Liquid cooling device and server

1 . A liquid cooling device, comprising:

at least two motherboards that are stacked, and each of the motherboards being provided with at least two heat generating elements; and

a plurality of liquid cooling plates attached to each of the heat generating elements are in a one-to-one correspondence, wherein two of the liquid cooling plates corresponding to two of the heat generating elements on a same one of the motherboards are connected in series to form a respective one of a plurality of liquid cooling loops, and the plurality of liquid cooling loops are connected in parallel; and

a liquid distributor comprises a first liquid outlet, a second liquid outlet, a first liquid inlet, a second liquid inlet, a first quick-connecting male joint located at the first liquid outlet, a second quick-connecting male joint located at the first liquid inlet, and a plurality of second connecting joints located at the second liquid outlet and the second liquid inlet, respectively, each of the second connecting joints having a second pagoda portion,

wherein the first liquid cooling loop is provided with a first quick-connecting female joint and a second quick-connecting female joint, the first quick-connecting female joint is in communication with the first quick-connecting male joint, the second quick-connecting female joint is in communication with the second quick-connecting male joint, and each second pagoda portion of the second connecting joints are in communication with the second liquid cooling loop.

2 . The liquid cooling device according to claim 1 , further comprising at least two series pipes and a plurality of branch pipes, wherein each of the liquid cooling plates is provided with a water inlet and a water outlet, the water inlet of one of the liquid cooling plates is in communication with the water outlet of another of the liquid cooling plates through one of the at least two series pipes, and the water inlet of the one liquid cooling plate and the water outlet of the another of the liquid cooling plates are both in communication with two of the branch pipes, respectively.

3 . The liquid cooling device according to claim 2 , further comprising a plurality of first connecting joints in communication with the water outlets, the water inlets, the series pipes, and the branch pipes.

4 . The liquid cooling device according to claim 3 , wherein each of the first connecting joints comprises a first connecting portion, a first fixing portion, and a first pagoda portion that are sequentially connected, the first connecting portion is in communication with a corresponding one of the water outlet or a corresponding one of the water inlet, an outer periphery of the first pagoda portion is provided with at least two conical protrusion structures, the first pagoda portion is in communication with a corresponding one of the series pipes or a corresponding one of the branch pipes, and the first fixing portion is threadedly connected to a nut, so as to fix the first pagoda portion to the corresponding one of the series pipes or the corresponding one of the branch pipes.

5 . The liquid cooling device according to claim 2 , wherein the plurality of liquid cooling plates comprises a first liquid cooling plate, a second liquid cooling plate, a third liquid cooling plate, and a fourth liquid cooling plate, the first liquid cooling plate and the second liquid cooling plate are respectively attached to two corresponding ones of the heat generating elements located on one of the motherboards, the third liquid cooling plate and the fourth liquid cooling plate are respectively attached to two corresponding ones of the heat generating elements located on another of the at least two motherboards, the first liquid cooling plate and the second liquid cooling plate are connected in series to form a first liquid cooling loop of the liquid cooling loops, the third liquid cooling plate and the fourth liquid cooling plate are connected in series to form a second liquid cooling loop of the liquid cooling loops, and the first liquid cooling loop and the second liquid cooling loop are connected in parallel.

6 . The liquid cooling device according to claim 5 , further comprising a liquid supply pipe and a liquid return pipe, wherein the two of the branch pipes of the first liquid cooling loop and the two of the branch pipes of the second liquid cooling loop are in communication with the liquid distributor, and the liquid distributor is provided with a liquid entering port in communication with the liquid supply pipe and a liquid return port in communication with the liquid return pipe.

7 . The liquid cooling device according to claim 6 , wherein one of the two of the branch pipes in the first liquid cooling loop in communication with the water inlet of the another of the liquid cooling plates is provided with the first quick-connecting female joint, another of the two of the branch pipes in the first liquid cooling loop in communication with the water outlet of the one of the liquid cooling plates is provided with the second quick-connecting female joint, the plurality of second connecting joints located at the second liquid outlet and the second liquid inlet, respectively, and two of the second connecting joints are in communication with the two of the branch pipes in the second liquid cooling loop are in a one-to-one correspondence.

8 . The liquid cooling device according to claim 7 , wherein each of the second connecting joints comprises a second connecting portion, a second fixing portion, and the second pagoda portion that are sequentially connected, an outer periphery of the second pagoda portion is provided with at least two conical protrusion structures, the second pagoda portion is in communication with the one or the another of the two corresponding ones of the branch pipes in the second liquid cooling loop, and the second fixing portion is threadedly connected to a nut, so as to fix the second pagoda portion to the one or the another of the two corresponding ones of the branch pipes in the second liquid cooling loop.

9 . The liquid cooling device according to claim 6 , wherein an end of the liquid supply pipe away from the liquid distributor is provided with a third quick-connecting male joint, an end of the liquid return pipe away from the liquid distributor is provided with a fourth quick-connecting male joint.

10 . The liquid cooling device according to claim 1 , further comprising a plurality of fixing members configured to fix the liquid cooling plates to a corresponding one of the motherboards.

11 . A server, comprising the liquid cooling device according to claim 1 .

12 . The server according to claim 11 , further comprising a housing assembly provided with a cavity, wherein the liquid cooling device is received in the cavity, and the at least two motherboards are connected to the housing assembly.