Circuit-forming method and circuit-forming apparatus

1 . A circuit-forming method comprising:

a first forming step of forming a resin layer on a pallet by a first discharge device configured to discharge a curable resin, the resin layer including a recessed portion;

a step of forming a base on the pallet by discharging the curable resin by the first discharge device, flattening a surface of the curable resin by a flattening device, and then curing the curable resin, the base formed on the pallet adjacent to a corner of the resin layer;

a step of forming a first mark by discharging the curable resin on the base by the first discharge device and curing the curable resin without flattening the surface of the curable resin by the flattening device; and

a second forming step of forming an electrode inside the recessed portion by a second discharge device, which is configured to discharge a conductive paste, by referring to the first mark formed by the first discharge device.

2 . The circuit-forming method according to claim 1 , further comprising:

a third forming step of forming a wiring by a third discharge device configured to discharge a conductive ink; and

a discharging step of discharging the conductive paste onto the wiring by the second discharge device by referring to a second mark formed by the third discharge device.

3 . The circuit-forming method according to claim 2 , further comprising:

a fourth forming step of forming a first one of the first mark and the second mark in a state of overlapping a second one of the first mark and the second mark.

4 . The circuit-forming method according to claim 3 , wherein

in the fourth forming step, one of the first mark and the second mark is formed in an annular shape.

5 . The circuit-forming method according to claim 1 , wherein a reflectance of the surface of the first mark is different from a reflectance of the surface of a second base.