IP Library › Granted Patent US 12696673
Granted Patent B2
US 12696673 · App. 18/269,769 · Granted Jul 28, 2026

Display devices and display terminals including solder pad part

Inventor: Feiming Lin (Wuhan, CN)
Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
H10K59/8794H10K59/131H10K59/8722H10K59/8792H10K2102/351
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Quick Facts
Patent No.
US 12696673
App. No.
18/269,769
Granted
Jul 28, 2026
Kind
B2
Abstract

A display device is provided. In this display device, a first backplate is disposed on a back side of a flat plate part; a second backplate is disposed on a side of a solder pad part; a rigid support layer is directly attached onto the first backplate; a buffer layer is directly attached onto the rigid support layer; a notch is provided at an end of the buffer layer close to a bending part; an adhesive layer is disposed in the notch, and the second backplate is attached onto a surface of the adhesive layer away from the rigid support layer; and a heat dissipation support layer is disposed on a side of the buffer layer.

Claims (34)

1 . A display device, comprising:

a display panel body comprising a flat plate part, a bending part, and a solder pad part, wherein the bending part is disposed between the flat plate part and the solder pad part, and the solder pad part is disposed on a back side of the flat plate part in a bending state;

a backplate layer comprising a first backplate and a second backplate, wherein the first backplate is disposed on the back side of the flat plate part, and the second backplate is disposed on a side of the solder pad part close to the flat plate part;

a rigid support layer attached onto a side of the first backplate away from the flat plate part;

a buffer layer attached onto a side of the rigid support layer away from the flat plate part;

a notch provided at an end of the buffer layer close to the bending part;

an adhesive layer disposed in the notch, wherein the second backplate is attached onto a surface of the adhesive layer away from the rigid support layer; and

a heat dissipation support layer disposed on a side of the buffer layer away from the flat plate part.

2 . The display device of claim 1 , wherein a thickness of the buffer layer between the adhesive layer and the rigid support layer is 0, and the second backplate is attached onto a surface of the rigid support layer away from the flat plate part through the adhesive layer.

3 . The display device of claim 1 , wherein a thickness of the buffer layer between the adhesive layer and the rigid support layer is greater than 0, and the second backplate is attached onto a surface of the buffer layer through the adhesive layer.

4 . The display device of claim 1 , wherein an orthographic projection of the heat dissipation support layer on the flat plate part does not overlap with an orthographic projection of the notch on the flat plate part.

5 . The display device of claim 4 , wherein a gap is defined between the orthographic projection of the heat dissipation support layer on the flat plate part and the orthographic projection of the notch on the flat plate part.

6 . The display device of claim 4 , wherein a thickness of a stacked layer between a surface of the flat plate part close to the heat dissipation support layer and a surface of the heat dissipation support layer away from the flat plate part is greater than or equal to a thickness of a stacked layer between a surface of the flat plate part close to the second backplate and a surface of the solder pad part away from the flat plate part.

7 . The display device of claim 6 , wherein the surface of the heat dissipation support layer away from the flat plate part and the surface of the solder pad part away from the flat plate part are in a same plane.

8 . The display device of claim 2 , wherein a height between a plane where the surface of the notch is located and a plane where a surface of the heat dissipation support layer away from the flat plate part is located ranges from 100 microns to 235 microns.

9 . The display device of claim 3 , wherein a height between a plane where the surface of the notch is located and a plane where a surface of the heat dissipation support layer away from the flat plate part is located ranges from 50 microns to 80 microns.

10 . The display device of claim 4 , wherein both of an elastic modulus of the rigid support layer and an elastic modulus of the heat dissipation support layer are greater than an elastic modulus of the backplate layer, and the elastic modulus of the backplate layer is greater than an elastic modulus of the buffer layer.

11 . The display device of claim 10 , wherein materials of the rigid support layer comprise stainless steel.

12 . The display device of claim 10 , wherein a thickness of the buffer layer between the adhesive layer and the rigid support layer is 0, and materials of the buffer layer comprise at least one of silica gel and polyurethane.

13 . The display device of claim 10 , wherein a thickness of the buffer layer between the adhesive layer and the rigid support layer is greater than 0, and materials of the buffer layer comprise a foam.

14 . The display device of claim 8 , wherein materials of the heat dissipation support layer comprise at least one of stainless steel, copper alloy, and carbon fiber.

15 . The display device of claim 9 , wherein materials of the heat dissipation support layer comprise at least one of stainless steel, copper alloy, and carbon fiber.

16 . A display terminal, comprising a terminal body and a display device integrated with the terminal body, wherein the display device comprises:

a display panel body comprising a flat plate part, a bending part, and a solder pad part, wherein the bending part is disposed between the flat plate part and the solder pad part, and the solder pad part is disposed on a back side of the flat plate part in a bending state;

a backplate layer comprising a first backplate and a second backplate, wherein the first backplate is disposed on the back side of the flat plate part, and the second backplate is disposed on a side of the solder pad part close to the flat plate part;

a rigid support layer attached onto a side of the first backplate away from the flat plate part;

a buffer layer attached onto a side of the rigid support layer away from the flat plate part;

a notch provided at an end of the buffer layer close to the bending part;

an adhesive layer disposed in the notch, wherein the second backplate is attached onto a surface of the adhesive layer away from the rigid support layer; and

a heat dissipation support layer disposed on a side of the buffer layer away from the flat plate part.

17 . The display terminal of claim 16 , wherein a thickness of the buffer layer between the adhesive layer and the rigid support layer is 0, and the second backplate is attached onto a surface of the rigid support layer away from the flat plate part through the adhesive layer.

18 . The display terminal of claim 16 , wherein a thickness of the buffer layer between the adhesive layer and the rigid support layer is greater than 0, and the second backplate is attached onto a surface of the buffer layer through the adhesive layer.

19 . The display terminal of claim 16 , wherein an orthographic projection of the heat dissipation support layer on the flat plate part does not overlap with an orthographic projection of the notch on the flat plate part.

20 . The display terminal of claim 19 , wherein a gap is defined between the orthographic projection of the heat dissipation support layer on the flat plate part and the orthographic projection of the notch on the flat plate part.