Method for placing a chip for device manufacturing
In one aspect, in general, a method for placing a chip for device manufacturing comprises: picking up the chip with a component placement tool comprises a tool surface; spatially translating the component placement tool and the chip along a direction substantially perpendicular to a plane defined by a reference surface, the spatially translating comprising beginning the spatially translating at a first spatial coordinate with respect to the direction, and ending the spatially translating when contact between the reference surface and the tool surface is detected by a sensor at a second spatial coordinate with respect to the direction; and in response to detecting the contact, releasing the chip from the component placement tool and onto a portion of a device assembly in proximity to the second spatial coordinate with respect to the direction.
1 . A method for placing a chip for device manufacturing, the method comprising:
picking up the chip with a component placement tool comprising a tool surface;
spatially translating the component placement tool and the chip along a direction substantially perpendicular to a plane defined by a reference surface, the spatially translating comprising
beginning the spatially translating at a first spatial coordinate with respect to the direction, and
ending the spatially translating when contact between the reference surface and the tool surface is detected by a sensor at a second spatial coordinate with respect to the direction; and
in response to detecting the contact, releasing the chip from the component placement tool and onto a portion of a device assembly in proximity to the second spatial coordinate with respect to the direction;
wherein the portion of the device assembly onto which the chip is released comprises adhesive.
2 . The method of claim 1 , wherein the adhesive is thermally conductive and located on top of a temperature control module.
3 . The method of claim 1 , wherein the adhesive has a non-uniform thickness.
4 . The method of claim 1 , wherein the spatially translating further comprises spatially translating the component placement tool along a direction substantially parallel to the plane defined by the reference surface.
5 . The method of claim 1 , wherein the sensor detects contact between the reference surface and the tool surface by at least one of (1) detecting a change in mechanical force, (2) detecting a change in air pressure in a portion of the component placement tool, or (3) detecting a change in an electrical connection caused by the contact between the reference surface and the tool surface.
6 . The method of claim 5 , wherein the sensor detects contact between the reference surface and the tool surface by at least one of detecting a change in mechanical force, or detecting a change in air pressure in a portion of the component placement tool.
7 . The method of claim 5 , wherein the sensor detects contact between the reference surface and the tool surface by at least one of detecting a change in mechanical force, or detecting a change in an electrical connection caused by the contact between the reference surface and the tool surface.
8 . The method of claim 5 , wherein the sensor detects contact between the reference surface and the tool surface by at least one of detecting a change in air pressure in a portion of the component placement tool, or detecting a change in an electrical connection caused by the contact between the reference surface and the tool surface.
9 . The method of claim 5 , wherein the sensor detects contact between the reference surface and the tool surface by detecting a change in air pressure in a portion of the component placement tool.
10 . The method of claim 1 , wherein the chip comprises a plurality of electrical or optical connections.
11 . The method of claim 1 , wherein the component placement tool comprises a component manipulation portion and a detection portion that define respective planes that are substantially the same.
12 . The method of claim 1 , wherein the component placement tool comprises a component manipulation portion and a detection portion that define respective planes that are offset from one another along the direction substantially perpendicular to the plane defined by the reference surface.
13 . The method of claim 1 , wherein the component placement tool comprises a component manipulation portion configured to pick up the chip and to release the chip, and the component manipulation portion comprises at least one of (1) a negative pressure portion configured to secure the chip using suction, or (2) a gripping portion configured to secure the chip using mechanical contact.
14 . The method of claim 1 , wherein the reference surface is rigid.
15 . The method of claim 1 , wherein the component placement tool comprises a component manipulation portion configured to pick up the chip and to release the chip.
16 . The method of claim 1 , wherein the component placement tool comprises a detection portion that comprises the sensor.
17 . The method of claim 1 , wherein spatially translating the component placement tool comprises spatially translating the component placement tool over a travel distance that is estimated before the spatially translating begins.
18 . A method for placing a chip for device manufacturing, the method comprising:
picking up the chip with a component placement tool comprising a tool surface;
spatially translating the component placement tool and the chip along a direction substantially perpendicular to a plane defined by a reference surface, the spatially translating comprising
beginning the spatially translating at a first spatial coordinate with respect to the direction, and
ending the spatially translating when contact between the reference surface and the tool surface is detected by a sensor at a second spatial coordinate with respect to the direction; and
in response to detecting the contact, releasing the chip from the component placement tool and onto a portion of a device assembly in proximity to the second spatial coordinate with respect to the direction;
wherein the sensor detects contact between the reference surface and the tool surface by at least one of (1) detecting a change in mechanical force, (2) detecting a change in air pressure in a portion of the component placement tool, or (3) detecting a change in an electrical connection caused by the contact between the reference surface and the tool surface; and
wherein the sensor detects contact between the reference surface and the tool surface by detecting a change in mechanical force.
19 . A method for placing a chip for device manufacturing, the method comprising:
picking up the chip with a component placement tool comprising a tool surface;
spatially translating the component placement tool and the chip along a direction substantially perpendicular to a plane defined by a reference surface, the spatially translating comprising
beginning the spatially translating at a first spatial coordinate with respect to the direction, and
ending the spatially translating when contact between the reference surface and the tool surface is detected by a sensor at a second spatial coordinate with respect to the direction; and
in response to detecting the contact, releasing the chip from the component placement tool and onto a portion of a device assembly in proximity to the second spatial coordinate with respect to the direction;
wherein the sensor detects contact between the reference surface and the tool surface by at least one of (1) detecting a change in mechanical force, (2) detecting a change in air pressure in a portion of the component placement tool, or (3) detecting a change in an electrical connection caused by the contact between the reference surface and the tool surface; and
wherein the sensor detects contact between the reference surface and the tool surface by detecting a change in an electrical connection caused by the contact between the reference surface and the tool surface.