Copper clad laminate and uses of the same
A copper clad laminate is provided. The copper clad laminate includes a dielectric layer; an adhesive layer, which is disposed on at least one side of the dielectric layer and formed of an adhesive material, wherein the adhesive material includes a non-perfluorinated resin; and a copper foil, wherein the copper foil has a first surface and is disposed on the other side of the adhesive layer opposite to the dielectric layer, and the copper foil is adhered to the adhesive layer with the first surface, wherein the first surface has a ten-point average roughness (Rz) of less than 0.5 μm, and the copper foil has a phosphorus content of no more than 499 μg/dm 2 at the first surface.
1 . A copper clad laminate, which comprises:
a dielectric layer;
an adhesive layer, which is disposed on at least one side of the dielectric layer and formed of an adhesive material, wherein the adhesive material comprises a non-perfluorinated resin; and
a copper foil, wherein the copper foil has a first surface and is disposed on the other side of the adhesive layer opposite to the dielectric layer, and wherein the copper foil is adhered to the adhesive layer with the first surface,
wherein the first surface has a ten-point average roughness (Rz) of less than 0.5 μm, and the copper foil is electroplated in such a way that the copper foil has a phosphorus content of no more than 499 μg/dm 2 at the first surface.
2 . The copper clad laminate of claim 1 , wherein the copper foil has a phosphorus content of no more than 199 μg/dm 2 at the first surface.
3 . The copper clad laminate of claim 1 , wherein the non-perfluorinated resin is selected from the group consisting of polychlorotrifluoroethylene, polyvinylidene difluoride, polyvinyl fluoride, an ethylene-tetrafluoroethylene copolymer, an ethylene-chloro-trifluoroethylene copolymer, and combinations thereof.
4 . The copper clad laminate of claim 1 , wherein the dielectric layer comprises a dielectric material formed from a resin composition.
5 . The copper clad laminate of claim 4 , wherein the resin composition comprises a thermosetting resin selected from the group consisting of an epoxy resin, a thermosetting phenolic resin with reactive functional groups, a thermosetting benzoxazine resin, a thermosetting polyphenylene ether resin, and combinations thereof.
6 . The copper clad laminate of claim 4 , wherein the resin composition further comprises a component selected from the group consisting of a catalyst, an elastomer, a filler, a dispersing agent, a toughener, a viscosity modifying agent, a flame retardant, a plasticizer, a coupling agent, and combinations thereof.
7 . The copper clad laminate of claim 4 , wherein the resin composition comprises a thermoplastic resin selected from the group consisting of a perfluorinated resin, a liquid crystal polymer, and a combination thereof.
8 . The copper clad laminate of claim 7 , wherein the perfluorinated resin is selected from the group consisting of polytetrafluoroethylene, polyfluoroalkoxy alkane, fluorinated ethylene propylene, and combinations thereof.
9 . A printed circuit board, which is prepared from the copper clad laminate of claim 1 .
10 . The copper clad laminate of claim 1 , wherein based on the total number of atoms in the repeating unit(s) of the non-perfluorinated resin, the number of fluorine atoms in the non-perfluorinated resin is no more than 60%.
11 . The copper clad laminate of claim 10 , wherein the non-perfluorinated resin is selected from the group consisting of polychlorotrifluoroethylene, polyvinylidene difluoride, polyvinyl fluoride, an ethylene-tetrafluoroethylene copolymer, an ethylene-chloro-trifluoroethylene copolymer, and combinations thereof.
12 . The copper clad laminate of claim 10 , wherein the dielectric layer comprises a dielectric material formed from a resin composition.
13 . The copper clad laminate of claim 12 , wherein the resin composition comprises a thermosetting resin selected from the group consisting of an epoxy resin, a thermosetting phenolic resin with reactive functional groups, a thermosetting benzoxazine resin, a thermosetting polyphenylene ether resin, and combinations thereof.
14 . The copper clad laminate of claim 12 , wherein the resin composition further comprises a component selected from the group consisting of a catalyst, an elastomer, a filler, a dispersing agent, a toughener, a viscosity modifying agent, a flame retardant, a plasticizer, a coupling agent, and combinations thereof.
15 . The copper clad laminate of claim 12 , wherein the resin composition comprises a thermoplastic resin selected from the group consisting of a perfluorinated resin, a liquid crystal polymer, and a combination thereof.
16 . The copper clad laminate of claim 15 , wherein the perfluorinated resin is selected from the group consisting of polytetrafluoroethylene, polyfluoroalkoxy alkane, fluorinated ethylene propylene, and combinations thereof.
17 . A printed circuit board, which is prepared from the copper clad laminate of claim 10 .