IP Library › Granted Patent US 12696399
Granted Patent B2
US 12696399 · App. 17/969,187 · Granted Jul 28, 2026

Reworking solder component without part removal

Inventors: Theron Lee Lewis (Rochester, MN); Timothy P. Younger (Rochester, MN); David J. Braun (St. Charles, MN); John R. Dangler (Rochester, MN)
Assignee: International Business Machines Corporation
H05K3/3494H05K3/3447H05K3/3452H05K3/3485H05K1/184
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Quick Facts
Patent No.
US 12696399
App. No.
17/969,187
Granted
Jul 28, 2026
Kind
B2
Abstract

A method for forming an electronic device that includes solder bonding pins from a component to plated through holes of a board, the component being positioned on a first side of the board; and applying solder paste to openings of the plated through holes on a second side of the board opposite the first side of the board that the component is positioned on. The method can further include drawing the solder paste to the pins to provide a reworked solder bond bonding at least one of the pins to the plated through hole.

Claims (37)

1 . A method for forming an electronic device comprising:

bonding pins from a component to plated through holes of a board, the component being positioned on a first side of the board;

applying solder paste to openings of the plated through holes on a second side of the board opposite the first side of the board that the component is positioned on; and

drawing the solder paste to the pins to provide a reworked solder bond bonding at least one of the pins to the plated through holes.

2 . The method of claim 1 , wherein the solder bonding of the pins from the component to the plated through holes of the board are bonded using intrusive solder bonding.

3 . The method of claim 1 , wherein an open pin that is not solder bonded to the plated through holes of the board results from the solder bonding of the pins from the component to the plated through holes of the board.

4 . The method of claim 3 , wherein the open pin is solder bonded by the drawing of the solder paste to the pins to provide the reworked solder bond.

5 . The method of claim 4 , wherein the drawings of the solder paste comprises reflow of the solder paste by heating the solder paste and gravitational force to pull the solder paste to the pins.

6 . The method of claim 1 , wherein the drawing of the solder paste comprises applying a vacuum.

7 . The method of claim 1 , wherein applying the solder paste comprises:

applying a stencil to the second side of the board, the stencil having openings corresponding to the plated through boles; and

forcing the solder paste through the openings of the stencil.

8 . The method of claim 7 , wherein the stencil comprises at least one of a metal plate, an adhesive tape or a combination thereof.

9 . A method for forming an electronic device comprising:

bonding pins from a component to plated through holes of a board, the component being positioned on a first side of the board;

applying solder paste to openings of the plated through holes on a second side of the board opposite the first side of the board that the component is positioned on;

melting the solder paste; and

drawing the solder paste using gravitational force to the pins to provide a reworked solder bond bonding at least one of the pins to the plated through holes.

10 . The method of claim 9 , wherein the solder bonding of the pins from the component to the plated through holes of the board are bonded using intrusive solder bonding.

11 . The method of claim 9 , wherein an open pin that is not solder bonded to the plated through holes of the board results from the solder bonding of the pins from the component to the plated through holes of the board.

12 . The method of claim 11 , wherein the open pin is solder bonded by the drawing of the solder paste to the pins to provide the reworked solder bond.

13 . The method of claim 9 , wherein applying the solder paste comprises:

applying a stencil to the second side of the board, the stencil having openings corresponding to the plated through holes; and

forcing the solder paste through the openings of the stencil.

14 . The method of claim 13 , wherein the stencil comprises at least one of a metal plate, an adhesive tape or a combination thereof.

15 . A method for forming an electronic device comprising:

bonding pins from a component to plated through holes of a board, the component being positioned on a first side of the board;

applying solder paste to openings of the plated through holes on a second side of the board opposite the first side of the board that the component is positioned on;

melting the solder paste; and

drawing the solder paste with a vacuum to the pins to provide a reworked solder bond bonding at least one of the pins to the plated through holes.

16 . The method of claim 15 , wherein the solder bonding of the pins from the component to the plated through holes of the board are bonded using intrusive solder bonding.

17 . The method of claim 15 , wherein an open pin that is not solder bonded to the plated through holes of the board results from the solder bonding of the pins from the component to the plated through holes of the board.

18 . The method of claim 15 , wherein the open pin is solder bonded by the drawing of the solder paste to the pins to provide the reworked solder bond.

19 . The method of claim 18 , wherein applying the solder paste comprises:

applying a stencil to the second side of the board, the stencil having openings corresponding to the plated through holes; and

forcing the solder paste through the openings of the stencil.

20 . The method of claim 19 , wherein the stencil comprises at least one of a metal plate, an adhesive tape or a combination thereof.