IP Library › Granted Patent US 12696599
Granted Patent B2
US 12696599 · App. 17/893,190 · Granted Jul 28, 2026

Light emitting diode package structure, manufacturing method of light emitting diode package structure and light emitting panel

Inventors: Shuo-Yang Sun (Hsinchu, TW); Hao-Lun Hsieh (Hsinchu, TW); Xiao-Yun Li (Hsinchu, TW); Yu-Hao Chang (Hsinchu, TW); Fu-Yang Chen (Hsinchu, TW); Jhih-Jhu Jhan (Hsinchu, TW); Yu-Chih Wang (Hsinchu, TW); Ying-Hui Lai (Hsinchu, TW)
Assignee: AUO Corporation
H10H20/857H10H20/01H10H20/0364
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Quick Facts
Patent No.
US 12696599
App. No.
17/893,190
Filed
Aug 23, 2022
Granted
Jul 28, 2026
Kind
B2
Art Unit
2817
USPC
257/79
Abstract

A light emitting diode (LED) package structure includes a first insulating layer, a first conductive pattern, a second insulating layer, a second conductive pattern, an LED element, and a solder material. The first conductive pattern has a first portion and a second portion, the first portion fills a through hole of the first insulating layer, and the second portion is disposed on the first insulating layer. The second insulating layer is disposed on the first insulating layer and covers the first conductive pattern. The second portion of the first conductive pattern is sandwiched between the first insulating layer and the second insulating layer. The second conductive pattern is disposed on the second insulating layer and is electrically connected to the first conductive pattern. The LED element is bonded to the second conductive pattern. The solder material is disposed on the first portion of the first conductive pattern.

Claims (44)

1 . A manufacturing method of a light emitting diode package structure, comprising:

forming a release layer on a substrate;

forming a first insulating layer on the release layer, wherein the first insulating layer has a through hole;

forming a first conductive pattern on the first insulating layer, wherein a first portion of the first conductive pattern fills the through hole of the first insulating layer, and a second portion of the first conductive pattern is disposed on the first insulating layer and is connected to the first portion, and the second portion exposes a portion of a top surface of the first portion to define a recess of the first conductive pattern;

forming a second insulating layer on the first insulating layer and the first conductive pattern, wherein the second portion of the first conductive pattern is ring-shaped, and a portion of the second portion of the first conductive pattern is sandwiched between the first insulating layer and the second insulating layer;

forming a second conductive pattern on the second insulating layer, wherein the second conductive pattern is electrically connected to the first conductive pattern, wherein the second conductive pattern comprises a pad portion and a conductive portion, and a portion of the conductive portion of the second conductive pattern is located in the recess of the first conductive pattern and contacts the portion of the top surface of the first portion;

forming a light absorbing layer on the second insulating layer, wherein the light absorbing layer covers a top surface and a side surface of the conductive portion, and wherein the pad portion of the second conductive pattern is exposed by the light absorbing layer;

bonding a light emitting diode element to the second conductive pattern;

forming a transparent package layer on and contacting the light absorbing layer and the light emitting diode element, wherein the light emitting diode element is encapsulated by the transparent package layer, and wherein a portion of the transparent package layer and a portion of the light absorbing layer are disposed between the pad portion and the conductive portion;

separating the release layer from the first insulating layer to expose the first portion of the first conductive pattern filling the through hole of the first insulating layer; and

forming a solder material on the first portion of the first conductive pattern, wherein the solder material and the second conductive pattern are respectively located on two opposite sides of the first conductive pattern, and wherein the solder material is not overlapped with the light emitting diode element and the pad portion.

2 . The manufacturing method according to claim 1 , further comprising:

forming a laser stopper layer on the release layer after forming the release layer and before forming the first insulating layer; and

after separating the release layer from the first insulating layer, removing the laser stopper layer to expose the first portion of the first conductive pattern filling the through hole of the first insulating layer.

3 . The manufacturing method according to claim 1 , wherein a projection area of the first conductive pattern is larger than a projection area of the through hole of the first insulating layer, and the projection area of the through hole of the first insulating layer falls within the projection area of the first conductive pattern.

4 . The manufacturing method according to claim 1 , wherein the second insulating layer has a through hole overlapped with the recess of the first conductive pattern, and the second conductive pattern is electrically connected to the first conductive pattern through the through hole of the second insulating layer.

5 . A light emitting diode package structure, comprising:

a first insulating layer, having a through hole;

a first conductive pattern, having a first portion and a second portion, wherein the first portion fills the through hole of the first insulating layer, the second portion is disposed on the first insulating layer and is connected to the first portion, and the second portion exposes a portion of a top surface of the first portion to define a recess of the first conductive pattern;

a second insulating layer, disposed on the first insulating layer and the first conductive pattern, wherein the second portion of the first conductive pattern is ring-shaped, and a portion of the second portion of the first conductive pattern is sandwiched between the first insulating layer and the second insulating layer;

a second conductive pattern, disposed on the second insulating layer and electrically connected to the first conductive pattern, wherein the second conductive pattern comprises a pad portion and a conductive portion, and a portion of the conductive portion of the second conductive pattern is located in the recess of the first conductive pattern and contacts the portion of the top surface of the first portion;

