Two phase shower immersion cooling system for data center: microstructure

1 . A heating surface, comprising:

a plurality of protrusions;

wherein an inter-protrusion gap and an interstitial space are formed between the plurality of protrusions;

wherein a coolant vapor is formed within the inter-protrusion gap, driven toward the interstitial space, and drifts out from the interstitial space;

wherein a first contact surface between the protrusions and a liquid coolant within the interstitial space is less than a second contact surface between the protrusions and the liquid coolant within the inter-protrusion gap; wherein the inter-protrusion gap or a serrated structure formed on the protrusions induces a capillary action interacting between the liquid coolant and the protrusions of the heating surface;

wherein an adhesion between the liquid coolant and the protrusions drives the liquid coolant toward a bottom of the protrusions;

wherein a cohesion of the liquid coolant drives the coolant vapor toward the interstitial space.

2 . The heating surface of claim 1 ,

wherein the plurality of protrusions is arranged as an array.

3 . The heating surface of claim 1 ,

wherein from a top view the plurality of protrusions has a convex shape.

4 . The heating surface of claim 1 ,

wherein a plurality of inter-protrusion gaps is formed between the plurality of protrusions;

wherein the plurality of inter-protrusion gaps forms an array.

5 . The heating surface of claim 1 ,

wherein a plurality of interstitial spaces is formed between the plurality of protrusions;

wherein the plurality of interstitial spaces forms an array.

6 . The heating surface of claim 1 ,

wherein the plurality of protrusions gradually tapers from bottom to top.

7 . The heating surface of claim 1 ,

wherein serrated grooves are formed on a top portion of a protrusion among the plurality of protrusions.

8 . The heating surface of claim 7 ,

wherein a bottom portion of the protrusion is bare.

9 . The heating surface of claim 1 ,

wherein a plurality of inter-protrusion gaps and a plurality of interstitial spaces are formed between the plurality of protrusions;

wherein the plurality of inter-protrusion gaps forms a first array;

wherein the plurality of interstitial spaces forms a second array;

wherein the first array and the second array are interwoven.

10 . The heating surface of claim 1 ,

wherein the heating surface is formed on a backside of a substrate of a semiconductor device.

11 . The heating surface of claim 1 ,

wherein the heating surface has a direct contact with a liquid coolant during a cooling operation;

wherein the heating surface is a surface through which a heat can be transferred from a heat generating component to the liquid coolant.

12 . The heating surface of claim 11 ,

wherein the heat generating component is disposed on a circuit board;

wherein the circuit board is vertically disposed within a coolant chamber of a cooling system.

13 . The heating surface of claim 12 ,

wherein the coolant chamber is disposed within a chassis in a server rack.

14 . A microstructure, formed on a surface of a heat generating component, the microstructure comprising:

a plurality of protrusions;

a plurality of gaps and a plurality of spaces formed between the plurality of protrusions on the microstructure;

wherein the plurality of gaps or a serrated structure formed on the protrusions is configured to draw a liquid coolant toward a bottom of the microstructure;

wherein the liquid coolant vaporizes vaporized as a coolant vapor around the bottom of the microstructure;

wherein the plurality of spaces is configured to release the coolant vapor away from the bottom of the microstructure;

wherein a first contact surface between the protrusions and the liquid coolant within the space is less than a second contact surface between the protrusions and the liquid coolant within the gap;

wherein the gap or the serrated structure formed on the protrusions induces a capillary action interacting between the liquid coolant and the protrusions of the microstructure;

wherein an adhesion between the liquid coolant and the protrusions drives the liquid coolant toward a bottom of the protrusions;

wherein a cohesion of the liquid coolant drives the coolant vapor toward the space.

15 . The microstructure of claim 14 ,

wherein a first capillary force corresponding to the plurality of gaps is stronger than a second capillary force corresponding to the plurality of spaces.

16 . The microstructure of claim 14 ,

wherein the plurality of gaps forms a first array;

wherein the plurality of spaces forms a second array;

wherein the first array and the second array are interwoven.

17 . The microstructure of claim 14 , comprising:

a plurality of channels;

wherein the coolant vapor forms within the plurality of gaps and travels towards the plurality of spaces through the plurality of channels.

18 . The microstructure of claim 14 ,

wherein the plurality of channels forms a first array;

wherein the plurality of spaces forms a second array;

wherein the first array and the second array are interwoven.

19 . A two-phase heat dissipation method, comprising:

forming a microstructure on a surface of a heat generating component, so as to draw a liquid coolant toward a bottom of the microstructure, causing the liquid coolant to vaporize as a coolant vapor around the bottom of the microstructure, and release the coolant vapor away from the bottom of the microstructure; and

forming a plurality of protrusions on the microstructure;

wherein a plurality of gaps and a plurality of spaces are between the plurality of protrusions;

wherein a first contact surface between the protrusions and the liquid coolant within the space is less than a second contact surface between the protrusions and the liquid coolant within the gap;

wherein the gap or a serrated structure formed on the protrusions induces a capillary action interacting between the liquid coolant and the protrusions of the microstructure;

wherein an adhesion between the liquid coolant and the protrusions drives the liquid coolant toward a bottom of the protrusions;

wherein a cohesion of the liquid coolant drives the coolant vapor toward the space.

20 . The two-phase heat dissipation method of claim 19 , further comprising:

forming the plurality of gaps and the plurality of spaces on the microstructure;

wherein the plurality of gaps is configured to draw the liquid coolant toward the bottom of the microstructure;

wherein the coolant vapor is released away from the bottom of the microstructure at the plurality of spaces.

21 . The two-phase heat dissipation method of claim 20 ,

wherein the plurality of gaps forms a first array;

wherein the plurality of spaces forms a second array;

wherein the first array and the second array are interwoven.

22 . The two-phase heat dissipation method of claim 20 , further comprising:

forming a plurality of channels on the microstructure;

wherein through the channels the coolant vapor is delivered to the plurality of spaces.

23 . The two-phase heat dissipation method of claim 22 ,

wherein the plurality of channels forms a first array;

wherein the plurality of spaces forms a second array;

wherein the first array and the second array are interwoven.

24 . The two-phase heat dissipation method of claim 20 , further comprising:

forming a plurality of protrusion on the microstructure; and

forming a first serrated structure on a top portion of a protrusion among the plurality of protrusions protrusion;

wherein the plurality of gaps and the plurality of spaces are between the plurality of protrusion.