IP Library › Granted Patent US 12696430

Granted Patent B2

US 12696430 · App. 18/364,330 · Granted Jul 28, 2026

Sealing method for direct liquid cooled power electronics package

Inventors: Roveendra Paul (Dublin, CA); Hyungsoo Kim (Yongin-si, KR)

Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

H05K7/20927

View Patent ↗

Loading inventors, assignments & file history…

Monitor This Case

Get email alerts when status or documents change.

Order Certified Copies

Most orders are placed with the USPTO same day — all within 24 business hours.

Order via The Patent Place →

Pre-filled with this patent's details

Quick Facts

Patent No.: US 12696430
App. No.: 18/364,330
Granted: Jul 28, 2026
Kind: B2

External Links

USPTO Patent Center↗ Full Patent PDF↗

Abstract

A package includes a power electronics module disposed between a first bracket and a second bracket with the power electronics module covering openings in the first bracket and the second bracket. Leak-proof joints are formed between surfaces of the power electronics module and the first bracket and the second bracket. A first cover beam is disposed on, and joined to, the first bracket to enclose a first cooling fluid channel for cooling fluid flow over the power electronics module. A second cover beam is disposed on, and joined to, the second bracket to enclose a second cooling fluid channel for cooling fluid flow over the power electronics module. The package includes end connectors that have input and output ports for cooling fluid flow through the first cooling fluid channel and the second cooling fluid channel.

Claims (51)

1 . A method, comprising:

welding a surface of a power electronics module to a first bracket around a perimeter of an opening in the first bracket to form a leak-proof joint between the power electronics module and the first bracket;

welding a surface of an opposite second side of the power electronics module to a second bracket along a perimeter of a second opening in the second bracket to form a leak-proof joint between the power electronics module and the second bracket;

welding a first cover beam and the first bracket together along a length of the first bracket, the first cover beam and the first bracket forming first enclosure for a first cooling fluid channel configured to direct cooling fluid over the power electronics module;

welding a second cover beam and the second bracket together along a length of the second bracket, the second cover beam and the second bracket forming a second enclosure for a second cooling fluid channel configured to direct the cooling fluid over the power electronics module;

attaching a first end connector to a first end of the first enclosure and the second enclosure, the first end connector including an input port; and

attaching a second end connector to a second end of the first enclosure and the second enclosure opposite the first end, the second end connector including an output port, wherein the input port and the output port are axially aligned in a direction corresponding to the length of the bracket.

2 . The method of claim 1 , wherein the cover beam is a U-channel beam or a C-channel beam.

3 . The method of claim 1 , wherein the power electronics module includes a plurality of fins extending through the opening in the first bracket.

4 . A method, comprising:

welding a surface of a first side of a power electronics module to a first bracket along a perimeter of a first opening in the first bracket to form a leak-proof joint between the power electronics module and the first bracket;

welding a first cover beam to the first bracket, the first cover beam and the first bracket forming a first enclosure for a first cooling fluid channel configured to direct cooling fluid over the first side of the power electronics module;

welding a second cover beam to the second bracket, the second cover beam and the second bracket forming a second enclosure for a second cooling fluid channel configured to direct the cooling fluid over the second side of the power electronics module;

attaching a first end connector to the first enclosure and the second enclosure, the first end connector including a first channel connector, a second channel connector, and an inlet port, such that the first channel connector is attached to a first end of the first enclosure, and the second channel connector is attached to a first end of the second enclosure; and

attaching a second end connector to the first enclosure and the second enclosure, the second end connector including a third channel connector, a fourth channel connector, and an outlet port, such that the third channel connector is attached to a second end of the first enclosure, and the fourth channel connector is attached to a second end of the second enclosure.

5 . The method of claim 4 , wherein the first cover beam and the second cover beam are U-channel beams or C-channel beams.

6 . The method of claim 4 , wherein the power electronics module includes a plurality of fins extending through the first opening in the first bracket.

7 . The method of claim 4 , wherein attaching the first end connector and the second end connector to the first enclosure and the second enclosure includes attaching the first end connector and the second end connector using adhesive sealants or by welding.

8 . The method of claim 4 , wherein the power electronics module is welded to a first side of the first bracket and the first cover beam is disposed over an opposite second side of the first bracket; and

wherein the power electronics module is welded to a first side of the second bracket and the second cover beam is disposed over an opposite second side of the second bracket.

