Heating unit and substrate treating apparatus including the same
The present disclosure provides a heating unit capable of using a bush with holes and a substrate treating apparatus including the same. An apparatus for treating a substrate, includes a heating unit including a heating plate and configured to heat the substrate, a cooling unit configured to cool the substrate, and a transfer unit configured to move the substrate to the heating unit or the cooling unit, wherein the heating plate includes a first plate configured to provide a seating surface to the substrate, and a second plate disposed under the first plate and installed internally with heater(s) and bush(es), and wherein the bush has a hollow configured to provide a lift pin with a space of movement for allowing the lift pin to be elevated or lowered, and includes a plurality of holes formed to extend from the hollow in an outward direction.
1 . An apparatus for treating a substrate, comprising:
a heating unit including a heating plate and configured to heat the substrate;
a cooling unit configured to cool the substrate; and
a transfer unit configured to move the substrate to the heating unit or the cooling unit,
wherein the heating plate comprises:
a first plate configured to provide a seating surface to the substrate; and
a second plate disposed under the first plate and installed internally with one or more heaters and one or more bushes,
wherein the bush has a hollow configured to provide a lift pin with a space of movement for allowing the lift pin to be elevated or lowered, and includes a plurality of holes formed to extend from the hollow in an outward direction, and
wherein the second plate of the heating plate includes a plurality of bushes consecutively installed in a height direction, and the bush including the holes is a bush disposed at an uppermost level among the plurality of bushes.
2 . The apparatus of claim 1 , wherein the holes are formed in a vertical direction with respect to a longitudinal direction of the bush, or are formed to be inclined with respect to the longitudinal direction of the bush.
3 . The apparatus of claim 1 , wherein the holes are each partially formed on a surface of the bush.
4 . The apparatus of claim 3 , wherein the hollow of the bush comprises:
a first subspace; and
a second subspace that is narrower in width than the first subspace, and
wherein the holes are connected to the first subspace.
5 . The apparatus of claim 4 , wherein the lift pin has an end configured, when elevated, to pass through the second subspace first, and when lowered, to pass through the first subspace first.
6 . The apparatus of claim 1 , wherein the second plate of the heating plate is formed internally with passages that connect to the holes and to a suction member for removing particles generated in the hollow of the bush.
7 . The apparatus of claim 1 , wherein the lift pin comprises:
a first body; and
a second body joined with the first body and having a width wider than the first body.
8 . The apparatus of claim 7 , wherein the lift pin when inserted into the hollow of the bush has the first body positioned above the second body.
9 . The apparatus of claim 7 , wherein the second body of the lift pin has a width corresponding to at least some of the hollow of the bush.
10 . The apparatus of claim 7 , wherein the lift pin is adjustable in length with the first body disposed internally of the second body and moving toward and away from the second body.
11 . The apparatus of claim 7 , wherein the second body of the lift pin has a length corresponding to at least some of the hollow of the bush.
12 . The apparatus of claim 1 , wherein the first plate of the heating plate has a surface formed with a groove, and the bush is fixed to the first plate through the groove.
13 . The apparatus of claim 12 , wherein the bush comprises:
a first bush installed on the second plate of the heating plate; and
a second bush coupled to the first bush and fixed to the first plate through the groove.
14 . An apparatus for treating a substrate, comprising:
a heating unit including a heating plate and configured to heat the substrate;
a cooling unit configured to cool the substrate; and
a transfer unit configured to move the substrate to the heating unit or the cooling unit,
wherein the heating plate comprises:
a first plate configured to provide a seating surface to the substrate; and
a second plate disposed under the first plate and installed internally with one or more heaters and one or more bushes, and
wherein the bush has a hollow configured to provide a lift pin with a space of movement for allowing the lift pin to be elevated or lowered, and includes a plurality of holes formed to extend from the hollow in an outward direction,
wherein the holes are formed in a vertical direction with respect to a longitudinal direction of the bush or are formed to be inclined with respect to the longitudinal direction of the bush,
wherein the lift pin comprises:
a first body, and
a second body joined with the first body and having a width wider than the first body,
wherein the second body has a width corresponding to at least some of the hollow of the bush,
wherein the first plate has a surface formed with a groove, and the bush is fixed to the first plate through the groove, and
wherein the second plate of the heating plate includes a plurality of bushes consecutively installed in a height direction, and the bush including the holes is a bush disposed at an uppermost level among the plurality of bushes.
15 . A heating unit provided in an apparatus for processing a substrate, the heating unit comprising:
a heating plate configured to heat the substrate and comprising:
a body configured to provide a seating surface to the substrate, and
one or more heaters installed internally of the body;
a cover configured to cover an upper portion of the heating plate; and
an actuator configured to move the cover,
wherein the heating plate comprises:
a first plate configured to provide a seating surface to the substrate; and
a second plate disposed under the first plate and installed internally with the one or more heaters and one or more bushes,
wherein the bush has a hollow configured to provide a lift pin with a space of movement for allowing the lift pin to be elevated or lowered, and includes a plurality of holes formed to extend from the hollow in an outward direction, and
wherein the second plate of the heating plate includes a plurality of bushes consecutively installed in a height direction, and the bush including the holes is a bush disposed at an uppermost level among the plurality of bushes.
16 . The heating unit of claim 15 , wherein the holes are formed in a vertical direction with respect to a longitudinal direction of the bush or are formed to be inclined with respect to the longitudinal direction of the bush.
17 . The heating unit of claim 15 , wherein the holes are each partially formed on a surface of the bush.
18 . The heating unit of claim 17 , wherein the hollow of the bush comprises:
a first subspace; and
a second subspace that is narrower in width than the first subspace, and
wherein the holes are connected to the first subspace.
19 . The heating unit of claim 15 , wherein the second plate of the heating plate is formed internally with passages that connect to the holes and to a suction member for removing particles generated in the hollow of the bush.