IP Library › Granted Patent US 12695225
Granted Patent B2
US 12695225 · App. 17/946,146 · Granted Jul 28, 2026

Memory module guidance and retention structure

Inventors: Nathan Lee Dunfee (Rochester, MN); Kevin O'Connell (Mantorville, MN); Christopher M. Marroquin (Rochester, MN); Stephen P. Mroz (Rochester, MN); Mark David Pfeifer (Owatonna, MN); Kenneth E. Lubahn (Oronoco, MN); Justin Christopher Rogers (Rochester, MN)
Assignee: International Business Machines Corporation
H01R12/721H01R12/727
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Quick Facts
Patent No.
US 12695225
App. No.
17/946,146
Granted
Jul 28, 2026
Kind
B2
Abstract

An apparatus for guidance and retention of integrated circuit boards includes a first structure configured to receive a first integrated circuit board and guide the first integrated circuit board for coupling to a substrate. The apparatus further includes a second structure configured to be removably coupled to the first structure. The second structure includes a first spring member configured to apply a first compressive force to the first integrated circuit board.

Claims (28)

1 . An apparatus for guidance and retention of integrated circuit boards comprising:

a first structure configured to receive a first integrated circuit board and guide the first integrated circuit board for coupling to a substrate; and

a second structure configured to be removably coupled to the first structure, the second structure including a first cantilevered spring member configured to apply a first compressive force to the first integrated circuit board.

2 . The apparatus of claim 1 , wherein the second structure is further configured to receive a second integrated circuit board, and wherein the second structure further includes a second cantilevered spring member configured to apply a second compressive force to the second integrated circuit board.

3 . The apparatus of claim 2 , wherein the first compressive force is the same as the second compressive force.

4 . The apparatus of claim 1 , wherein the first structure further includes at least one slot for guiding the first integrated circuit board for coupling to the substrate.

5 . The apparatus of claim 1 , wherein the first structure is further configured to be coupled to the substrate.

6 . The apparatus of claim 1 , wherein the first structure includes a guide portion configured to house the first integrated circuit board.

7 . The apparatus of claim 6 , wherein the second structure includes a cap portion configured to cover a portion of the guide portion, and wherein the second structure is configured to be fully decoupled from the first structure.

8 . The apparatus of claim 1 , wherein the first structure includes an engagement portion configured to engage the second structure.

9 . The apparatus of claim 8 , wherein the engagement portion comprises at least one engagement tab configured to engage an engagement slot of the second structure.

10 . A method for guidance and retention of integrated circuit boards comprising:

providing a first structure configured to receive a first integrated circuit board and guide the first integrated circuit board for coupling to a substrate; and

providing a second structure configured to be removably coupled to the first structure, the second structure including a first cantilevered spring member configured to apply a first compressive force to the first integrated circuit board.

11 . The method of claim 10 , further comprising:

coupling the first structure to the substrate.

12 . The method of claim 11 , further comprising:

inserting the first integrated circuit board into the first structure; and

coupling the second structure to the first structure,

wherein the second structure is configured to be fully decoupled from the first structure.

13 . The method of claim 10 , wherein the second structure is further configured to receive a second integrated circuit board, and wherein the second structure further includes a second cantilevered spring member configured to apply a second compressive force to the second integrated circuit board.

14 . The method of claim 13 , wherein the first compressive force is the same as the second compressive force.

15 . The method of claim 10 , wherein the first structure further includes at least one slot for guiding the first integrated circuit board for coupling to the substrate.

16 . The method of claim 10 , wherein the first structure is further configured to be coupled to the substrate.

17 . The method of claim 10 , wherein the first structure includes a guide portion configured to house the first integrated circuit board.

18 . The method of claim 17 , wherein the second structure includes a cap portion configured to cover a portion of the guide portion.

19 . The method of claim 10 , wherein the first structure includes an engagement portion configured to engage the second structure.

20 . The method of claim 19 , wherein the engagement portion comprises at least one engagement tab configured to engage an engagement slot of the second structure.