Electronic assembly having electrical connector connecting electronic components
An electronic assembly includes a first electronic component, a second electronic component, and an electrical connector connecting the first electronic component and the second electronic component. The electrical connector includes a first multilayer circuit board and a terminal that includes a plurality of signal terminals and a plurality of ground terminals. Each signal terminal is electrically connected to a signal interface of the first electronic component and a signal interface of the second electronic component. Signal terminals configured to transmit a same signal form one group of signal terminals, and at least one ground terminal is disposed between two adjacent groups of signal terminals. The first multilayer circuit board includes at least one layer of first ground copper sheet. The first electronic component includes a second multilayer circuit board, and the second multilayer circuit board includes at least one layer of second ground copper sheet.
1 . An electronic assembly comprising:
a first electronic component;
a second electronic component; and
an electrical connector connecting the first electronic component and the second electronic component, wherein
the electrical connector comprises:
a terminal; and
a first multilayer circuit board, wherein:
the terminal is fastened on the first multilayer circuit board;
the terminal comprises a plurality of signal terminals and a plurality of ground terminals, each signal terminal is electrically connected to a signal interface of the first electronic component and a signal interface of the second electronic component and is configured to transmit a signal, each signal terminal configured to transmit a same signal form one group of signal terminals, at least one ground terminal is disposed between two adjacent groups of signal terminals and around each group of signal terminals used to transmit a signal, the at least one ground terminals providing a shielding wall for the group of signal terminals surrounded by the shielding wall; and
the first multilayer circuit board comprises a layer formed by a first ground copper sheet; and
the first electronic component comprises a second multilayer circuit board that comprises a layer formed by a second ground copper sheet, and each ground terminal providing the shielding wall for the group of signal terminals surrounded by the shielding wall is electrically connected to the first ground copper sheet and to the second ground copper sheet and configured to shield interference signals from adjacent signal terminals.
2 . The electronic assembly according to claim 1 , wherein the second electronic component comprises a third multilayer circuit board, the third multilayer circuit board comprises a layer formed by a third ground copper sheet, and each ground terminal of the electrical connector is further electrically connected to the third ground copper sheet.
3 . The electronic assembly according to claim 1 , wherein the groups of signal terminals comprise groups of differential signal terminals, with each group of differential signal terminals having two signal terminals transmitting a differential signal, and at least one ground terminal is disposed between two adjacent groups of differential signal terminals.
4 . The electronic assembly according to claim 3 , wherein two ground terminals are disposed between two adjacent groups of differential signal terminals.
5 . The electronic assembly according to claim 1 , wherein a structure of the ground terminals is same as a structure of the signal terminals.
6 . The electronic assembly according to claim 1 , wherein every two adjacent ground terminals are electrically connected.
7 . The electronic assembly according to claim 1 , wherein a width of each ground terminal is greater than a width of each signal terminal.
8 . The electronic assembly according to claim 1 , wherein the first electronic component is a chip, and the second electronic component is a main board, and the electrical connector is a chip slot for connecting the chip to the main board.
9 . An electronic device comprising:
a power module;
an electronic assembly; and
a housing, wherein the power module and the electronic assembly are disposed on the housing, and the power module is electrically connected to the electronic assembly,
wherein the electronic assembly comprises:
a first electronic component;
a second electronic component; and
an electrical connector connecting the first electronic component and the second electronic component, wherein
the electrical connector comprises:
a terminal; and
a first multilayer circuit board, wherein:
the terminal is fastened on the first multilayer circuit board;
the terminal comprises a plurality of signal terminals and a plurality of ground terminals, each signal terminal is electrically connected to a signal interface of the first electronic component and a signal interface of the second electronic component and is configured to transmit a signal, each signal terminal configured to transmit a same signal form one group of signal terminals, at least one ground terminal is disposed between two adjacent groups of signal terminals and around each group of signal terminals used to transmit a signal, the at least one ground terminals providing a shielding wall for the group of signal terminals surrounded by the shielding wall; and
the first multilayer circuit board comprises a layer formed by a first ground copper sheet; and
the first electronic component comprises a second multilayer circuit board that comprises a layer formed by a second ground copper sheet, and
each ground terminal providing the shielding wall for the group of signal terminals surrounded by the shielding wall is electrically connected to the first ground copper sheet and to the second ground copper sheet and configured to shield interference signals from adjacent signal terminals.
10 . The electronic device according to claim 9 , wherein the second electronic component comprises a third multilayer circuit board, the third multilayer circuit board comprises a layer formed by a third ground copper sheet, and each ground terminal of the electrical connector is further electrically connected to the third ground copper sheet.
11 . The electronic device according to claim 9 , wherein the groups of signal terminals comprise groups of differential signal terminals, with each group of differential signal terminals having two signal terminals transmitting a differential signal, and at least one ground terminal is disposed between two adjacent groups of differential signal terminals.
12 . The electronic device according to claim 11 , wherein two ground terminals are disposed between two adjacent groups of differential signal terminals.
13 . The electronic device according to claim 9 , wherein a structure of the ground terminals is same as a structure of the signal terminals.
14 . The electronic device according to claim 9 , wherein every two adjacent ground terminals are electrically connected.
15 . The electronic device according to claim 9 , wherein a width of each ground terminal is greater than a width of each signal terminal.
16 . The electronic device according to claim 9 , wherein the first electronic component is a chip, and the second electronic component is a main board, and the electrical connector is a chip slot for connecting the chip to the main board.
17 . An electronic assembly comprising:
a first electronic component;
a second electronic component; and
an electrical connector connecting the first electronic component and the second electronic component, wherein
the electrical connector comprises:
a terminal; and
a first multilayer circuit board, wherein:
the terminal is fastened on the first multilayer circuit board;
the terminal comprises a plurality of signal terminals and a plurality of ground terminals, each signal terminal is electrically connected to a signal interface of the first electronic component and a signal interface of the second electronic component and is configured to transmit a signal, each signal terminal configured to transmit a same signal form one group of signal terminals, at least one ground terminal is disposed between two adjacent groups of signal terminals and around each group of signal terminals used to transmit a signal, and the first multilayer circuit board comprises a layer formed by a first ground copper sheet; and
the first electronic component comprises a second multilayer circuit board that comprises a layer formed by a second ground copper sheet;
each ground terminal is electrically connected to the first ground copper sheet and to the second ground copper sheet, wherein the first ground terminal, first ground copper sheet and second ground copper sheet form a shielding cage surrounding each signal terminal to shield interference signals from adjacent signal terminals; and
the second electronic component comprises a third multilayer circuit board, the third multilayer circuit board comprises a layer formed by a third ground copper sheet, and each ground terminal of the electrical connector is further electrically connected to the third ground copper sheet.
18 . The electronic assembly according to claim 17 , wherein the groups of signal terminals comprise groups of differential signal terminals, with each group of differential signal terminals having two signal terminals transmitting a differential signal, and at least one ground terminal is disposed between two adjacent groups of differential signal terminals.
19 . The electronic assembly according to claim 17 , wherein two ground terminals are disposed between two adjacent groups of differential signal terminals.
20 . The electronic assembly according to claim 17 , wherein a width of each ground terminal is greater than a width of each signal terminal.