IP Library Granted Patent US 12696595
Granted Patent B2
US 12696595 · App. 18/298,420 · Granted Jul 28, 2026

Display device and method of manufacturing the same

Inventors: Sun-Kyu Joo (Suwon-si, KR); Keunchan Oh (Hwaseong-si, KR); Jun-Woo Hyung (Seongnam-si, KR)
Assignee: SAMSUNG DISPLAY CO., LTD.
H10H20/8514H10H20/0361
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Quick Facts
Patent No.
US 12696595
App. No.
18/298,420
Granted
Jul 28, 2026
Kind
B2
Abstract

A display device includes a substrate, a partition layer disposed on the substrate, and comprising a first accommodating opening, a second accommodating opening, a third accommodating opening, and a spacer area spaced apart from the first accommodating opening and the second accommodating opening, a first color conversion layer disposed in the first accommodating opening, a second color conversion layer disposed in the third accommodating opening, a scattering layer disposed in the third accommodating opening, and a spacer disposed on the spacer area of the partition layer. The spacer and the scattering layer comprises a same material.

Claims (50)

1 . A display device comprising:

a substrate;

a partition layer disposed on the substrate, and comprising:

a first accommodating opening;

a second accommodating opening;

a third accommodating opening; and

a spacer area spaced apart from the first accommodating opening and the second accommodating opening;

a first color conversion layer disposed in the first accommodating opening;

a second color conversion layer disposed in the second accommodating opening;

a scattering layer disposed in the third accommodating opening; and

a spacer disposed on the spacer area of the partition layer,

wherein the spacer and the scattering layer comprise a same material, and

wherein the scattering layer and the spacer comprise a scattering material.

2 . The display device of claim 1 , wherein the partition layer further comprises:

a first dummy opening disposed between the second accommodating opening and the third accommodating opening; and

a second dummy opening disposed between the first accommodating opening and the second accommodating opening and between the first accommodating opening and the third accommodating opening.

3 . The display device of claim 2 , wherein the scattering layer is further disposed in the first dummy opening and the second dummy opening.

4 . The display device of claim 1 , wherein the partition wall further comprises a fourth accommodating opening,

wherein the fourth accommodating opening is surrounded by the first accommodating opening, the second accommodating opening, and the third accommodating opening, and comprises a central dummy opening and a plurality of peripheral dummy openings surrounding the central dummy opening.

5 . The display device of claim 4 , wherein the spacer area is a portion of the partition wall adjacent to the central dummy opening.

6 . The display device of claim 4 , wherein the scattering layer is further disposed in the fourth accommodating opening.

7 . The display device of claim 1 , further comprising:

a capping layer covering the partition wall, the first color conversion layer, and the second color conversion layer.

8 . The display device of claim 7 , wherein the capping layer is further disposed between the partition wall and the scattering layer in the third accommodating opening.

9 . The display device of claim 1 , wherein

a planar area of the first accommodating opening is larger than a planar area of the second accommodating opening, and

the planar area of the second accommodating opening is larger than a planer area of the third accommodating opening.

10 . The display device of claim 1 , further comprising:

a filling layer covering the partition wall, the first color conversion layer, the second color conversion layer, the scattering layer, and the spacer.

11 . A method of manufacturing a display device, comprising:

forming a pre-partition wall on a substrate;

forming a partition wall comprising a first accommodating opening, a second accommodating opening, a third accommodating opening, and a spacer area spaced apart from the first accommodating opening and the second accommodating opening by removing a first portion of the pre-partition wall;

forming a first color conversion layer in the first accommodating opening;

forming a second color conversion layer in the second accommodating opening;

applying a photoresist material entirely on the substrate to cover the partition wall, the first color conversion layer, and the second color conversion layer; and

forming a scattering layer disposed in the third accommodating opening and a spacer disposed on the spacer area of the partition wall at the same time by removing a portion of the photoresist material,

wherein the photoresist material comprises a scattering material.

12 . The method of claim 11 , wherein

the forming of the first color conversion layer comprises supplying a first ink comprising a first color conversion material into the first accommodating opening by an inkjet method, and

the forming of the second color conversion layer comprises supplying a second ink comprising a second color conversion material into the second accommodating opening by an inkjet method.

13 . The method of claim 12 , wherein the forming of the partition wall further comprises:

forming a first dummy opening disposed between the second accommodating opening and the third accommodating opening, and a second dummy opening disposed between the first accommodating opening and the third accommodating opening by removing second portion of the pre-partition wall.

14 . The method of claim 13 , wherein the forming of the partition wall further comprises:

forming a fourth accommodating opening surrounded by the first accommodating opening, the second accommodating opening, and the third accommodating opening, and comprising a central dummy opening and a plurality of peripheral dummy openings surrounding the central dummy opening by removing a third portion of the pre-partition wall.

15 . The method of claim 14 , wherein the scattering layer is further disposed in the first dummy opening, the second dummy opening, and the fourth accommodating opening.

16 . The method of claim 12 , further comprising:

forming a filling layer covering the partition wall, the first color conversion layer, the second color conversion layer, the scattering layer, and the spacer.

17 . The method of claim 11 , further comprising:

after the forming of the second color conversion layer, forming the capping layer covering the substrate, the partition wall, the first color conversion layer, and the second color conversion layer.

18 . The method of claim 17 , wherein the photoresist material is applied onto the capping layer.