Liquid cooling device and server

1 . A liquid cooling device, comprising:

at least two motherboards that are stacked, and each of the motherboards being provided with at least two heat generating elements;

a plurality of liquid cooling plates attached to each of the heat generating elements are in a one-to-one correspondence,

a plurality of liquid cooling loops including the liquid cooling plates, the plurality of liquid cooling loops are connected in parallel; and

a liquid distributor, the liquid distributor configured to supply and return coolant from each of the liquid cooling loops,

wherein each of the liquid cooling loops having one of the liquid cooling plates corresponding to one of the motherboards connected to another of the liquid cooling plates corresponding to another of the motherboards in series to form a respective one of a plurality of liquid cooling loops, and

wherein a gap is formed between the one motherboard and the another motherboard, the heat generating elements and the attached liquid cooling plates of the one of the motherboards are provided in the gap, and the heat generating elements and the attached liquid cooling plates of the another of the motherboards are provided outside of the gap.

2 . The liquid cooling device according to claim 1 , wherein the plurality of liquid cooling plates comprises a first liquid cooling plate, a second liquid cooling plate, a third liquid cooling plate, and a fourth liquid cooling plate, the first liquid cooling plate and the second liquid cooling plate are respectively attached to two corresponding ones of the heat generating elements located on the one of the motherboards, the third liquid cooling plate and the fourth liquid cooling plate are respectively attached to two corresponding ones of the heat generating elements located on the another of the motherboards, the first liquid cooling plate and the third liquid cooling plate are connected in series to form a first liquid cooling loop of the liquid cooling loops, the second liquid cooling plate and the fourth liquid cooling plate are connected in series to form a second liquid cooling loop of the liquid cooling loops, and the first liquid cooling loop and the second liquid cooling loop are connected in parallel.

3 . The liquid cooling device according to claim 1 , further comprising a plurality of series pipes and a plurality of branch pipes, wherein each of the liquid cooling plates is provided with a water inlet and a water outlet, in two of the liquid cooling plates forming each of the liquid cooling loops, the water inlet of one of the liquid cooling plates is in communication with the water outlet of another of the liquid cooling plates through one of the series pipes, and the water inlet of the one of the liquid cooling plates and the water outlet of the another of the liquid cooling plates are in communication with two of the branch pipes, respectively.

4 . The liquid cooling device according to claim 3 , further comprising a plurality of first connecting joints in communication with the water outlets, the water inlets, the series pipes, and the branch pipes.

5 . The liquid cooling device according to claim 4 , wherein each of the first connecting joints comprises a first connecting portion, a first fixing portion, and a first pagoda portion that are sequentially connected, the first connecting portion is in communication with a corresponding one of the water outlet or a corresponding one of the water inlet, an outer periphery of the first pagoda portion is provided with at least two conical protrusion structures, the first pagoda portion is in communication with a corresponding one of the series pipes or a corresponding one of the branch pipes, and the first fixing portion is threadedly connected to a nut, so as to fix the first pagoda portion to the corresponding one of the series pipes or the corresponding one of the branch pipes.

6 . The liquid cooling device according to claim 3 , wherein each of the motherboards has a first side and a second side, the two of the liquid cooling plates in one of the liquid cooling loops comprises a first liquid cooling plate and a third liquid cooling plate, the at least two motherboards comprises a first motherboard corresponding to the first liquid cooling plate and a second motherboard corresponding to the third liquid cooling plate, the third liquid cooling plate is provided in the gap, one end of the corresponding one of the series pipes is connected the third liquid cooling plate, another end of the corresponding one of the series pipes bypasses the first motherboard from the first side and is connected to the third liquid cooling plate, an end of a first one of the branch pipes connected to the first liquid cooling plate, which is away from the first liquid cooling plate, bypasses the first motherboard from the first side and extends through the gap to the second side, and an end of a second one of the branch pipes connected to the third liquid cooling plate, which is away from the third liquid cooling plate, extends through the gap to the second side.

7 . The liquid cooling device according to claim 3 , further comprising a liquid supply pipe and a liquid return pipe, wherein the two of the branch pipes of each of the liquid cooling loops are in communication with the liquid distributor, and the liquid distributor is provided with a liquid entering port in communication with the liquid supply pipe and a liquid return port in communication with the liquid return pipe.

8 . The liquid cooling device according to claim 7 , wherein the liquid distributor is provided with a plurality of liquid outlets and a plurality of liquid inlets, each of the plurality of liquid outlets is in communication with one of the two of the branch pipes that is in communication with the water inlet of the another of the liquid cooling plates in the respective one of the plurality of liquid cooling loops with one of the liquid outlets for each of the one of the two of the branch pipes, and each of the plurality of liquid inlets is in communication with another of the two of the branch pipes that is in communication with the water outlet of the one of the liquid cooling plates in the respective one of the plurality of liquid cooling loops with one of the liquid inlets for each of the another of the two of the branch pipes.

9 . The liquid cooling device according to claim 8 , further comprising a plurality of second connecting joints located at the plurality of liquid outlets and the plurality of liquid inlets, respectively, wherein each of the second connecting joints comprises a second connecting portion, a second fixing portion, and a second pagoda portion that are sequentially connected, the liquid outlets and the liquid inlets are each in communication with a corresponding one of the second connecting portions, an outer periphery of the second pagoda portion is provided with at least two conical protrusion structures, the second pagoda portion is in communication with a corresponding one of the branch pipes, and the second fixing portion is configured to be threadedly connected to a nut, so as to fix the second pagoda portion to the corresponding one of branch pipes.

10 . The liquid cooling device according to claim 9 , wherein an end of the liquid supply pipe away from the liquid distributor is provided with a first quick-connecting male joint configured to be in communication with a first quick-connecting female joint of a liquid cooling distribution assembly, an end of the liquid return pipe away from the liquid distributor is provided with a second quick-connecting male joint configured to be in communication with a second quick-connecting female joint of the liquid cooling distribution assembly.

11 . The liquid cooling device according to claim 1 , further comprising a plurality of fixing members configured to fix the liquid cooling plates to a corresponding one of the motherboards.

12 . A server, comprising the liquid cooling device according to claim 1 .