Composition and method for treating substrate

1 . A composition comprising:

at least one iodic acid compound selected from the group consisting of periodic acid, iodic acid, and salts thereof;

a chloride ion; and

a compound represented by Formula (1),

in Formula (1), R 1 to R 4 each independently represent an alkyl group which may have a substituent, R 1 to R 4 do not represent the same group all together, X n− represents a hydroxide ion, a chloride ion, or a fluoride ion, and n represents an integer of 1,

wherein a content of the compound represented by Formula (1) is 0.001% to 2.00% by mass with respect to the total mass of the composition, and

the compound represented by Formula (1) includes at least one compound selected from the group consisting of a diethyldimethylammonium salt, a methyltriethylammonium salt, a trimethyl(hydroxyethyl)ammonium salt, a methyltributylammonium salt, a dimethyldipropylammonium salt, a benzyltrimethylammonium salt, a benzyltriethylammonium salt, a triethyl(hydroxyethyl)ammonium salt, a methyltri(hydroxyethyl)ammonium salt, a benzyltrimethylammonium salt, a triethyl(hydroxyethyl)ammonium salt, a bishydroxyethyldimethylammonium salt, a trimethylpropylammonium salt, an isopropyltrimethylammonium salt, a butyltrimethylammonium salt, a triethylpropylammonium salt, an isopropyltriethylammonium salt, a butyltriethylammonium salt, a methyltripropylammonium salt, an ethyltripropylammonium salt, a butyltripropylammonium salt, an ethyltributylammonium salt, a propyltributylammonium salt, a diisopropyldimethylammonium salt, a dibutyldimethylammonium salt, a diethyldipropylammonium salt, a diethyldiisopropylammonium salt, a diethyldibutylammonium salt, an ethylmethylpropylbutylammonium salt, an ethylmethylisopropylbutylammonium salt, an ethylmethyldipropylammonium salt, an ethylmethyldiisopropylammonium salt, a dimethylbis(2-hydroxyethyl)ammonium salt, a methyltris(2-hydroxyethyl)ammonium salt, and an ethylmethyldibutylammonium salt.

2 . The composition according to claim 1 ,

wherein a content of the chloride ion is 1 ppt by mass to 1% by mass with respect to a total mass of the composition.

3 . The composition according to claim 2 ,

wherein a mass ratio of a content of the iodic acid compound to the content of the chloride ion is 1.0×10 4 or more.

4 . The composition according to claim 1 ,

wherein a mass ratio of a content of the iodic acid compound to the content of the chloride ion is 1.0×10 4 or more.

5 . The composition according to claim 1 ,

wherein a content of the iodic acid compound is 0.01% to 5.00% by mass with respect to a total mass of the composition.

6 . The composition according to claim 1 ,

wherein the number of carbon atoms in the alkyl group is 1 to 15.

7 . The composition according to claim 1 ,

wherein the total number of carbon atoms in R 1 to R 4 in Formula (1) is 4 to 15.

8 . The composition according to claim 1 ,

wherein the compound represented by Formula (1) includes at least one compound selected from the group consisting of a diethyldimethylammonium salt, a methyltriethylammonium salt, a trimethyl(hydroxyethyl)ammonium salt, a dimethylbis(2-hydroxyethyl)ammonium salt, a methyltris(2-hydroxyethyl)ammonium salt, a methyltributylammonium salt, a dimethyldipropylammonium salt, a benzyltrimethylammonium salt, a benzyltriethylammonium salt, and a triethyl(hydroxyethyl)ammonium salt.

9 . The composition according to claim 1 ,

wherein a pH of the composition is 3.0 to 9.0.

10 . The composition according to claim 1 ,

wherein a pH of the composition is 4.0 to 8.0.

11 . The composition according to claim 1 ,

wherein the composition is used for removing a ruthenium-containing substance on a substrate.

12 . The composition according to claim 1 ,

wherein the compound represented by Formula (1) includes at least one compound selected from the group consisting of a trimethyl(hydroxyethyl)ammonium salt, a dimethylbis(2-hydroxyethyl)ammonium salt, a methyltris(2-hydroxyethyl)ammonium salt, a methyltributylammonium salt, a dimethyldipropylammonium salt, a benzyltriethylammonium salt, and a triethyl(hydroxyethyl)ammonium salt.

13 . A method for treating a substrate, comprising:

a step A of removing a ruthenium-containing substance on a substrate by using the composition according to claim 1 .

14 . The method for treating a substrate according to claim 13 ,

wherein the step A is a step A1 of performing a recess etching treatment on a ruthenium-containing wiring line disposed on a substrate by using the composition, a step A2 of removing a ruthenium-containing film at an outer edge portion of a substrate, on which the ruthenium-containing film is disposed, by using the composition, a step A3 of removing a ruthenium-containing substance attached to a back surface of a substrate, on which a ruthenium-containing film is disposed, by using the composition, a step A4 of removing a ruthenium-containing substance on a substrate, which has undergone dry etching, by using the composition, or a step A5 of removing a ruthenium-containing substance on a substrate, which has undergone a chemical mechanical polishing treatment, by using the composition.