IP Library Granted Patent US 12696709
Granted Patent B2
US 12696709 · App. 18/252,796 · Granted Jul 28, 2026

Substrate processing method, substrate processing apparatus, and computer-readable recording medium

Inventor: Tsunemoto Ogata (Koshi City, JP)
Assignee: TOKYO ELECTRON LIMITED
H10P72/0411H10P72/0406H10P70/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12696709
App. No.
18/252,796
Granted
Jul 28, 2026
Kind
B2
Abstract

A substrate processing method includes forming, by supplying a cleaning liquid, a liquid film of the cleaning liquid on the substrate; forming, by supplying a rinse liquid, a liquid film of the rinse liquid on the substrate, after the forming of the liquid film of the cleaning liquid; forming, by supplying a first organic solvent, a liquid film of the first organic solvent on the substrate, after the forming of the liquid film of the rinse liquid; forming, by supplying a second organic solvent, a liquid film of the second organic solvent on the substrate, after the forming of the liquid film of the first organic solvent; and drying the substrate after the forming of the liquid film of the second organic solvent. The second organic solvent has water solubility lower than that of the first organic solvent and a boiling point higher than that of the first organic solvent.

Claims (62)

1 . A substate processing method, comprising:

forming, by supplying a cleaning liquid to a substrate while rotating the substrate, a liquid film of the cleaning liquid on the substrate;

forming, by supplying a rinse liquid to the substrate while rotating the substrate, a liquid film of the rinse liquid on the substrate and removing the cleaning liquid from the substrate, after the forming of the liquid film of the cleaning liquid;

forming, by supplying a first organic solvent to the substrate while rotating the substrate, a liquid film of the first organic solvent on the substrate and removing the rinse liquid from the substrate, after the forming of the liquid film of the rinse liquid;

forming, by supplying a second organic solvent to the substrate while rotating the substrate, a liquid film of the second organic solvent on the substrate and removing the first organic solvent from the substrate, after the forming of the liquid film of the first organic solvent;

forming, by supplying a third organic solvent to the substrate while rotating the substrate, a liquid film of the third organic solvent on the substrate and removing the second organic solvent from the substrate, after the forming of the liquid film of the second organic solvent; and

drying the substrate after the forming of the liquid film of the third organic solvent,

wherein the substrate is dried without performing any additional organic-solvent supplying step between the forming of the liquid film of the third organic solvent and the drying of the substrate,

wherein the second organic solvent has water solubility lower than that of the first organic solvent and a boiling point higher than that of the first organic solvent,

the third organic solvent has water solubility lower than that of the second organic solvent and a boiling point higher than that of the second organic solvent,

a solubility parameter (SP value) of the first organic solvent is smaller than a solubility parameter (SP value) of the rinse liquid, and

a solubility parameter (SP value) of the second organic solvent is smaller than the solubility parameter (SP value) of the first organic solvent.

2 . The substrate processing method of claim 1 ,

wherein the rinse liquid is pure water.

3 . The substrate processing method of claim 1 ,

wherein the second organic solvent is a mixed solution in which multiple kinds of organic solvents are mixed.

4 . The substrate processing method of claim 1 ,

wherein the forming of the liquid film of the second organic solvent comprises supplying the second organic solvent to the substrate while repeating acceleration and deceleration of a rotation of the substrate.

5 . The substrate processing method of claim 4 , wherein the forming of the liquid film of the second organic solvent comprises increasing a supply amount of the second organic solvent to the substrate when the substrate is rotated.

6 . The substrate processing method of claim 1 ,

wherein a solubility parameter (SP value) of the third organic solvent is smaller than a solubility parameter (SP value) of the second organic solvent.

7 . The substrate processing method of claim 1 ,

wherein the third organic solvent is a mixed solution in which multiple kinds of organic solvents are mixed.

8 . The substrate processing method of claim 1 ,

wherein the forming of the liquid film of the third organic solvent comprises supplying the third organic solvent to the substrate while repeating acceleration and deceleration of a rotation of the substrate.

9 . The substrate processing method of claim 8 ,

wherein a maximum rotation speed of the substrate in the forming of the liquid film of the third organic solvent is larger than a maximum rotation speed of the substrate in the forming of the liquid film of the second organic solvent.

