Managing semiconductor wafer and die handling
An apparatus for securing a semiconductor wafer portion (SWP) comprises: a first rotatable structure (RS) configured to perform a first rotation and a first counterrotation about a first axis; a second RS configured to perform a second rotation and a second counterrotation about a second axis; a first set of one or more adjustable adhesive regions (AARs) located on the first RS and in contact with the SWP, where each AAR in the first set of AARs is configured to increase its adhesion to the SWP during the first rotation and to decrease its adhesion during the first counterrotation; and a second set of one or more AARs located on the second RS and in contact with the SWP, where each AAR in the second set of AARs is configured to increase its adhesion to the SWP during the second rotation and decrease its adhesion during the second counterrotation.
1 . An apparatus for securing a semiconductor wafer portion, the apparatus comprising:
a first rotatable structure configured to perform a first rotation and a first counterrotation about a first axis;
a second rotatable structure configured to perform a second rotation and a second counterrotation about a second axis;
a first set of one or more adjustable adhesive regions located on the first rotatable structure and in contact with the semiconductor wafer portion, where each adjustable adhesive region in the first set of adjustable adhesive regions is configured to increase its adhesion to the semiconductor wafer portion during the first rotation and to decrease its adhesion to the semiconductor wafer portion during the first counterrotation; and
a second set of one or more adjustable adhesive regions located on the second rotatable structure and in contact with the semiconductor wafer portion, where each adjustable adhesive region in the second set of adjustable adhesive regions is configured to increase its adhesion to the semiconductor wafer portion during the second rotation and decrease its adhesion to the semiconductor wafer portion during the second counterrotation.
2 . The apparatus of claim 1 , where the first axis and the second axis are the same.
3 . The apparatus of claim 1 , where the first axis and the second axis are perpendicular to a flat surface of the semiconductor wafer portion.
4 . The apparatus of claim 1 , where the first set of adjustable adhesive regions and the second set of adjustable adhesive regions are arranged in a single plane.
5 . The apparatus of claim 1 , where the first set of adjustable adhesive regions are configured to collectively apply a first torque to the semiconductor wafer portion, and the second set of adjustable adhesive regions are configured to collectively apply a second torque that is substantially equal and opposite to the first torque.
6 . The apparatus of claim 1 , where
the first set of adjustable adhesive regions are arranged in a first circle characterized by a first radius; and
the second set of adjustable adhesive regions are arranged in a second circle that is concentric with the first circle and that is characterized by a second radius different from the first radius.
7 . The apparatus of claim 6 , where
the first set of adjustable adhesive regions have a first total area that is equal to a sum of each area of the one or more adjustable adhesive regions in the first set of adjustable adhesive regions;
the second set of adjustable adhesive regions have a second total area that is equal to a sum of each area of the one or more adjustable adhesive regions in the second set of adjustable adhesive regions; and
a first ratio of (1) the first total area and (2) the second total area is substantially equal to a second ratio of (1) the second radius and (2) the first radius.
8 . The apparatus of claim 1 , where
the first set of adjustable adhesive regions have a third total area that is equal to a sum of each area of the one or more adjustable adhesive regions in the first set of adjustable adhesive regions;
the second set of adjustable adhesive regions have a fourth total area that is equal to a sum of each area of the one or more adjustable adhesive regions in the second set of adjustable adhesive regions; and
the third total area and the fourth total area are determined based at least in part on respective locations of each adjustable adhesive region in the first set of adjustable adhesive regions and each adjustable adhesive region in the second set of adjustable adhesive regions.
9 . The apparatus of claim 1 , further comprising a rotation control element configured to apply a first force to the first rotatable structure and a second force to the second rotatable structure.
10 . The apparatus of claim 9 , where the rotation control element is configured to apply the first force to the first rotatable structure and the second force to the second rotatable structure by spatially translating the rotation control element along one dimension.
11 . The apparatus of claim 1 , further comprising
a third rotatable structure configured to perform a third rotation and a third counterrotation about a third axis;
a fourth rotatable structure configured to perform a fourth rotation and a fourth counterrotation about a fourth axis;
a third set of one or more adjustable adhesive regions located on the third rotatable structure and in contact with the semiconductor wafer portion, where each adjustable adhesive region in the third set of one or more adjustable adhesive regions is configured to increase its adhesion to the semiconductor wafer portion during the third rotation and to decrease its adhesion to the semiconductor wafer portion during the third counterrotation; and
a fourth set of one or more adjustable adhesive regions located on the fourth rotatable structure and in contact with the semiconductor wafer portion, where each adjustable adhesive region in the fourth set of one or more adjustable adhesive regions is configured to increase its adhesion to the semiconductor wafer portion during the fourth rotation and to decrease its adhesion to the semiconductor wafer portion during the fourth counterrotation.