Camera module having an edge-disposed shielding plate and electronic device including the camera module

1 . A camera module comprising:

an image sensor;

a substrate electrically connected to the image sensor;

a bracket configured to fix the substrate; and

a plate disposed on the bracket and along at least a part of an edge of the substrate such that a height of a surface of the plate facing the image sensor covers a width of an area in which the image sensor is disposed when viewed from a side of the camera module, the plate shielding at least a part of a space in which the image sensor is disposed from the outside,

wherein the plate is disposed in a cut-out in the bracket.

2 . The camera module of claim 1 , wherein the bracket comprises a first bonding area bonded to the substrate, and a second bonding area spaced apart from the first bonding area, and

wherein the plate is disposed between the first bonding area and the second bonding area.

3 . The camera module of claim 2 , further comprising an IR filter disposed on the bracket.

4 . The camera module of claim 3 , wherein the image sensor is disposed in a space formed by the bracket, the IR filter, the plate, and the substrate.

5 . The camera module of claim 3 , comprising a first surface on which the IR filter is disposed, a second surface on which the substrate is disposed, and a lateral surface formed between the first surface and the second surface,

wherein the lateral surface comprises a first lateral surface forming the first bonding area, a second lateral surface forming the second bonding area at a position opposite to the first bonding area, and a third lateral surface formed by the plate.

6 . The camera module of claim 1 , wherein the substrate comprises at least one groove shape formed to be disposed between the plate and the substrate.

7 . The camera module of claim 6 , wherein the groove shape comprises a curved shape such that at least a partial area is away from the plate.

8 . The camera module of claim 7 , wherein the curved shape is formed at a position where one end of the plate is disposed.

9 . The camera module of claim 6 , comprising an adhesive applied to the groove shape such that the substrate is coupled to at least one of the bracket or the plate,

wherein the bracket is coupled to the substrate by the adhesive applied to the groove shape.

10 . The camera module of claim 1 , wherein the bracket is formed integrally with the plate by insert injection molding, and

wherein the plate comprises a steel use stainless (SUS) material.

11 . The camera module of claim 2 , wherein the second bonding area shields, by an adhesive, at least a part of a space in which the image sensor is disposed.

12 . A method for manufacturing a camera module, the method comprising:

producing a bracket supporting a plate disposed such that a height of a surface of the plate facing an image sensor covers a width of an area in which the image sensor is disposed when viewed from a side of the camera module, the plate shielding at least a part of a space of the camera module in which the image sensor is disposed from the outside;

first bonding in which the produced bracket and a substrate electrically connected to the image sensor are coupled to each other by an adhesive; and

second bonding in which the coupled plate and the substrate are coupled to each other and along at least a part of an edge of the substrate by applying an adhesive into a spacing gap therebetween,

wherein the plate is disposed in a cut-out in the bracket.

13 . The method of claim 12 , wherein the producing of the bracket comprises forming the bracket by injection molding a material forming the bracket in a state in which the plate is inserted into a mold.

14 . The method of claim 12 , wherein the first bonding comprises applying an adhesive to the first bonding area to which the bracket and the substrate are bonded, and the second bonding comprises applying an adhesive to the second bonding area spaced apart from the first bonding area.

15 . An electronic device comprising:

a housing configured to form an inner space;

at least one electronic component disposed in the inner space; and

a camera module disposed in the inner space,

wherein the camera module comprises:

an image sensor;

a substrate electrically connected to the image sensor;

a bracket configured to fix the substrate; and

a plate disposed on the bracket and along at least a part of an edge of the substrate such that a height of a surface of the plate facing the image sensor covers a width of an area in which the image sensor is disposed when viewed from a side of the camera module, the plate shielding at least a part of a space in which the image sensor is disposed from the outside,

wherein the plate is disposed in a cut-out in the bracket.

16 . The electronic device of claim 15 , wherein the bracket comprises a first bonding area bonded to the substrate, and a second bonding area spaced apart from the first bonding area, and

wherein the plate is disposed between the first bonding area and the second bonding area.

17 . The electronic device of claim 16 , further comprising an IR filter disposed on the bracket.

18 . The electronic device of claim 17 , wherein the image sensor is disposed in a space formed by the bracket, the IR filter, the plate, and the substrate.

19 . The electronic device of claim 17 , comprising a first surface on which the IR filter is disposed, a second surface on which the substrate is disposed, and a lateral surface formed between the first surface and the second surface,

wherein the lateral surface comprises a first lateral surface forming the first bonding area, a second lateral surface forming the second bonding area at a position opposite to the first bonding area, and a third lateral surface formed by the plate.