Laminate and release agent composition
The laminate of the invention has a semiconductor substrate, a support substrate, a release layer disposed so as to come into contact with the semiconductor substrate, and an adhesive layer disposed between the support substrate and the release layer, characterized in that the release layer is a film formed from a releasing agent composition containing a polyorganosiloxane component essentially containing polydimethylsiloxane; the polyorganosiloxane component has a viscosity of 5.50×10 3 Pa·s to 0.75×10 3 Pa·s, as measured at 25° C.; and the film has a thickness of 0.01 μm to 4.90 μm.
1 . A laminate comprising
a semiconductor substrate,
a support substrate,
a release layer disposed so as to come into contact with the semiconductor substrate, and
an adhesive layer disposed between the support substrate and the release layer, wherein:
the release layer is a thermoplastic film formed from a releasing agent composition containing a polyorganosiloxane component comprising polydimethylsiloxane represented by formula (X):
where n m is a positive integer and represents the number of repeating units;
the polyorganosiloxane component has a viscosity of 5.50×10 3 Pa·s to 0.75×10 3 Pa·s, as measured at 25° C.; and
the film has a thickness of 0.01 μm to 4.90 μm.
2 . The laminate according to claim 1 , wherein the viscosity of the polyorganosiloxane component is 5.00×10 3 Pa·s to 0.80×10 3 Pa·s, as measured at 25° C.
3 . The laminate according to claim 2 , wherein the viscosity of the polyorganosiloxane component is 4.52×10 3 Pa·s to 0.96×10 3 Pa·s, as measured at 25° C.
4 . The laminate according to claim 1 , wherein the thickness of the film is 0.25 μm to 3.75 μm.
5 . The laminate according to claim 4 , wherein the thickness of the film is 1.75 μm to 2.75 μm.
6 . The laminate according to claim 1 , wherein the adhesive layer is disposed so as to come into contact with the support substrate and the release layer.
7 . The laminate according to claim 1 , wherein the adhesive layer is a film formed from an adhesive composition containing an adhesive component (S) containing at least one species selected from among a polyorganosiloxane adhesive, an acrylic resin adhesive, an epoxy resin adhesive, a polyamide adhesive, a polystyrene adhesive, a polyimide adhesive, and a phenolic resin adhesive.
8 . The laminate according to claim 7 , wherein the adhesive component (S) contains a polyorganosiloxane adhesive.
9 . The laminate according to claim 8 , wherein the polyorganosiloxane adhesive contains a polyorganosiloxane component (A) which is curable through hydrosilylation.
10 . A releasing agent composition for forming a release layer included in a laminate, the laminate comprising a semiconductor substrate, a support substrate, the release layer disposed so as to come into contact with the semiconductor substrate, and an adhesive layer disposed between the support substrate and the release layer, and the release layer being a thermoplastic film having a thickness of 0.01 μm to 4.90 μm, wherein the composition contains a polyorganosiloxane component comprising polydimethylsiloxane represented by formula (X):
where n m is a positive integer and represents the number of repeating units, and the polyorganosiloxane component has a viscosity of 5.50×10 3 Pa·s to 0.75×10 3 Pa·s, as measured at 25° C.
11 . The releasing agent composition according to claim 10 , wherein the viscosity of the polyorganosiloxane component is 5.00×10 3 Pa·s to 0.80×10 3 Pa·s, as measured at 25° C.
12 . The releasing agent composition according to claim 11 , wherein the viscosity of the polyorganosiloxane component is 4.52×10 3 Pa·s to 0.96×10 3 Pa·s, as measured at 25° C.
13 . The releasing agent composition according to claim 10 , wherein the thickness of the film is 0.25 μm to 3.75 μm.
14 . The releasing agent composition according to claim 13 , wherein the thickness of the film is 1.75 μm to 2.75 μm.
15 . The releasing agent composition according to claim 10 , wherein the adhesive layer is disposed so as to come into contact with the support substrate and the release layer.
16 . The releasing agent composition according to claim 10 , wherein the adhesive layer is a film formed from an adhesive composition containing an adhesive component (S) containing at least one species selected from among a polyorganosiloxane adhesive, an acrylic resin adhesive, an epoxy resin adhesive, a polyamide adhesive, a polystyrene adhesive, a polyimide adhesive, and a phenolic resin adhesive.
17 . The releasing agent composition according to claim 16 , wherein the adhesive component (S) contains a polyorganosiloxane adhesive.
18 . The releasing agent composition according to claim 17 , wherein the polyorganosiloxane adhesive contains a polyorganosiloxane component (A) which is curable through hydrosilylation.