Array substrate for display apparatus and method of manufacturing display apparatus
In an array substrate for a display apparatus, the array substrate includes: a mother substrate; a base substrate on the mother substrate and comprising a display cell and a peripheral area surrounding the display cell, the display cell comprising a display area and a non-display area surrounding the display area; a ground pad at an edge of the base substrate and extending from an upper surface of the base substrate to an upper surface of the mother substrate; a ground wire in the peripheral area to surround the display cell and electrically connected to the ground pad and the display cell; a first organic layer covering an edge of the ground pad; and a second organic layer on the first organic layer and covering the ground pad.
1 . An array substrate for a display apparatus, the array substrate comprising:
a mother substrate;
a base substrate on the mother substrate and comprising a display cell and a peripheral area surrounding the display cell, the display cell comprising a display area and a non-display area surrounding the display area;
a ground pad overlapping an edge of the base substrate and extending from an upper surface of the base substrate to overlap an upper surface of the mother substrate;
a ground wire in the peripheral area to surround the display cell and electrically connected to the ground pad and the display cell;
a first organic layer covering an edge of the ground pad; and
a second organic layer on the first organic layer and covering the ground pad,
wherein the second organic layer directly contacts the ground pad and the mother substrate.
2 . The array substrate of claim 1 , wherein the display cell comprises a terminal portion on one side of the non-display area, and
the terminal portion is electrically connected to the ground pad through the ground wire.
3 . The array substrate of claim 1 , wherein the display cell comprises:
a pixel circuit comprising a thin-film transistor and a storage capacitor;
a display element in the display area and electrically connected to the pixel circuit; and
a planarization insulating layer between the pixel circuit and the display element, and
the first organic layer comprises a same material as the planarization insulating layer.
4 . The array substrate of claim 3 , wherein the display cell comprises an encapsulation layer on the display element and comprising at least one inorganic encapsulation layer and an organic encapsulation layer, and
the second organic layer comprises a same material as the organic encapsulation layer.
5 . The array substrate of claim 1 , further comprising a metal layer covering the second organic layer.
6 . The array substrate of claim 5 , wherein the display cell comprises an input sensing layer in the display area,
the input sensing layer comprises a first conductive layer, a second conductive layer, and an insulating layer between the first conductive layer and the second conductive layer, and
the metal layer comprises a same material as the first conductive layer or the second conductive layer.
7 . The array substrate of claim 1 , further comprising a cover layer overlapping the ground wire.
8 . The array substrate of claim 1 , wherein a portion of the ground wire is in the non-display area.
9 . The array substrate of claim 1 , further comprising an inorganic insulating layer extending from the base substrate to the mother substrate,
wherein the inorganic insulating layer is in direct contact with the mother substrate.
10 . The array substrate of claim 9 , wherein the ground pad is on the inorganic insulating layer.
11 . The array substrate of claim 1 , wherein the display cell comprises:
a pixel circuit comprising a thin-film transistor and a storage capacitor;
a display element in the display area and electrically connected to the pixel circuit; and
a contact metal connecting the pixel circuit to the display element, and
the ground pad comprises a same material as the contact metal.
12 . A method of manufacturing a display apparatus, the method comprising:
forming, on a mother substrate, a base substrate comprising a display cell and a peripheral area surrounding the display cell, the display cell comprising a display area and a non-display area surrounding the display area;
forming a pixel circuit comprising a thin-film transistor and a storage capacitor on the base substrate;
forming a ground pad and a ground wire, the ground pad being arranged to overlap an edge of the base substrate, and the ground wire electrically connecting the ground pad to the pixel circuit;
forming a first organic layer and a cover layer, the first organic layer covering an edge of the ground pad, and the cover layer covering the ground wire;
forming a display element electrically connected to the pixel circuit in the display area;
forming a second organic layer to cover the ground pad, the second organic layer directly contacting the ground pad and the mother substrate; and
separating the display cell from the peripheral area along an edge of the display cell.
13 . The method of claim 12 , wherein the forming of the display element comprises:
forming a pixel electrode;
forming an emission layer; and
forming an opposite electrode,
wherein, in the forming of the emission layer, the ground pad is in direct contact with a holder of deposition equipment.
14 . The method of claim 12 , wherein the forming of the first organic layer comprises forming a planarization insulating layer on the pixel circuit.
15 . The method of claim 12 , further comprising forming an inorganic encapsulation layer covering the display element between the forming of the display element and the forming of the second organic layer,
wherein, the forming of the second organic layer comprises forming an organic encapsulation layer on the inorganic encapsulation layer.
16 . The method of claim 12 , further comprising forming a metal layer covering the second organic layer after the forming of the second organic layer.
17 . The method of claim 16 , wherein the display cell comprises an input sensing layer in the display area,
the input sensing layer comprises a first conductive layer, a second conductive layer, and an insulating layer between the first conductive layer and the second conductive layer, and
the first conductive layer is formed in the forming of the metal layer.
18 . The method of claim 16 , wherein the display cell comprises an input sensing layer in the display area,
the input sensing layer comprises a first conductive layer, a second conductive layer, and an insulating layer between the first conductive layer and the second conductive layer, and
the second conductive layer is formed in the forming of the metal layer.
19 . The method of claim 12 , wherein the display cell comprises a terminal portion on one side of the non-display area, and
the terminal portion is electrically connected to the ground pad through the ground wire.
20 . The method of claim 12 , wherein, in the separating of the display cell from the peripheral area, a portion of the ground wire remains in the display cell.