9 . The method of claim 4 , wherein the first channel connector protrudes from a surface of the first end connector and is inserted into the first enclosure;

wherein the second channel connector protrudes from the surface of the first end connector and is inserted into the second enclosure;

wherein the third channel connector protrudes from a surface of the second end connector and is inserted into the first enclosure; and

wherein the fourth channel connector protrudes from the surface of the second end connector and is inserted into the second enclosure.

10 . The method of claim 4 , wherein welding the surface of the first side of the power electronics module to the first bracket includes directing laser beams through the first opening; and

wherein welding the surface of the opposite second side of the power electronics module to the second bracket includes directing laser beams through the second opening.

11 . A package comprising:

a power electronics module disposed between a first bracket and a second bracket with a first side of the power electronics module covering an opening in the first bracket and an opposite second side of the power electronics module covering an opening in the second bracket;

a first weld joint between a surface of the first side of the power electronics module and the first bracket along a perimeter of the opening in the first bracket;

a second weld joint between a surface of the opposite second side of the power electronics module and the second bracket along a perimeter of the opening in the second bracket;

a first cover beam disposed on the first bracket over the power electronics module, the first cover beam and the first bracket forming a first enclosure for a first cooling fluid channel configured to direct cooling fluid over the power electronics module, the first cover beam attached to the first bracket by a third weld joint;

a second cover beam disposed on the second bracket over the power electronics module, the second cover beam and the second bracket forming a second enclosure for a second cooling fluid channel configured to direct the cooling fluid over the power electronics module, the second cover beam attached to the second bracket by a fourth weld joint;

a first end connector including a first channel connector attached to a first end of the first enclosure, a second channel connector attached to a first end of the second enclosure, and an inlet port; and

a second end connector including a third channel connector attached to a second end of the first enclosure, a fourth channel connector attached to a second end of the second enclosure, and an outlet port.

12 . The package of claim 11 , wherein the power electronics module includes a plurality of fins extending through the opening in the first bracket.

13 . The package of claim 11 , wherein the power electronics module is welded to a first side of the first bracket and the first cover beam is disposed over an opposite second side of the first bracket; and

wherein the power electronics module is welded to a first side of the second bracket and the second cover beam is disposed over an opposite second side of the second bracket.

14 . The package of claim 11 , wherein the first channel connector protrudes from a surface of the first end connector and is inserted into the first enclosure;

wherein the second channel connector protrudes from the surface of the first end connector and is inserted into the second enclosure;

wherein the third channel connector protrudes from a surface of the second end connector and is inserted into the first enclosure; and

wherein the fourth channel connector protrudes from the surface of the second end connector and is inserted into the second enclosure.

15 . A package comprising:

a power electronics module coupled to a first bracket and a second bracket, wherein a bottom surface of the power electronics module is welded the first bracket around a perimeter of an opening in the first bracket to form a leak-proof joint between the power electronics module and the first bracket, and wherein a top surface of the power electronics module is welded to the second bracket around a perimeter of an opening in the second bracket to form a leak-proof joint between the power electronics module and second first bracket;

a first cover beam coupled to the first bracket, wherein the first cover beam and the first bracket are welded together along a length of the first bracket, the first cover beam and the first bracket forming a first enclosure for a first cooling fluid channel configured to direct cooling fluid over the power electronics module;

a second cover beam coupled to the second bracket, wherein the second cover beam and the second bracket are welded together along a length of the second bracket, the second cover beam and the second bracket forming a second enclosure for a second cooling fluid channel configured to direct the cooling fluid over the power electronics module;

a first end connector attached to a first end of the first enclosure and the second enclosure, the first end connector including an input port; and

a second end connector attached to a second end of the first enclosure and the second enclosure opposite the first end, the second end connector including an output port, wherein the input port and the output port are axially aligned in a direction corresponding to the length of the bracket.

16 . The package of claim 15 , wherein the power electronics module includes a plurality of fins extending through the opening in the first bracket.

17 . The package of claim 15 , wherein the power electronics module is a first power electronics module, wherein a surface of a second power electronics module is welded to the first bracket around a perimeter of a third opening in the first bracket to form a leak-proof joint between the second power electronics module and the first bracket.

18 . The package of claim 15 , wherein a portion of the power electronics module is exposed to the cooling fluid channel through the opening in the first bracket.