IP Library Granted Patent US 12695470
Granted Patent B2
US 12695470 · App. 18/625,227 · Granted Jul 28, 2026

Radio frequency circuit and communication device

Inventors: Hiroki Shounai (Nagaokakyo, JP); Kenji Tahara (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H04B1/006H03F1/56H03F3/245H03F2200/171H03F2200/387H03F2200/451
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Quick Facts
Patent No.
US 12695470
App. No.
18/625,227
Granted
Jul 28, 2026
Kind
B2
Abstract

A radio frequency circuit includes power amplifiers, an input side coil and an output side coil, a filter whose pass band is a first band, a filter whose pass band is a second band, a filter whose pass band is a third band, a switch connected between ground and a path connecting one end portion of the output side coil and the filter, a switch connected between the ground and a path connecting the other end portion of the output side coil and the filter, a switch arranged in series in the path in between the switch and the filter, and a switch arranged in series in the path connecting the filter and a path connecting the switch and the switch, wherein no switch is arranged in series in the path.

Claims (71)

1 . A radio frequency circuit comprising:

a first amplifying element and a second amplifying element;

a transformer having an input side coil and an output side coil;

a first filter having a pass band that includes a first band;

a second filter having a pass band that includes a second band;

a third filter having a pass band that includes a third band;

a first switch connected between a first path and ground, the first path connecting one end portion of the output side coil and the first filter;

a second switch connected between a second path and the ground, the second path connecting another end portion of the output side coil and the third filter;

a third switch arranged in series in the first path in between the first switch and the first filter; and

a fourth switch arranged in series in a third path connecting a path and the second filter, the path being part of the first path and connecting the first switch and the third switch, wherein

no switch is arranged in series in the second path.

2 . The radio frequency circuit according to claim 1 , wherein

assuming a signal of the first band is transmitted, the second switch and the third switch are in an electrically continuous state, and the first switch and the fourth switch are in an electrically discontinuous state, and

assuming a signal of the second band is transmitted, the second switch and the fourth switch are in the electrically continuous state, and the first switch and the third switch are in the electrically discontinuous state.

3 . The radio frequency circuit according to claim 2 , wherein

assuming a signal of the third band is transmitted, the first switch is in the electrically continuous state, and the second switch, the third switch, and the fourth switch are in the electrically discontinuous state.

4 . The radio frequency circuit according to claim 3 , wherein

the pass band of the third filter is higher in frequency than the pass band of the first filter and the pass band of the second filter.

5 . The radio frequency circuit according to claim 4 , wherein

the pass band of the first filter partially overlaps the pass band of the second filter in frequency.

6 . The radio frequency circuit according to claim 5 , further comprising:

a Digital Tunable Capacitor (DTC) connected between the one end portion of the output side coil and a connecting point of the third switch and the fourth switch.

7 . The radio frequency circuit according to claim 6 , further comprising:

a module board having a first principal surface and a second principal surface, the first principal surface and the second principal surface facing one another, wherein

the first switch, the second switch, the third switch, and the fourth switch are included in a semiconductor IC,

the first amplifying element, the second amplifying element, the transformer, the first filter, the second filter, and the third filter are arranged on the first principal surface, and

the semiconductor IC is arranged on the second principal surface.

8 . The radio frequency circuit according to claim 7 , wherein

the semiconductor IC includes

a switch part in which the first switch, the second switch, the third switch, and the fourth switch are arranged, and

a control circuit part that controls the first amplifying element and the second amplifying element, and

assuming the module board is seen in planar view, at least one of the first filter and the second filter at least partially overlaps the switch part.

9 . The radio frequency circuit according to claim 8 , wherein

the first band is Band 66 for 4G-LTE or Band n66 for 5G-NR,

the second band is Band 3 for 4G-LTE or Band n3 for 5G-NR, and

the third band is Band 1 for 4G-LTE or Band n1 for 5G-NR.

10 . The radio frequency circuit according to claim 1 , wherein

assuming a signal of the third band is transmitted, the first switch is in the electrically continuous state, and the second switch, the third switch, and the fourth switch are in the electrically discontinuous state.

11 . The radio frequency circuit according to claim 10 , wherein

the pass band of the third filter is higher in frequency than the pass band of the first filter and the pass band of the second filter.

12 . The radio frequency circuit according to claim 11 , wherein

the pass band of the first filter partially overlaps the pass band of the second filter in frequency.

13 . The radio frequency circuit according to claim 12 , further comprising:

a Digital Tunable Capacitor (DTC) connected between the one end portion of the output side coil and a connecting point of the third switch and the fourth switch.

14 . The radio frequency circuit according to claim 13 , further comprising:

a module board having a first principal surface and a second principal surface, the first principal surface and the second principal surface facing one another, wherein

the first switch, the second switch, the third switch, and the fourth switch are included in a semiconductor IC,

the first amplifying element, the second amplifying element, the transformer, the first filter, the second filter, and the third filter are arranged on the first principal surface, and

the semiconductor IC is arranged on the second principal surface.

15 . The radio frequency circuit according to claim 14 , wherein

the semiconductor IC includes

a switch part in which the first switch, the second switch, the third switch, and the fourth switch are arranged, and

a control circuit part that controls the first amplifying element and the second amplifying element, and

assuming the module board is seen in planar view, at least one of the first filter and the second filter at least partially overlaps the switch part.

16 . The radio frequency circuit according to claim 15 , wherein

the first band is Band 66 for 4G-LTE or Band n66 for 5G-NR,

the second band is Band 3 for 4G-LTE or Band n3 for 5G-NR, and

the third band is Band 1 for 4G-LTE or Band n1 for 5G-NR.

17 . The radio frequency circuit according to claim 2 , wherein

the pass band of the third filter is higher in frequency than the pass band of the first filter and the pass band of the second filter.

18 . The radio frequency circuit according to claim 17 , wherein

the pass band of the first filter partially overlaps the pass band of the second filter in frequency.

19 . The radio frequency circuit according to claim 18 , further comprising:

a Digital Tunable Capacitor (DTC) connected between the one end portion of the output side coil and a connecting point of the third switch and the fourth switch;

a module board having a first principal surface and a second principal surface, the first principal surface and the second principal surface facing one another, wherein

the first switch, the second switch, the third switch, and the fourth switch are included in a semiconductor IC,

the first amplifying element, the second amplifying element, the transformer, the first filter, the second filter, and the third filter are arranged on the first principal surface, and

the semiconductor IC is arranged on the second principal surface.

20 . A communication device comprising:

a signal processing circuit that performs processing on a radio frequency signal; and

the radio frequency circuit according to claim 1 that transmits the radio frequency signal between the signal processing circuit and an antenna.