IP Library Granted Patent US 12696434
Granted Patent B2
US 12696434 · App. 18/672,815 · Granted Jul 28, 2026

Module

Inventors: Yoshihito Otsubo (Nagaokakyo, JP); Morio Takeuchi (Nagaokakyo, JP)
Assignee: Murata Manufacturing Co., Ltd.
H05K9/0081H05K1/0233
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12696434
App. No.
18/672,815
Granted
Jul 28, 2026
Kind
B2
Abstract

A module includes: a first substrate having a first surface and a second surface facing opposite sides; and a second substrate having a third surface and a fourth surface facing opposite sides, wherein the second substrate is disposed to overlap the first substrate with the third surface facing the first substrate, while being spaced apart from the first substrate on the second surface side of the first substrate, the first substrate and the second substrate are electrically connected, an inductor is mounted on the third surface, and at least one shield electrode is fixed to the first substrate with the shield electrode being positioned so as to cross a path of a magnetic flux, and each of the at least one shield electrode is grounded.

Claims (23)

1 . A module comprising:

a first substrate having a first surface and a second surface facing away from each other;

a second substrate having a third surface and a fourth surface facing away from each other;

a signal line disposed to connect the first substrate and the second substrate;

an intermediate sealing resin sealing a space between the first substrate and the second substrate; and

a shield film covering at least a side surface of the intermediate sealing resin, wherein

the second substrate is disposed to overlap the first substrate with the third surface facing the first substrate while the second substrate is spaced from the first substrate on a side of the second surface of the first substrate,

the first substrate and the second substrate are electrically connected,

an inductor is mounted on the third surface,

at least one shield electrode is fixed to the first substrate with the shield electrode being positioned so as to cross a path of a magnetic flux emitted by the inductor, and each of the at least one shield electrode is grounded,

the inductor is disposed such that the magnetic flux emitted by the inductor is parallel to the third surface, and the at least one shield electrode is disposed to stand vertically on the second surface,

the at least one shield electrode is a plurality of columnar conductors disposed in parallel with each other, and the plurality of columnar conductors are disposed along two parallel side surfaces of the inductor from which the magnetic flux is emitted, and

the signal line is sandwiched between the plurality of columnar conductors and the shield film.

2 . The module according to claim 1 , wherein

the at least one shield electrode is disposed to connect the first substrate and the second substrate.

3 . The module according to claim 1 , wherein

the at least one shield electrode is a plurality of strip-shaped conductors disposed in parallel with each other.

4 . The module according to claim 1 , wherein

the first substrate has a recessed portion in the second surface, and a part of the inductor enters the recessed portion.

5 . The module according to claim 2 , wherein

the first substrate has a recessed portion in the second surface, and a part of the inductor enters the recessed portion.

6 . The module according to claim 3 , wherein

the first substrate has a recessed portion in the second surface, and a part of the inductor enters the recessed portion.