Electrostatic discharge collector

1 . An electronic circuit printed on a substrate by roll-to-roll system having grounding brushes, the electronic circuit, comprising:

a plurality of traces; and

at least one electrostatic discharge (ESD) collector;

wherein the ESD collector envelops the plurality of traces, wherein the ESD collector is disposed on the substrate to enable electrical contact with the grounding brushes, and wherein traces of the ESD collector are substantially wider than the plurality of traces to provide larger contact surfaces for the grounded brushes.

2 . The electronic circuit of claim 1 , wherein the ESD collector and the plurality of traces are traces made of conductive material and wherein the substrate is made of dielectric material.

3 . The electronic circuit of claim 1 , wherein the electronic circuit is printed along and across a rolled substrate.

4 . The electronic circuit of claim 3 , wherein ESD collector envelops in the rolled substrate are electrically connected to one another.

5 . The electronic circuit of claim 1 , wherein the plurality of traces and the ESD collector are together printed to a substrate-roll using any one technique: deposition of conductive inks, and etching.

6 . A method of printing electronic circuits on a substrate of claim 1 , comprising:

forming patterns of the plurality of traces and an ESD-collector, wherein the forming results in traces of the ESD-collector pattern being substantially wider than the patterns for the plurality of traces;

attaching electronic components;

inlaying electronic-circuits; and

producing electronic-products.

7 . The method of claim 6 , wherein forming the patterns of the plurality of traces further comprises: sequential printing of a plurality of electronic circuits along and across a rolled substrate.

8 . The method of claim 7 , wherein printing the ESD collector and the plurality of traces is performed together using the same technique.

9 . The method of claim 6 , wherein attaching the electronic components is performed with any one technique: flip-chip bonding, wire bonding, and thermal compression.

10 . The method of claim 6 , wherein inlaying the electronic-circuits further comprises:

encapsulation and lamination used to protect the electronic-circuits from environmental physical damage.

11 . The method of claim 6 , wherein producing the electronic-products further comprises: converting an inlaid electronic-circuits into devices; and inlay and dicing each electronic-circuits in the roll into an electronic product.