IP Library Granted Patent US 12696712
Granted Patent B2
US 12696712 · App. 17/898,143 · Granted Jul 28, 2026

Substrate processing apparatus and substrate processing method

Inventors: Takaumi Morita (Kuwana Mie, JP); Hiroshi Fujita (Mie Mie, JP); Tatsuhiko Koide (Kuwana Mie, JP); Naomi Yanai (Kuwana Mie, JP); Tsubasa Watanabe (Yokkaichi Mie, JP)
Assignee: Kioxia Corporation
H10P72/0426
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Quick Facts
Patent No.
US 12696712
App. No.
17/898,143
Granted
Jul 28, 2026
Kind
B2
Abstract

According to one embodiment, a substrate processing apparatus includes a processing tank configured to store a chemical solution for processing a substrate by immersion in a chemical solution. The substrate is held by a holding member during the processing. A lid is configured to open and close an upper end portion of the processing tank. The lid has a first bubble dispensing pipe formed or integrated therein. The first bubble dispensing pipe is configured to dispense a gas into the processing tank. A bottom surface side of the lid on a processing tank side may come into direct contact with the chemical solution in some examples. The first bubble dispensing pipe may dispense an inert gas into the chemical solution to improve process stability or the like.

Claims (34)

1 . A substrate processing apparatus, comprising:

a processing tank configured to store a chemical solution to process a substrate by immersion of the substrate in the chemical solution;

a holder configured to hold the substrate while immersed in the chemical solution;

a lid disposed on processing tank for opening and closing an upper end of the processing tank;

a first bubble dispensing pipe in the lid, the first bubble dispensing pipe being configured to dispense a gas into the processing tank from the lid;

an outer overflow tank surrounding the processing tank at an upper end of the processing tank;

a second bubble dispensing pipe with a gas outlet port on a bottom surface of the outer overflow tank; and

a third bubble dispensing pipe with a gas outlet port at a bottom surface of the processing tank and a recirculating path connected between the bottom surface of the outer overflow tank and the bottom surface of the processing tank, wherein

the lid comprises a first portion hinged at one side of the processing tank and a second portion hinged at an opposite side of the processing tank from the first portion,

the first and second portions directly contact the chemical solution stored in the processing tank when the lid is closed, and

when the lid is closed, the first portion angles upward from the one side of the processing tank toward a middle of the processing tank, and the second portion angles upward from the opposite side of the processing tank toward the middle of the processing tank;

wherein bottom surfaces of each of the first and second portions of the lid have gas outlets therein connected to the first bubble dispensing pipe.

2 . The substrate processing apparatus according to claim 1 , further comprising:

the recirculating path configured to return chemical solution from the outer overflow tank to the processing tank.

3 . The substrate processing apparatus according to claim 2 , wherein the recirculating path includes a filter cartridge thereon, the filter cartridge configured to supply an inert gas to the chemical solution on the recirculating path.

4 . The substrate processing apparatus according to claim 2 , wherein the recirculating path includes a heater thereon, the heater configured to heat the chemical solution on the recirculating path.

5 . The substrate processing apparatus according to claim 2 , wherein the recirculating path includes at least one resting tank thereon, an inert gas being supplied to the resting tank.

6 . The substrate processing apparatus according to claim 1 , wherein the first bubble dispensing pipe has a plurality of gas outlets in a bottom surface of the lid.

7 . The substrate processing apparatus according to claim 1 , wherein

the holder is configured to hold a plurality of substrates at the same time, and

the plurality of substrate are each held to be parallel to a vertical direction while immersed in the processing tank.

8 . A substrate processing apparatus, comprising:

a processing tank configured to store a chemical solution to process a substrate by immersion of the substrate in the chemical solution;

a holder configured to hold the substrate while immersed in the chemical solution;

a lid disposed on processing tank for opening and closing an upper end of the processing tank, the lid having a first portion hinged to a first side of the processing tank and second portion hinged to a second side of the processing tank opposite to the first side;

a first bubble dispensing pipe, the first bubble dispensing pipe being configured to dispense a gas into the processing tank from the lid;

an outer overflow tank surrounding the processing tank at an upper end of the processing tank; and

a second bubble dispensing pipe with a gas outlet port on a bottom surface of the outer overflow tank,

a third bubble dispensing pipe with a gas outlet port at a bottom surface of the processing tank and a recirculating path connected between the bottom surface of the outer overflow tank and the bottom surface of the processing tank,

wherein

a bottom surface of each of the first and second portions directly contacts the chemical solution stored in the processing tank when the lid is closed,

the bottom surface of the first portion angles upward from the first side of the processing tank toward a middle of the processing tank, and

the bottom surface of the second portion angles upward from the second side of the processing tank toward the middle of the processing tank;

wherein the bottom surfaces of each of the first and second portions of the lid have gas outlets therein connected to the first bubble dispensing pipe.