Electronic controller unit
The specification provides arrangements including an electronic controller unit, ECU, comprising a heatsink, a first printed circuit board, PCB; and a second printed circuit board, PCB. A plurality of components are provided located on said PCBs. The heatsink is arranged between the first and second PCBs and is thermally coupled to the components to provide cooling. The heatsink further comprises an aperture extending through a body of the heatsink. The first PCB is directly connected to the second PCB by a board-to-board, B2B, connector configured to electrically and/or communicatively connect the PCBs located above and below the heatsink. The specification also provides arrangements of a heatsink provided for use within an ECU.
1 . An electronic controller unit, ECU, comprising:
a heatsink including a cooling unit having a first upper and second lower cooling plate and a fluid channel arranged between the cooling plates and configured to receive a cooling fluid, wherein the cooling fluid is circulated through the channel in proximity to the cooling plates;
a first printed circuit board, PCB;
a second printed circuit board, PCB,
a third printed circuit board, PCB; and
a plurality of components located on the first, second, and third PCBs and facing respective first upper and second lower cooling plates of the cooling unit, wherein:
the heatsink is arranged between the first and second PCBs,
the heatsink is further arranged between the first PCB and the third PCB,
the heatsink is configured for thermally coupling to the plurality of components and is configured to provide a thermal coupling of the plurality of components facing toward a respective cooling plate to effect cooling of the plurality of components,
the first PCB is connected to the second PCB by a board-to-board connector that is configured to electrically and/or communicatively connect the PCBs located above and below the heatsink,
the upper and lower cooling plates each include a plurality of thermally conducting pedestals extending outwardly therefrom towards the PCBs and the plurality of components,
each pedestal is configured to provide a thermal coupling of at least one of the plurality of components to a respective cooling plate, for cooling, and
the heatsink provides a core and central component of the ECU and the ECU is arranged to provide a split-level or stacked PCB arrangement, while the heatsink provides cooling to the PCBs located on both sides thereof, allowing for an efficient use of the heatsink in a compact footprint.
2 . The ECU of claim 1 , wherein:
the heatsink further includes an aperture extending through a body of the heatsink,
the aperture defines a path for receiving the connector to provide a connection having a short path length between the PCBs located above and below the upper and lower cooling plates of the heatsink, and
the fluid channels are arranged internally within the body of the heatsink between the cooling plates and about the aperture.
3 . The ECU of claim 1 , wherein:
the first cooling plate defines an upper surface of the cooling unit and the second cooling plate defines a lower surface thereof, and a peripheral side wall which when coupled together with the first and second cooling plates forms a sealed cavity, and
the fluid channel is arranged in the cavity between the cooling plates and configured to receive a cooling fluid from an external cooling system.
4 . The ECU of claim 1 , wherein each of the PCBs, and the cooling unit, is located at a different level in the vertical direction (Z) within the ECU.
5 . The ECU of claim 1 , wherein:
each pedestal is of a pre-defined height (Z) and is arranged at a pre-defined location (X-Y) relative to the cooling plate, and
the location and height of each pedestal are selected taking account of the location of a component relative to the cooling plate and the distance between a heat transfer surface of the component and the cooling plate.
6 . The ECU of claim 1 , wherein the heatsink further includes supports for mechanically coupling at least one of the first, second, and third PCBs to the heatsink.
7 . The ECU of claim 1 , further comprising a housing defined by a housing of the heatsink when assembled together with a base plate, a top plate, and lateral end walls, to define a single unitary housing of the ECU.
8 . The ECU of claim 7 , wherein:
the top and base plates are configured for connection to the housing of the heatsink, and
the lateral end walls are connected externally to and longitudinally spaced apart from the lateral end walls of the housing of the heatsink.
9 . The ECU of claim 1 wherein:
the second and third PCBs are located on a same side of the heatsink,
the third PCB is spaced apart in a vertical direction (Z) from the second PCB, and
the third PCB is connected to the second PCB by a second board-to-board connector.
10 . The ECU of claim 1 , further comprising a connector system including connectors or headers located at first and second lateral ends of the ECU, for providing connections to and from the PCBs, wherein:
the connector system includes first and second lower rows of connectors located at each of the first and second lateral ends of the ECU, and
the lower rows of connectors are arranged to provide connections to the first PCB at each end of the PCB.