a light absorbing layer, disposed on the second insulating layer, wherein the light absorbing layer covers a top surface and a side surface of the conductive portion, and wherein the pad portion of the second conductive pattern is exposed by the light absorbing layer;

a light emitting diode element, bonded to the pad portion of the second conductive pattern;

a transparent package layer, located on and contacting the light absorbing layer and the light emitting diode element, wherein the light emitting diode element is encapsulated by the transparent package layer, and a portion of the transparent package layer and a portion of the light absorbing layer are disposed between the pad portion and the conductive portion; and

a solder material, disposed on the first portion of the first conductive pattern, wherein the solder material and the second conductive pattern are respectively located on two opposite sides of the first conductive pattern, and wherein the solder material is not overlapped with the light emitting diode element and the pad portion.

6 . The light emitting diode package structure according to claim 5 , wherein a projection area of the first conductive pattern is larger than a projection area of the through hole of the first insulating layer, and the projection area of the through hole of the first insulating layer falls within the projection area of the first conductive pattern.

7 . The light emitting diode package structure according to claim 5 , wherein the second insulating layer has a through hole overlapped with the recess of the first conductive pattern, and the second conductive pattern is electrically connected to the first conductive pattern through the through hole of the second insulating layer.

8 . A light emitting panel, comprising:

a light emitting diode package structure, comprising:

a first insulating layer, having a through hole;

a first conductive pattern, having a first portion and a second portion, wherein the first portion fills the through hole of the first insulating layer, the second portion is disposed on the first insulating layer and connected to the first portion, and the second portion exposes a portion of a top surface of the first portion to define a recess of the first conductive pattern;

a second insulating layer, disposed on the first insulating layer and the first conductive pattern, wherein the second portion of the first conductive pattern is ring-shaped, and a portion of the second portion of the first conductive pattern is sandwiched between the first insulating layer and the second insulating layer;

a second conductive pattern, disposed on the second insulating layer and electrically connected to the first conductive pattern, wherein the second conductive pattern comprises a pad portion and a conductive portion, and a portion of the conductive portion of the second conductive pattern is located in the recess of the first conductive pattern and contacts the portion of the top surface of the first portion;

a light absorbing layer, disposed on the second insulating layer, wherein the light absorbing layer covers a top surface and a side surface of the conductive portion, and the pad portion of the second conductive pattern is exposed by the light absorbing layer;

a light emitting diode element, bonded to the pad portion of the second conductive pattern; and

a transparent package layer, located on and contacting the light absorbing layer and the light emitting diode element, wherein the light emitting diode element is encapsulated by the transparent package layer, and a portion of the transparent package layer and a portion of the light absorbing layer are disposed between the pad portion and the conductive portion; and

a solder material, disposed on the first portion of the first conductive pattern, wherein the solder material and the second conductive pattern are respectively located on two opposite sides of the first conductive pattern, and wherein the solder material is not overlapped with the light emitting diode element and the pad portion; and

a driver back plate, wherein the light emitting diode package structure is bonded to the driver back plate.

9 . The light emitting panel according to claim 8 , wherein a projection area of the first conductive pattern is larger than a projection area of the through hole of the first insulating layer, and the projection area of the through hole of the first insulating layer falls within the projection area of the first conductive pattern.

10 . The light emitting panel according to claim 8 , wherein the second insulating layer has a through hole overlapped with the recess of the first conductive pattern, and the second conductive pattern is electrically connected to the first conductive pattern through the through hole of the second insulating layer.

11 . The light emitting diode package structure according to claim 5 , wherein the first insulating layer has a first surface and a second surface, the first portion of the first conductive pattern completely fills within the through hole of the first insulating layer so that a bottom surface of the first conductive pattern and the first surface of the first insulating layer are at a same level, the second portion of the first conductive pattern is disposed on the through hole and the second surface of the first insulating layer, the second insulating layer is disposed on the second surface of the first insulating layer and the first conductive pattern, and the solder material contacts the bottom surface of the first conductive pattern.

12 . The light emitting diode package structure according to claim 5 , wherein the solder material is disposed on the first portion of the first conductive pattern and adjacent to a first surface of the first insulating layer, and wherein a driver back plate and the first portion of the first conductive pattern are bonded with each other by the solder material so that at least one portion of the first surface of the first insulating layer does not contact the driver back plate.

13 . The light emitting panel according to claim 8 , wherein the first insulating layer has a first surface and a second surface the first portion of the first conductive pattern completely fills within the through hole of the first insulating layer so that a bottom surface of the first conductive pattern and the first surface of the first insulating layer are at a same level, the second portion of the first conductive pattern is disposed on the through hole and the second surface of the first insulating layer, the second insulating layer is disposed on the second surface of the first insulating layer and the first conductive pattern, and the solder material contacts the bottom surface of the first conductive pattern.

14 . The light emitting panel according to claim 8 , wherein the solder material is disposed on the first portion of the first conductive pattern and adjacent to a first surface of the first insulating layer, and wherein the driver back plate and the first portion of the first conductive pattern are bonded with each other by the solder material so that at least one portion of the first surface of the first insulating layer does not contact the driver back plate.