Laser package structure
A package structure of a laser device is provided, including: a first light transmissive substrate including a first surface, a second surface opposing the first surface, a first side surface between the first surface and the second surface, and a second side surface opposing the first side surface; a laser structure including a first laser chip and a second laser chip which are disposed on the first surface, and the first laser chip including a third side surface; a first optical component disposing on the first light transmissive substrate and corresponding in position to the first laser chip; and a second optical component disposing on the light transmissive substrate and corresponding in position to the second laser chip; wherein the first side surface is coplanar with the third side surface.
1 . A package structure of a laser device, comprising:
a first light transmissive substrate comprising a first surface, a second surface opposing the first surface, a first side surface between the first surface and the second surface, and a second side surface opposing the first side surface;
a laser structure comprising a first laser chip and a second laser chip which are on the first surface, and the first laser chip comprising a third side surface;
a first optical component on the first light transmissive substrate and corresponding in position to the first laser chip; and
a second optical component on the light transmissive substrate and corresponding in position to the second laser chip; and
a first conductive post and a second conductive post respectively penetrating at least portions of the first laser chip and the second laser chip;
wherein the first laser chip comprises a lower surface away from the second surface, a first electrode and a second electrode on the lower surface.
2 . The laser package structure of claim 1 , wherein the first side surface is coplanar with the third side surface, and the second laser chip further comprises a fourth side surface coplanar with the second side surface.
3 . The laser package structure of claim 1 , further comprising a conductive layer between the laser structure and the first light transmissive substrate.
4 . The laser package structure of claim 1 , further comprising a conductive layer on the second surface of the first light transmissive substrate.
5 . The laser package structure of claim 1 , further comprising an adhesive layer between the first light transmissive substrate and the laser structure.
6 . The laser package structure of claim 5 , wherein the adhesive layer disposes between a conductive layer and the laser structure.
7 . The laser package structure of claim 5 , wherein the first conductive post and the second conductive post penetrate the adhesive layer.
8 . The laser package structure of claim 5 , wherein the adhesive layer disposes between the first light transmissive substrate and a conductive layer.
9 . The laser package structure of claim 1 , further comprising a common electrode on the first laser chip and the second laser chip.
10 . The laser package structure of claim 1 , wherein the first electrode or the second electrode connect to the first conductive post.
11 . The laser package structure of claim 1 , further comprising a support element surrounding the laser structure and the first light transmissive substrate.
12 . The laser package structure of claim 11 , wherein the support element further surrounds the first optical component and the second optical component.
13 . The laser package structure of claim 11 , further comprising a conductive layer on the support element.
14 . The laser package structure of claim 13 , further comprising a first conductive post and a second conductive post penetrating the support element, and wherein the conductive layer connects to the first conductive post and the second conductive post.
15 . The laser package structure of claim 13 , further comprising a second light transmissive substrate, and wherein the conductive layer disposes between the second light transmissive substrate and the support element.
16 . The laser package structure of claim 15 , wherein the second optical component comprises an optical component pattern portion and a light transmissive substrate portion disposed between the second light transmissive substrate and the optical component pattern portion.
17 . The laser package structure of claim 1 , further comprising a first distance between the first optical component and the first laser chip, and a second distance between the second optical component and the second laser chip, the second distance being different from the first distance.
18 . The laser package structure of claim 1 , further comprising a spacing layer between the first laser chip and the second laser chip.