11 . A heatsink for an electronic control unit, ECU, the heatsink comprising:
a cooling unit including a first cooling plate defining an upper surface of the cooling unit and a second cooling plate defining a lower surface of the cooling unit, and a side wall which, when coupled together with the first and second cooling plates, forms a sealed cavity;
a fluid channel arranged within the sealed cavity between an inlet opening and an outlet opening and defining a path for the circulation of a cooling fluid through the cooling unit in proximity to the two cooling plates to provide a cooling effect at regions of the surfaces thereof, the cooling unit configured to receive the cooling fluid of a cooling system;
an input connector configured to couple the channel to an input line to receive the cooling fluid from the cooling system; and
an output connector configured to couple the channel to an output line to return the cooling fluid to the cooling system, wherein:
the cooling unit further includes an aperture that extends therethrough between the upper surface of the first cooling plate and the lower surface of the second cooling plate, and defining a path for receiving a connector,
the connector is configured to electrically and communicatively connect PCBs located above and below the heatsink, and
the first and second cooling plates include a plurality of thermally conducting pedestals configured to thermally couple electronic components located on the PCBs and facing the respective first and second cooling plates of the cooling unit to the heatsink respective cooling plate.
12 . The heatsink of claim 11 , wherein the pedestals are arranged to extend in directions substantially orthogonal to the upper or lower surfaces of the cooling unit for direct coupling to a heat transfer surface of a component of the electronic components to provide heat transfer from the component to the cooling plate and the cooling fluid.
13 . The heatsink of claim 11 , wherein the cooling plates further include coupling supports extending in directions substantially orthogonal to the upper and lower surfaces of the cooling unit and for coupling one or more PCBs to the heatsink.
14 . The ECU of claim 9 wherein:
the second and third PCBs each have a footprint, as defined by a width and length thereof in lateral and longitudinal directions, that is less than that of the first PCB, and
the third PCB is arranged to at least partially overlap the first PCB, the second PCB, and the heatsink.
15 . The ECU of claim 1 wherein:
the second and third PCBs each have a footprint, as defined by a width and length thereof in lateral and longitudinal directions, that is less than that of the first PCB, and
the third PCB is arranged to at least partially overlap the first PCB, the second PCB, and the heatsink.
16 . The ECU of claim 10 , wherein the connector system includes first and second upper rows of connectors located at each of the first and second lateral ends of the ECU, configured to provide connections to an upper PCB located adjacent thereto.
17 . The ECU of claim 1 , further comprising:
a connector system including connectors or headers located at first and second lateral ends of the ECU, for providing connections to and from the PCBs,
wherein the connector system includes first and second upper rows of connectors located at each of the first and second lateral ends of the ECU, configured to provide connections to an upper PCB located adjacent thereto.
18 . An electronic controller unit, ECU, comprising:
a heatsink including a cooling unit having a first upper and second lower cooling plate and a fluid channel arranged between the cooling plates and configured to receive a cooling fluid, wherein the cooling fluid is circulated through the channel in proximity to the cooling plates;
a first printed circuit board, PCB;
a second printed circuit board, PCB;
a plurality of components located on the first and second PCBs and facing respective first upper and second lower cooling plates of the cooling unit; and
a connector system including connectors or headers located at first and second lateral ends of the ECU, wherein:
the connectors or headers are configured to provide connections to and from the PCBs,
the connector system is arranged according to at least one of:
the connector system includes a first and second lower rows of connectors located at each of the first and second lateral ends of the ECU, the lower rows of connectors arranged to provide connections to the first PCB at each end of the PCB, or
the connector system includes first and second upper rows of connectors located at each of the first and second lateral ends of the ECU, configured to provide connections to an upper PCB located adjacent thereto,
the heatsink is arranged between the first and second PCBs,
the heatsink is configured for thermally coupling to the plurality of components, and is configured to provide a thermal coupling of the plurality of components facing toward a respective cooling plate to effect cooling of the plurality of components,
the first PCB is connected to the second PCB by a board-to-board connector that is configured to electrically and/or communicatively connect the PCBs located above and below the heatsink,
the upper and lower cooling plates each include a plurality of thermally conducting pedestals extending outwardly therefrom towards the PCBs and the plurality of components,
each pedestal is configured to provide a thermal coupling of at least one of the plurality of components to a respective cooling plate, for cooling, and
the heatsink provides a core and central component of the ECU and the ECU is arranged to provide a split-level or stacked PCB arrangement, while the heatsink provides cooling to the PCBs located on both sides thereof, allowing for an efficient use of the heatsink in a compact footprint.