Semiconductor device package and acoustic device including the same
A wireless earphone comprises a battery, a speaker and a chamber/space. The battery has a first surface, a second surface opposite the first surface, and a third surface extended between the first surface and the second surface. The battery is disconnected from any protecting circuits. The speaker is disposed adjacent to the first surface of the battery. The chamber/space is defined by the battery and the speaker. The chamber/space is devoid of any electronic component.
1 . A wireless earphone, comprising:
a housing having a first surface extending downwardly from a first end of the wireless earphone to a bottom end of the housing and a second surface extending upwardly from the first end of the wireless earphone to a top end of the housing, wherein the housing has an antenna pattern formed on the top end;
a semiconductor device package disposed in a first space of the housing and having a substrate and a feed structure in contact with the antenna pattern;
a battery covered by the housing and arranged along a first axis of the wireless earphone, wherein the battery is disposed in a second space of the housing different from the first space, and wherein a surface of the substrate supporting the feed structure faces away from the battery; and
a speaker disposed in the second space of the housing, wherein the battery and the speaker are arranged along a second axis of the wireless earphone substantially perpendicular to the first axis,
wherein the first surface of the housing overlaps the second space but does not overlap the first space in a direction along the second axis, and
wherein when the first end of the wireless earphone is plugged into an ear canal, the semiconductor device package is disposed around a location between the ear canal and an ear helix.
2 . The wireless earphone of claim 1 , wherein the second surface of the housing overlaps the first space and the second space in a direction along the first axis.
3 . The wireless earphone of claim 1 , wherein the semiconductor device package and the battery are arranged along the first axis of the wireless earphone.
4 . The wireless earphone of claim 1 , wherein a first curvature of the first surface of the housing is different from a second curvature of the second surface of the housing.
5 . The wireless earphone of claim 1 , wherein the semiconductor device package is disposed in adjacent to a curved lateral surface of the battery.
6 . The wireless earphone of claim 1 , wherein a projection area of the speaker along the second axis lies entirely within a boundary of the battery.
7 . The wireless earphone of claim 1 , wherein the housing has a second end opposite to the first end, and a distance between the first end of the housing and the second end of the housing is equal to or less than approximately 20 millimeters (mm).
8 . The wireless earphone of claim 7 , wherein a diameter of the speaker is approximately 6 mm.
9 . A wireless earphone comprising;
a housing including a first end configured to be plugged into an ear canal and a second end opposite to the first end, wherein the second end of the housing has an antenna pattern, wherein the antenna pattern is integrated on the housing;
a battery disposed in the housing;
a semiconductor device package disposed in the housing and including a feed structure in contact with the antenna pattern; and
a flexible print circuit disposed along a curved lateral surface of the battery and positioned between the battery and the semiconductor device package.
10 . The wireless earphone of claim 9 , wherein the housing has a space defined by a surface of the housing extending downwardly from the first end of the housing, and wherein the wireless earphone further comprises:
a microphone disposed in the space of the housing and facing the second end of the housing.
11 . The wireless earphone of claim 9 , wherein the semiconductor device package includes:
a substrate supporting the feed structure;
an electronic component disposed over the substrate;
an encapsulant covering the electronic component and exposing the feed structure; and
a shielding layer is disposed on a surface of the encapsulant.
12 . A wireless earphone comprising;
a housing including an end configured to be plugged into an ear canal, and a space defined by a surface of the housing extending upwardly from the end of the housing;
a battery disposed in the space;
a semiconductor device package disposed in adjacent to a curved lateral surface of the battery and having a feed structure configured to feed a radio frequency (RF) signal to an antenna integrated on the housing; and
a sensing element disposed in the space and facing the surface of the housing, wherein the semiconductor device package is not present between the battery and the sensing element.
13 . The wireless earphone of claim 12 , wherein the sensing element is configured to determine a working mode of the wireless earphone when the wireless earphone is being worn or to determine a standby mode of the wireless earphone.
14 . The wireless earphone of claim 12 , wherein the sensing element comprises a proximity sensor.
15 . The wireless earphone of claim 12 , wherein the sensing element and the battery are arranged along a first axis of the wireless earphone, and wherein the sensing element and the end of the housing are not overlapped in a direction along the first axis of the wireless earphone.
16 . The wireless earphone of claim 15 , wherein the sensing element and the semiconductor device package are not overlapped along a second axis of the wireless earphone substantially perpendicular to the first axis of the wireless earphone.
17 . The wireless earphone of claim 15 , wherein the semiconductor device package is electrically connected to the sensing element through a flexible print circuit.
18 . The wireless earphone of claim 17 , wherein the flexible print circuit passes through the curved lateral surface of the battery.
19 . The wireless earphone of claim 17 , wherein the semiconductor device package includes:
a substrate;
a connector disposed over a first side of the substrate; and
an encapsulant covering a second side opposite to the first side of the substrate, wherein the connector is disposed farther form the sensing element with respect to the encapsulant, and wherein the connector is connected with the flexible print circuit.