Unitary heatsink for multi-socket computing systems

Inventors: William Mark Megarity (Renton, WA); Chetan Sanjay Agarwal (Surrey, CA); Ali Elashri (Issaquah, WA); Sibi Mathew (Bothell, WA); Virginia Dunn (Seattle, WA); Darin Lee Frink (Lake Tapps, WA)

Assignee: Amazon Technologies, Inc.

H05K7/20509 H05K7/20418

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Quick Facts

Patent No.: US 12696426
App. No.: 18/519,934
Granted: Jul 28, 2026
Kind: B1

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Abstract

An apparatus of a computing component system can include a heatsink. A first heat transfer device may extend outward from the heatsink to facilitate receipt of heat from a first socket zone, and a second heat transfer device may extend outward from the heatsink to facilitate receipt of heat from a second socket zone. For example, the first socket zone and the second socket zone may each include a processor or other heat-generating component coupled with a plate that may in turn be coupled with the heat transfer device to enable heat transfer to the heatsink so that the heatsink dissipates heat from both socket zones.

Claims (36)

1 . An apparatus, comprising:

a first plate sized and arranged for installation in a first socket zone of a circuit board;

a first heat transfer device arranged for transferring heat away from the first socket zone;

a second plate sized and arranged for installation in a second socket zone of the circuit board;

a second heat transfer device arranged for transferring heat away from the second socket zone; and

a heatsink arranged to receive and dissipate heat from the first heat transfer device and the second heat transfer device and configured for installation in a remote zone remote from the first socket zone and the second socket zone, wherein the heatsink is subdivided into a first region and a second region distinct from one another, wherein the first heat transfer device extends outward from the first region and also extends internally through the first region into the second region, and wherein the second heat transfer device extends outward from the second region and also extends internally through the second region into the first region.

2 . The apparatus of claim 1 , wherein the first plate and the second plate are both arranged spaced from a same side of the heatsink.

3 . The apparatus of claim 1 , wherein the first plate is arranged between the heatsink and the second plate.

4 . The apparatus of claim 1 , wherein the heatsink is positioned between the first plate and the second plate.

5 . The apparatus of claim 1 , wherein the first socket zone is configured for receiving a first heat-generating component; and

wherein the second socket zone is configured for receiving a second heat-generating component.

6 . The apparatus of claim 5 , further comprising the first heat-generating component and the second heat-generating component.

7 . The apparatus of claim 6 , wherein at least one of the first heat-generating component or the second heat-generating component comprises a processor, an input/output chip, a baseboard management controller, a chip, a die, a card, a voltage regulator, a hotswap controller, an inductor, a resister, or a capacitor.

8 . The apparatus of claim 6 , wherein the first heat-generating component comprises a first processor and the second heat-generating component comprises a second processor;

wherein the apparatus is included in a computing component system that further comprises a chassis and the circuit board, the circuit board mounted in the chassis and defining the first socket zone and the second socket zone;

wherein the first heat transfer device comprises a first heat pipe set extending from the first plate and arranged for transferring heat away from the first socket zone; and

wherein the second heat transfer device comprises a second heat pipe set extending from the second plate and arranged for transferring heat away from the second socket zone.

9 . An apparatus, comprising:

a heatsink;

a first heat transfer device extending outward from the heatsink to facilitate receipt of heat from a first socket zone on a circuit board; and

a second heat transfer device extending outward from the heatsink to facilitate receipt of heat from a second socket zone on the circuit board,

wherein the heatsink is subdivided into a first region and a second region distinct from one another, wherein the first heat transfer device extends outward from the first region and also extends internally through the first region into the second region, and wherein the second heat transfer device extends outward from the second region and also extends internally through the second region into the first region.

10 . The apparatus of claim 9 , wherein the first heat transfer device comprises a heat pipe, a thermosyphon, or a thermal electric cooler.

11 . The apparatus of claim 9 , wherein the first heat transfer device and the second heat transfer device each extend from a same side of the heatsink.

12 . The apparatus of claim 9 , wherein the second heat transfer device is arranged extending at least partially above the first heat transfer device.

13 . The apparatus of claim 9 , wherein the first heat transfer device and the second heat transfer device each extend from opposite sides of the heatsink.

14 . The apparatus of claim 9 , further comprising:

the circuit board;

a first plate arranged for installation in the first socket zone of the circuit board and coupled with the first heat transfer device to facilitate transfer of heat away from the first socket zone via the first heat transfer device; and

a second plate arranged for installation in the second socket zone of the circuit board and coupled with the second heat transfer device to facilitate transfer of heat away from the second socket zone via the second heat transfer device, wherein the heatsink is arranged to receive and dissipate heat from the first heat transfer device and the second heat transfer device and is configured for installation in a remote zone of the circuit board remote from the first socket zone and the second socket zone.

15 . The apparatus of claim 14 , wherein the first socket zone is configured for receiving a first heat-generating component;

wherein the second socket zone is configured for receiving a second heat-generating component;

wherein the first heat-generating component comprises a first processor and the second heat-generating component comprises a second processor;

wherein the first heat transfer device comprises a first heat pipe set extending from the first plate and arranged for transferring heat away from the first socket zone; and

wherein the second heat transfer device comprises a second heat pipe set extending from the second plate and arranged for transferring heat away from the second socket zone.