Fin structures, plate apparatus, and related methods, process kits, and processing chambers for growth rates and process uniformity
The present disclosure relates to semiconductor processing chambers, and more particularly, to fin structures that facilitate growth rates and process uniformity. In one or more embodiments, a processing chamber applicable for use in semiconductor manufacturing includes one or more gas inlets operable to flow a gas into an internal volume of the processing chamber and a substrate support disposed in the internal volume. The processing chamber includes a plate apparatus disposed in the internal volume and above the substrate support. The plate apparatus includes a plate, and one or more fins disposed at least partially below the plate.
1 . A processing chamber, comprising:
one or more gas inlets operable to flow a gas into an internal volume of the processing chamber;
a substrate support disposed in the internal volume; and
a plate apparatus disposed in the internal volume and above the substrate support, the plate apparatus comprising:
a plate comprising:
a first outer face,
a second outer face opposing the first outer face, and
one or more openings formed in the first outer face and defining one or more recessed surfaces, and
one or more fins disposed at least partially below the plate, at least one of the one or more fins extending relative to the second outer face of the plate and sized and shaped for positioning in the one or more openings, and at least one of the one or more fins comprising:
a first shoulder,
a second shoulder, and
a middle section extending between the first shoulder and the second shoulder, the first shoulder and the second shoulder interfacing with at least one of the one or more recessed surfaces.
2 . The processing chamber of claim 1 , wherein the one or more gas inlets are operable to flow the gas between the one or more fins and over the substrate.
3 . The processing chamber of claim 1 , wherein the plate comprises one or more openings defining one or more recessed surfaces, and the one or more fins are disposed in the one or more openings.
4 . The processing chamber of claim 1 , further comprising:
a pre-heat ring disposed outwardly of the substrate support, the pre-heat ring at least partially surrounding a middle section of at least one of the one or more fins;
a window at least partially defining the internal volume; and
one or more heat sources operable to heat the internal volume.
5 . The processing chamber of claim 1 , wherein at least one of the one or more fins has a lower transmissivity than the plate.
6 . The processing chamber of claim 5 , wherein the plate is formed of a first composition, at least one of the one or more fins is formed of a second composition that is different than the first composition, the second composition comprises silicon carbide (SiC), and the first composition comprises quartz.
7 . The processing chamber of claim 6 , wherein the SiC has an atomic structure that is 4H, 6H, or 3C.
8 . The processing chamber of claim 1 , wherein:
the plate is formed of a first composition;
at least one of the one or more fins formed of a second composition that is different than the first composition; and
the processing chamber further comprises a set of blocks on opposing sides of the one or more fins, the set of blocks sized and shaped to interface with the plate.
9 . The processing chamber of claim 1 , wherein the one or more fins including a plurality of fins spaced from each other between the set of blocks.
10 . The processing chamber of claim 1 , wherein the plate has a first thickness that is larger than a second thickness of at least one of the one or more fins.
11 . The processing chamber of claim 8 , wherein the plate has a first thickness that is larger than a second thickness of at least one of the one or more fins.
12 . A process kit applicable for use in semiconductor manufacturing, the process kit comprising:
a plate formed of a first composition;
one or more fins, at least one of the one or more fins formed of a second composition that is different than the first composition, the at least one of the one or more fins comprising a first shoulder, a second shoulder, and a middle section extending between the first shoulder and the second shoulder; and
a ring sized and shaped to at least partially surround the middle section of the one or more fins, the ring comprising one or more openings defining one or more recessed surfaces, the at least one of the one or more fins sized and shaped for positioning in the one or more openings, and the first shoulder and second shoulder sized and shaped to interface with at least one of the one or more recessed surfaces.
13 . The plate apparatus of claim 12 , wherein the second composition comprises one or more of black quartz, graphite, or SiC, and the first composition comprises transparent quartz.
14 . A process kit, comprising:
the plate apparatus of claim 12 ; and
a set of blocks on opposing sides of the one or more fins, the set of blocks sized and shaped to interface with the plate, and the one or more fins including a plurality of fins spaced from each other between the set of blocks.
15 . The plate apparatus of claim 12 , wherein the plate has a first thickness that is larger than a second thickness of at least one of the one or more fins.
16 . A processing chamber, comprising:
a substrate support disposed in a processing volume of the processing chamber;
a first pre-heat ring disposed in the processing volume;
a second pre-heat ring disposed in the processing volume below the first pre-heat ring;
one or more gas inlets at least partially between the first pre-heat ring and the second pre-heat ring, the one or more gas inlets operable to flow a gas between the first pre-heat ring and the second pre-heat ring and into the processing volume of the processing chamber; and
a set of blocks supported on the second pre-heat ring and disposed between the first pre-heat ring and the second pre-heat ring.
17 . The processing chamber of claim 16 , wherein the first pre-heat ring comprises one or more openings defining one or more recessed surfaces.
18 . The processing chamber of claim 16 , wherein the set of blocks comprise extensions extending through openings formed in the first pre-heat ring.
19 . The processing chamber of claim 16 , wherein the first pre-heat ring and the second pre-heat ring are formed of silicon carbide (SiC) or graphite coated with SiC.
20 . The processing chamber of claim 16 , wherein the first pre-heat ring and the second pre-heat ring are formed of an opaque material that pre-heats the gas prior to flowing into the processing volume.