 , wherein:

a single one of the first DIMM connector and the second DIMM connector corresponds to a memory channel.

12 . The system of claim 9 , wherein:

the two CAMMs coupled with a one of the first PCB or the second PCB are directly coupled with one another through the PCB.

13 . The system of claim 8 , wherein:

the first compressible conductive contacts are included in a first compression mount technology (CMT) connector between the PCB and the first CAMM, and

the second compressible conductive contacts are included in a second CMT connector between the PCB and the second CAMM.

14 . The system of claim 8 , wherein:

the first conductive traces couple the first conductive contacts having a first pin-out with corresponding contacts of the second conductive contacts having a second pin-out that is different than the first pin-out, and

the second conductive traces couple the first conductive contacts having the first pin-out with corresponding contacts of the third conductive contacts having the second pin-out that is different than the second pin-out.

15 . The system of claim 8 , wherein:

the first conductive traces couple the first conductive contacts having a first pitch with corresponding contacts of the second conductive contacts having a second pitch that is smaller than the first pitch, and

the second conductive traces couple the first conductive contacts having the first pitch with corresponding contacts of the third conductive contacts having the second pitch that is smaller than the first pitch.

16 . An apparatus comprising:

a printed circuit board (PCB) having an edge to be received by a dual-inline memory module (DIMM) connector;

first conductive contacts proximate to the edge of the PCB to be received by the DIMM connector, the first conductive contacts to couple with contacts of the DIMM connector;

second conductive contacts on a first face of the PCB to couple with a first compression attached memory module (CAMM) via a first compression mount technology (CMT) connector;

third conductive contacts on a second face of the PCB to couple with a second CAMM via a second CMT connector;

first conductive traces between the first conductive contacts and the second conductive contacts; and

second conductive traces between the first conductive contacts and the third conductive contacts.

17 . The apparatus of claim 16 , further comprising:

the first CMT connector; and

the first CAMM.

18 . The apparatus of claim 16 , wherein:

the first conductive traces couple the first conductive contacts having a first pin-out with corresponding contacts of the second conductive contacts having a second pin-out that is different than the first pin-out, and

the second conductive traces couple the first conductive contacts having the first pin-out with corresponding contacts of the third conductive contacts having the second pin-out that is different than the second pin-out.

19 . The apparatus of claim 18 , wherein:

the first conductive contacts include power, ground, and data contacts compatible with a first memory standard having the first pin-out;

the second and third conductive contacts include second power, ground, and data contacts compatible with a second memory standard having the second pin-out;

the first conductive traces couple the power, ground, and data contacts of the first conductive contacts with corresponding second power, ground, and data contacts of the second conductive contacts; and

the second conductive traces couple the power, ground, and data contacts of the first conductive contacts with corresponding third power, ground, and data contacts of the third conductive contacts.

20 . The system of claim 14 , wherein:

the first conductive contacts include power, ground, and data contacts compatible with a first memory standard having the first pin-out;

the second and third conductive contacts include second power, ground, and data contacts compatible with a second memory standard having the second pin-out;

the first conductive traces couple the power, ground, and data contacts of the first conductive contacts with corresponding second power, ground, and data contacts of the second conductive contacts; and

the second conductive traces couple the power, ground, and data contacts of the first conductive contacts with corresponding third power, ground, and data contacts of the third conductive contacts.