10 . The substrate processing method of claim 8 ,

wherein the forming of the liquid film of the third organic solvent comprises increasing a supply amount of the third organic solvent to the substate when the substrate is rotated.

11 . A substrate processing apparatus, comprising:

a rotating/holding unit configured to hold and rotate a substrate;

a cleaning liquid supply configured to supply a cleaning liquid to the substrate, wherein the cleaning liquid supply comprises a cleaning liquid source that contains the cleaning liquid;

a rinse liquid supply configured to supply a rinse liquid to the substrate, wherein the rinse liquid supply comprises a rinse liquid source that contains the rinse liquid;

a first solvent supply configured to supply a first organic solvent to the substrate, wherein the first solvent supply comprises a first solvent source that contains the first organic solvent;

a second solvent supply configured to supply a second organic solvent to the substrate, wherein the second solvent supply comprises a second solvent source that contains the second organic solvent;

a third solvent supply configured to supply a third organic solvent to the substrate, wherein the third solvent supply comprises a third solvent source that contains the third organic solvent; and

a controller configured to control the rotating/holding unit, the cleaning liquid supply, the rinse liquid supply, the first solvent supply, the second solvent supply, and the third solvent supply,

wherein the second organic solvent has water solubility lower than that of the first organic solvent and a boiling point higher than that of the first organic solvent,

the third organic solvent has water solubility lower than that of the second organic solvent and a boiling point higher than that of the second organic solvent,

a solubility parameter (SP value) of the first organic solvent is smaller than a solubility parameter (SP value) of the rinse liquid,

a solubility parameter (SP value) of the second organic solvent is smaller than the solubility parameter (SP value) of the first organic solvent, and

wherein the controller is configured to perform:

forming, during a rotation of the substrate with the rotating/holding unit, a liquid film of the cleaning liquid on the substrate by controlling the rotating/holding unit and the cleaning liquid supply;

removing, after the forming of the liquid film of the cleaning liquid, the cleaning liquid from the substrate and forming a liquid film of the rinse liquid on the substrate during the rotation of the substrate with the rotating/holding unit by controlling the rotating/holding unit and the rinse liquid supply;

removing, after the removing of the cleaning liquid, the rinse liquid from the substrate and forming a liquid film of the first organic solvent on the substrate during the rotation of the substrate with the rotating/holding unit by controlling the rotating/holding unit and the first solvent supply;

removing, after the removing of the rinse liquid, the first organic solvent from the substrate and forming a liquid film of the second organic solvent on the substrate during the rotation of the substrate with the rotating/holding unit by controlling the rotating/holding unit and the second solvent supply;

removing, after the removing of the first organic solvent, the second organic solvent from the substrate and forming a liquid film of the third organic solvent on the substate during the rotation of the substrate with the rotating/holding unit by controlling the rotating/holding unit and the third solvent supply; and

drying the substrate after the forming of the liquid film of the third organic solvent,

wherein the drying is performed without the controller performing any additional organic-solvent supplying step between the forming of the liquid film of the third organic solvent and the drying of the substrate.

12 . The substrate processing apparatus of claim 11 ,

wherein the rinse liquid is pure water.

13 . The substrate processing apparatus of claim 11 ,

wherein the second organic solvent is a mixed solution in which multiple kinds of organic solvents are mixed.

14 . The substrate processing apparatus of claim 11 ,

wherein the third organic solvent is a mixed solution in which multiple kinds of organic solvents are mixed.

15 . The substrate processing apparatus of claim 11 ,

wherein the removing of the second organic solvent comprises supplying the third organic solvent to the substrate by the third solvent supply while repeating acceleration and deceleration of the rotation of the substrate by the rotating/holding unit.

16 . The substrate processing apparatus of claim 15 ,

wherein a maximum rotation speed of the substrate in the removing of the second organic solvent is larger than a maximum rotation speed of the substrate in the removing of the first organic solvent.

17 . The substrate processing apparatus of claim 15 ,

wherein the removing of the second organic solvent comprises increasing a supply amount of the third organic solvent by the third solvent supply when the substrate is rotated.

18 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a substrate processing apparatus to perform a substrate processing method as claimed in claim 1 .